Sealed body of semiconductor device

Abstract

Abstract PURPOSE:To enhance heat radiability and to miniaturize a semiconductor device by a method wherein the semiconductor chip and a flexible film being formed with conductors for wiring are joined on a substrate having favorable thermal conductivity, and after wire bonding of the chip and the conductors for wiring is performed, the device is sealed with resin. CONSTITUTION:The semiconductor device 9 is joined on the substrate 8 consisting of a copper plate having favorable thermal radiability, while the conductors 12 for wiring are formed on the surface of the polyimide film 11, a part 13 to insert the semiconductor device 9 therein is dug in the film 11, and the film is adhered on the surface of the substrate 8 with an adhesive 14 as the semiconductor device 9 is to be placed at the center of the part thereof. Bonding pads on the semiconductor device and the conductors 12 for wiring are connected by wire bonding of gold wires 15, the epoxy resin 16 is covered thereon as to cover the semiconductor device 9 and the gold wires 15, and the outside circumferential parts of the film 11 formed with conductor wiring are made to protrude from the substrate 8. Accordingly radiation of heat from the copper substrate is favorable, the device can be formed thinly and can be miniaturized, and is suitable for mass production.

Inventors

• 👤 Kenji Higashiyama
• 👤 Hisashi Nakamura

Bibliographic Details