US5012322A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor die and mounting assembly
Assignee: Allegro Microsystems LLC
•
Filing: 1987-05-18
•
Granted: 1991-04-30
•
Expires: 2007-05-18
Abstract
Abstract A uniformly thick dielectric polyimide coating is provided on the back face of an integrated circuit and the die is mounted to a copper lead frame finger by interposing an epoxy resin bonding agent between the uniformly thick polyimide coating and the copper support finger. The die coating is provided before separating die from the precursive water. Liquid polyimide is poured onto the back side of the water which is spun, in a manner similar to that usually used for obtaining uniformly thick photoresist films. After curing the polyimide, the die are cut from the wafer by sawing.
Inventors
- 👤 Paul A. Guillotte
- 👤 Paul Panaccione
- 👤 Thomas J. Martiska
- 👤 Jay J. Gagnon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 07:09
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/073; H10W72/30; H10W72/07331; H10W72/07337; H10W72/07338; H10W72/351; H10W72/353; H10W72/354; H10W90/00; H10W90/701; H10W90/731; H10W90/736
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
62 words
A semiconductor die and mounting assembly comprising: (a) a semiconductor die having an electronic device formed in one major face thereof; (b) at least one uniform cured-liquid dielectric-resin coating self adhered directly to the other major face of said die; (c) a solid mounting support; and (d) a bonding agent disposed directly between said at least one dielectric coating and said support.
Claim 2
Dependent Claim
62 words
A semiconductor die and mounting assembly comprising: (a) a semiconductor die having an electronic device formed in one major face thereof; (b) at least one uniform cured-liquid dielectric-resin coating self adhered directly to the other major face of said die; (c) a solid mounting support; and (d) a bonding agent disposed directly between said at least one dielectric coating and said support.
Claim 3
Dependent Claim
12 words
The assembly of claim 1 wherein said mounting support is electrically conductive.
Claim 4
Dependent Claim
13 words
The assembly of claim 1 wherein said solid mounting support is a metal.
Claim 5
Dependent Claim
12 words
The assembly of claim 1 wherein said dielectric resin coating is polyimide.
Claim 6
Dependent Claim
19 words
The assembly of claim 1 wherein said bonding agent is selected from an epoxy resin and a polyimide resin.
Claim 7
Dependent Claim
12 words
The assembly of claim 1 wherein said bonding agent is electrically conductive.
References Cited (Backward Citations)
US3568012A
Cited
US3691628A
Cited
US4136352A
Cited
US4278990A
Cited
US4268848A
Cited
US4330790A
Cited
US4450471A
Cited
JPS5769765A
Cited
US4510519A
Cited
US4667214A
Cited
JPS6199359A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-04-29 | 1994-10-29 | 1995-04-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-04-29 | 1998-10-29 | 1999-04-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-04-29 | 2002-10-29 | 2003-04-30 | $7700.00 | Window Closed / Lapsed |