US5313102A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit device having a polyimide moisture barrier coating
Assignee: Texas Instruments Inc
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Filing: 1989-12-22
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Granted: 1994-05-17
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Expires: 2009-12-22
Abstract
Abstract A semiconductor package device is disclosed. In one embodiment, attached by its active face to a lead-on-chip leadframe having leadfingers is an integrated circuit. The integrated circuit has a polyimide coating on its backside. An encapsulating material surrounds the integrated circuit and the lead-on-chip leadframe so that the leadfingers are exposed. The polyimide coating on the backside of the integrated circuit helps to reduce package cracking arising from mounting the device to a printed circuit board by relflow solder.
Inventors
- 👤 Thiam B. Lim
- 👤 Tadashi Saitoh
- 👤 Boon Q. Seow
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 11:37
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/421; H10W70/424; H10W70/427; H10W70/429; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W72/00; H10W72/071; H10W72/073; H10W72/075; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/851; H10W72/853; H10W72/865; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
69 words
A semiconductor integrated circuit adapted for mounting to a leadframe comprising: an integrated circuit having an active face and a backside, the active face attached to a leadframe; a plastic encapsulant, encapsulating the integrated circuit; and a polyimide coating on the backside of the integrated circuit between the backside and the encapsulant providing a moisture barrier and to prevent cracking of the encapsulant during mounting to a circuit board.
Claim 2
Dependent Claim
69 words
A semiconductor integrated circuit adapted for mounting to a leadframe comprising: an integrated circuit having an active face and a backside, the active face attached to a leadframe; a plastic encapsulant, encapsulating the integrated circuit; and a polyimide coating on the backside of the integrated circuit between the backside and the encapsulant providing a moisture barrier and to prevent cracking of the encapsulant during mounting to a circuit board.
Claim 3
Dependent Claim
18 words
The semiconductor integrated circuit of claim 1 wherein the polyimide coating ranges from about 6 to 75 microns.
Claim 4
Dependent Claim
70 words
A semiconductor integrated circuit adapted for mounting to a chip-on-leadframe comprising: a plastic encapsulant, encapsulating the integrated circuit; and an integrated circuit having an active face and a backside, the active face attached to a chip-on-leadframe; and a polyimide coating on the backside of the integrated circuit between the backside and the encapsulant providing a moisture barrier and to prevent cracking of the encapsulant during mounting to a circuit board.
Claim 5
Dependent Claim
70 words
A semiconductor integrated circuit adapted for mounting to a chip-on-leadframe comprising: a plastic encapsulant, encapsulating the integrated circuit; and an integrated circuit having an active face and a backside, the active face attached to a chip-on-leadframe; and a polyimide coating on the backside of the integrated circuit between the backside and the encapsulant providing a moisture barrier and to prevent cracking of the encapsulant during mounting to a circuit board.
Claim 6
Dependent Claim
18 words
The semiconductor integrated circuit of claim 3 wherein the polyimide coating ranges from about 6 to 75 microns.
Claim 7
Dependent Claim
72 words
A semiconductor integrated circuit adapted for mounting to a tabpak tape comprising: a plastic encapsulant, encapsulating the integrated circuit; and an integrated circuit having an active face and a backside, the active face attached to the tabpak tape; and a polyimide coating on the backside of the integrated circuit between the backside and the encapsulant providing a moisture barrier and to prevent cracking of the encapsulant during mounting to a circuit board.
Claim 8
Dependent Claim
72 words
A semiconductor integrated circuit adapted for mounting to a tabpak tape comprising: a plastic encapsulant, encapsulating the integrated circuit; and an integrated circuit having an active face and a backside, the active face attached to the tabpak tape; and a polyimide coating on the backside of the integrated circuit between the backside and the encapsulant providing a moisture barrier and to prevent cracking of the encapsulant during mounting to a circuit board.
Claim 9
Dependent Claim
18 words
The semiconductor integrated circuit of claim 5 wherein the polyimide coating ranges from about 6 to 75 microns.
Claim 10
Dependent Claim
69 words
A semiconductor packaged device comprising: a lead-on chip leadframe having leadfingers; an integrated circuit having an active face and a backside, the active face attached to the lead-on-chip leadframe; a polyimide coating on the backside of the integrated circuit; and an encapsulating material encapsulating the integrated circuit, part of the leadfingers, and making intimate contact with and adhering to the polyimide coating on the backside of the integrated circuit.
Claim 11
Dependent Claim
69 words
A semiconductor packaged device comprising: a lead-on chip leadframe having leadfingers; an integrated circuit having an active face and a backside, the active face attached to the lead-on-chip leadframe; a polyimide coating on the backside of the integrated circuit; and an encapsulating material encapsulating the integrated circuit, part of the leadfingers, and making intimate contact with and adhering to the polyimide coating on the backside of the integrated circuit.
