Hybrid integrated circuit device

Abstract

Abstract PURPOSE:To suppress the manufacturing costs and to obtain a high reliable device, by attaching a heat radiation supporting plate to a heat radiating plate by a Pb-Sn solder, which is the same material as that of a dielectric substrate. CONSTITUTION:The thermal expansion coefficient of a heat radiation supporting plate 9 comprising copper and the like is about the same as that of a heat radiating plate 1. A dielectric supporting substrate 2 comprising BeO and the like is bonded on the heat radiation supporting plate 9 by an Ag solder material 3. A semiconductor element 4 is attached to the substrate 2 by a solder and the like. Wire bonding is performed by a thin metal wire 5. Thereafter, the heat radiation supporting plate 9 is attached to the heat radiating plate 1 on an alumina substrate by a Pb-Sn solder 8 together with a dielectric substrate 7 at a low output part. Therefore, even if the increase and decrease in temperature are repeated, thermal strain is not yielded at the part of the Pb-Sn solder 8. A fracture phenomenon due to solder fatigue does not occur. Thus the costs can be reduced.

Inventors

• 👤 Masahide Yamauchi
• 👤 山内　眞英

Bibliographic Details