US5227661A
Expired / Lapsed
US
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Integrated circuit device having an aminopropyltriethoxysilane coating
Assignee: Texas Instruments Inc
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Filing: 1990-09-24
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Granted: 1993-07-13
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Expires: 2010-09-24
Abstract
Abstract A lead over chip packaged device that is less prone to package cracking during surface mounting is disclosed. The lead over chip lead frame overlies the active face of a semiconductor circuit. The backside of the semiconductor circuit is covered with an aminopropyltriethoxysilane coating. The aminopropyltriethoxysilane coating promotes adhesion between the backside of the semiconductor circuit and the mold compound used to encapsulate the device. This reduces package cracking resulting from delamination between the inactive face of the chip and the mold compound during reflow solder.
Inventors
- 👤 Katherine G. Heinen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 21:21
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W72/00; H10W72/90; H10W74/00; H10W74/10; H10W74/111; H10W74/127; H10W74/40; H10W74/47; H10W74/476; H10W72/071; H10W72/073; H10W72/07351; H10W72/07352; H10W72/075; H10W72/30; H10W72/321; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/851; H10W72/853; H10W72/865; H10W72/931; H10W72/932; H10W72/941; H10W72/944; H10W72/9445; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/731; H10W90/732; H10W90/736; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
52 words
A semiconductor integrated circuit chip adapted for mounting to a lead over chip lead frame, comprising: an integrated circuit chip having an active face and an inactive backside, the active face attached to a lead over chip lead frame; and an aminopropyltriethoxysilane coating on the inactive backside of the integrated circuit chip.
Claim 2
Dependent Claim
52 words
A semiconductor integrated circuit chip adapted for mounting to a lead over chip lead frame, comprising: an integrated circuit chip having an active face and an inactive backside, the active face attached to a lead over chip lead frame; and an aminopropyltriethoxysilane coating on the inactive backside of the integrated circuit chip.
Claim 3
Dependent Claim
18 words
The semiconductor integrated circuit chip of claim 1 wherein the aminopropyltriethoxysilane coating is less than 1 micron thick.
Claim 4
Dependent Claim
82 words
An semiconductor packaged device, comprising: a semiconductor circuit chip having an active face and a backside; a lead frame to support the semiconductor chip and to provide external connection thereto, the lead frame having lead fingers connected by one end to the semiconductor chip; an encapsulant, encapsulating the semiconductor chip and the lead frame, other ends of the lead fingers extending through the encapsulant; and wherein the semiconductor chip has an aminopropyltriethoxysilane layer on its backside to promote adhesion to the encapsulant.
Claim 5
Dependent Claim
82 words
An semiconductor packaged device, comprising: a semiconductor circuit chip having an active face and a backside; a lead frame to support the semiconductor chip and to provide external connection thereto, the lead frame having lead fingers connected by one end to the semiconductor chip; an encapsulant, encapsulating the semiconductor chip and the lead frame, other ends of the lead fingers extending through the encapsulant; and wherein the semiconductor chip has an aminopropyltriethoxysilane layer on its backside to promote adhesion to the encapsulant.
Claim 6
Dependent Claim
17 words
The semiconductor packaged device of claim 3 wherein the aminopropyltriethoxysilane layer is up to 1 micron thick.
Claim 7
Dependent Claim
12 words
The integrated packaged device of claim 4 wherein the encapsulant is plastic.
Claim 8
Dependent Claim
18 words
The integrated packaged device of claim 5 wherein the lead frame is a lead over chip lead frame.
Claim 9
Dependent Claim
15 words
The integrated packaged device of claim 5 wherein the lead frame is a tabpak tape.
Claim 10
Dependent Claim
17 words
The integrated packaged device of claim 5 wherein the lead frame is a flip chip lead frame.
References Cited (Backward Citations)
US4395527A
Cited
US4480009A
Cited
US4499149A
Cited
US4477828A
Cited
US4862245A
Cited
US4916519A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-07-12 | 1997-01-11 | 1997-07-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-07-12 | 2001-01-11 | 2001-07-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-07-12 | 2005-01-11 | 2005-07-13 | $7700.00 | Window Closed / Lapsed |