Claim 12
Dependent Claim
25 words
The semiconductor package device of claim 7 further comprising: encapsulating material surrounding the integrated circuit and the lead-on-chip leadframe so that the leadfingers are exposed.
Claim 13
Dependent Claim
13 words
The semiconductor package device of claim 8 wherein the encapsulating material is plastic.
Claim 14
Dependent Claim
18 words
The semiconductor package device of claim 9 wherein the polyimide coating ranges from about 6 to 75 microns.
Claim 15
Dependent Claim
70 words
A semiconductor package device comprising: a chip-on-lead leadframe having leadfingers; an integrated circuit having an active face and a backside, the active face attached to the chip-on-lead leadframe; and a plastic encapsulant, encapsulating the integrated circuit; and a polyimide coating on the backside of the integrated circuit between the backside and the encapsulant providing a moisture barrier and to prevent cracking of the encapsulant during mounting to a circuit board.
Claim 16
Dependent Claim
70 words
A semiconductor package device comprising: a chip-on-lead leadframe having leadfingers; an integrated circuit having an active face and a backside, the active face attached to the chip-on-lead leadframe; and a plastic encapsulant, encapsulating the integrated circuit; and a polyimide coating on the backside of the integrated circuit between the backside and the encapsulant providing a moisture barrier and to prevent cracking of the encapsulant during mounting to a circuit board.
Claim 17
Dependent Claim
26 words
The semiconductor package device of claim 11, further comprising: an encapsulating material surrounding the integrated circuit and the chip-on-lead leadframe so that the leadfingers are exposed.
Claim 18
Dependent Claim
13 words
The semiconductor package device of claim 12 wherein the encapsulating material is plastic.
Claim 19
Dependent Claim
18 words
The semiconductor package device of claim 13 wherein the polyimide coating ranges from about 6 to 75 microns.
Claim 20
Dependent Claim
77 words
A semiconductor package device comprising: a tabpak tap having lead fingers; an integrated circuit having an active face and a backside, the active face attached to the tabpak tape so that the leadfingers are exposed; and a plastic encapsulant, encapsulating the integrated circuit; and a polyimide coating on the backside of the integrated circuit between the backside and the encapsulant providing a moisture barrier and to prevent cracking of the encapsulant during mounting to a circuit board.
Claim 21
Dependent Claim
77 words
A semiconductor package device comprising: a tabpak tap having lead fingers; an integrated circuit having an active face and a backside, the active face attached to the tabpak tape so that the leadfingers are exposed; and a plastic encapsulant, encapsulating the integrated circuit; and a polyimide coating on the backside of the integrated circuit between the backside and the encapsulant providing a moisture barrier and to prevent cracking of the encapsulant during mounting to a circuit board.
Claim 22
Dependent Claim
26 words
The semiconductor package device of claim 15 further comprising: an encapsulating material surrounding the integrated circuit and the tabpak tape so that the leadfingers are exposed.
Claim 23
Dependent Claim
18 words
The semiconductor package device of claim 16 wherein the polyimide coating ranges from about 6 to 75 microns.
Claim 24
Dependent Claim
70 words
A semiconductor package device comprising: a flip-chip leadframe having leadfingers; an integrated circuit having an active face and a backside, the active face attached to the flip-chip leadframe; and a plastic encapsulant, encapsulating the integrated circuit; and a polyimide coating on the backside of the integrated circuit between the backside and the encapsulant providing a moisture barrier and to prevent cracking of the encapsulant during mounting to a circuit board.
Claim 25
Dependent Claim
70 words
A semiconductor package device comprising: a flip-chip leadframe having leadfingers; an integrated circuit having an active face and a backside, the active face attached to the flip-chip leadframe; and a plastic encapsulant, encapsulating the integrated circuit; and a polyimide coating on the backside of the integrated circuit between the backside and the encapsulant providing a moisture barrier and to prevent cracking of the encapsulant during mounting to a circuit board.
Claim 26
Dependent Claim
26 words
The semiconductor package device of claim 18 further comprising: an encapsulating material surrounding the integrated circuit and the flip-chip leadframe so that the leadfingers are exposed.
Claim 27
Dependent Claim
13 words
The semiconductor package device of claim 19 wherein the encapsulating material is plastic.
Claim 28
Dependent Claim
18 words
The semiconductor package device of claim 20 wherein the polyimide coating ranges from about 6 to 75 microns.
References Cited (Backward Citations)
US2809332A
Cited
US3568012A
Cited
US4300153A
Cited
US4535350A
Cited
US4621279A
Cited
US4862245A
Cited
US4826297A
Cited
JPS62179554A
Cited
US4974057A
Cited
US4891687A
Cited
US5012322A
Cited
US4916516A
Cited
US4937656A
Cited
US4933741A
Cited
US4916519A
Cited
US4965654A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-05-16 | 1997-11-15 | 1998-05-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-05-16 | 2001-11-15 | 2002-05-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-05-16 | 2005-11-15 | 2006-05-17 | $7700.00 | Window Closed / Lapsed |