US4621279A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Non-evacuated, rapidly coolable housing for an opto-electronic semiconductor component
Assignee: Telefunken Electronic GmbH
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Filing: 1984-10-12
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Granted: 1986-11-04
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Expires: 2004-10-12
Abstract
Abstract The invention relates to a housing for opto-electronic components, with the semiconductor component being cooled by a cooler which operates in accordance with the Joule-Thomson effect and is in communication with the housing. The gist of the invention is that the non-evacuation housing comprises several sections, with the first section of the housing which is in direct communication with the cooler having a low thermal conductivity and a low thermal capacity, whereas the end section of the housing containing a radiation transmitting window has a high thermal conductivity and a high thermal capacity.
Inventors
- 👤 Horst Maier
- 👤 Gottfried Pahler
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 10:56
CPC Classifications
H; H10; H10F; H10F77/00; H10F77/50; F; F25; F25D; F25D19/00; F25D19/006; H10F77/60; Y; Y10; Y10S; Y10S505/00; Y10S505/825; Y10S505/873; Y10S505/875
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
122 words
Housing for an opto-electronic semiconductor component operable at low temperatures, with the housing being in communication with a cooler operating in accordance with the Joule-Thompson effect, wherein the housing in non-evacuated and filled with gas, and the housing comprises a first housing section (2) which is in direct communication with the cooler (1) and which has a low thermal conductivity and capacity, a housing end section (3) containing a radiation transmitting window (4), said housing end section having a high thermal conductivity and capacity, and a third housing section between said first housing section and said housing end section and tightly connected thereto, and electric leads for the semiconductor component being conducted between said first housing section and said third housing section.
Claim 2
Dependent Claim
122 words
Housing for an opto-electronic semiconductor component operable at low temperatures, with the housing being in communication with a cooler operating in accordance with the Joule-Thompson effect, wherein the housing in non-evacuated and filled with gas, and the housing comprises a first housing section (2) which is in direct communication with the cooler (1) and which has a low thermal conductivity and capacity, a housing end section (3) containing a radiation transmitting window (4), said housing end section having a high thermal conductivity and capacity, and a third housing section between said first housing section and said housing end section and tightly connected thereto, and electric leads for the semiconductor component being conducted between said first housing section and said third housing section.
Claim 3
Dependent Claim
14 words
Housing according to claim 1 in combination with an infrared radiation sensitive semiconductor component.
Claim 4
Dependent Claim
57 words
Housing according to claim 1, wherein the cooler comprises a cooling agent, the housing sections (2, 3, 5) are connected to a bottom plate (8) which simultaneously presses the cooler (1) against the first housing section (2) with a defined bearing pressure, and this bottom plate contains inlet and outlet openings (9, 10) for the cooling agent.
Claim 5
Dependent Claim
45 words
Housing according to claim 1, wherein the semiconductor component (7) is arranged on a plate (11) of high thermal conductivity held by the first housing section (2) and cooled by the cooler (1) and located opposite the window (4) in the housing end section (3).
Claim 6
Dependent Claim
15 words
Housing according to claim 1, characterized in that it is filled with air or gas.
Claim 7
Dependent Claim
86 words
Housing according to claim 1, wherein the semiconductor component is mounted in a carrier plate, the cooler comprises a cooling agent and a gas outlet opening for the cooling agent, and the cooler (1) is of conical or cylindrical design and fits into a correspondingly designed recess (12) in a thin-walled area (13) in the first housing section (2) in such a way that the gas outlet opening (14) for the cooling agent is arranged immediately underneath the carrier plate (11) for the semiconductor component (7).
Claim 8
Dependent Claim
23 words
Housing according to claim 6, wherein the thin-walled area (13) of the first housing section (2) is reinforced by stabilizing ribs or webs.
Claim 9
Dependent Claim
23 words
Housing according to claim 1, wherein the first and the third housing sections (2, 5) consist of a plastics material such as polyimide.
Claim 10
Dependent Claim
19 words
Housing according to claim 8, wherein the housing plastics material contains a filler such as glass fibers or teflon.
Claim 11
Dependent Claim
34 words
Housing according to claim 4, wherein the carrier plate (11) of the semiconductor component (7) and the housing end section (3) consist of a material which has a high thermal conducivity such as copper.
Claim 12
Dependent Claim
32 words
Housing according to claim 4, wherein the carrier plate (11) for the semiconductor component (7) consists of a material of high thermal conductivity and low thermal capacity such as sapphire or molybdenum.
Claim 13
Dependent Claim
25 words
Housing according to claim 6, wherein the housing sections (2, 3, 5) are tightly connected to one another by rubber rings or indium rings (15-17).
Claim 14
Dependent Claim
38 words
Housing according to claim 1, wherein the electric leads for the semiconductor component (7) comprise narrow, radially arranged, conductive foils (6), and these leads are conducted out between two housing sections (2, 5) in an electrically insulated manner.
Claim 15
Dependent Claim
31 words
Housing according to claim 13, comprising conductive sealing rings between the first and third housing sections, and wherein the conductive foils are insulated on both sides from the conductive sealing rings.
Claim 16
Dependent Claim
26 words
Housing according to claim 6, wherein the recess (12) in the first housing section (2) for accomodation of the cooler has an aperture angle between 0<α≦90°.
Claim 17
Dependent Claim
25 words
Housing according to claim 3, wherein the bottom plate (8) presses the cooler (1) against the first housing section (2) by means of springs (18).
Claim 18
Dependent Claim
62 words
Housing according to claim 3, wherein a pipe coil (19) for the cooling gas is arranged on the cone of the cooler, and this pipe coil is pressed against the outside wall of the first housing section (2) in such a way that the returning gas flows in a likewise spiral-shaped path to the gas outlet (10) in the bottom plate (8).
Claim 19
Dependent Claim
32 words
Housing according to claim 17, characterized in that a superinsulation is arranged between the pipe coil (19) and the first housing section (2) and consists of a thin single- or multi-layered coil.
Claim 20
Dependent Claim
16 words
Housing according to claim 1, wherein all of the housing sections are screwed to one another.
Claim 21
Dependent Claim
39 words
Housing according to claim 1, wherein the multi-sectioned housing is built into a further hermetically sealed housing (23) of stainless steel containing above the first radiation transmitting window in the housing end section a further radiation transmitting window (24).
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1989-11-03 | 1990-05-05 | 1990-11-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1993-11-03 | 1994-05-05 | 1994-11-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1997-11-03 | 1998-05-05 | 1998-11-04 | $7700.00 | Window Closed / Lapsed |