US3686539A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Gallium arsenide semiconductor device with improved ohmic electrode
Assignee: RCA Corp
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Filing: 1970-05-04
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Granted: 1972-08-22
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Expires: 1990-05-04
Abstract
Abstract A semiconductor device comprising of semiconducting body of gallium arsenide bonded to an ohmic electrode. The ohmic electrode comprises a tantalum body with a layer of palladium united to it, and with a layer of bonding material united to the palladium and joining the electrode to the semiconductor. The electrode may also be bonded to other semiconductors having a similar coefficient of expansion.
Inventors
- 👤 Stanley Schwartzman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 23:15
CPC Classifications
H; H10; H10D; H10D62/00; H10D62/80; H10D62/85; H10D64/00; H10D64/60; H10D64/62; H10W; H10W99/00; Y; Y10; Y10S; Y10S148/00; Y10S148/02
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
14 words
A semiconductor device as in claim 1, wherein said semiconducting body is gallium arsenide.
Claim 2
Dependent Claim
13 words
A semiconductor device as in claim 1, wherein said bonding layer contains silver.
Claim 3
Dependent Claim
36 words
A semiconductor device as in claim 1, and further including a second layer of palladium united directly to said semiconductor body, and said bonding layer is disposed between and joins both of said palladium layers together.
Claim 4
Dependent Claim
66 words
A mounted semiconductor device comprising: a metallic base plate; a tantalum body bonded to said base plate; a layer of palladium united to said tantalum body; a layer of a gold free bonding material united to said layer of palladium; and a semiconducting body of gallium arsenide, or other semiconductor having a similaR coefficient of expansion to that of gallium arsenide, united to said bonding layer.
Claim 5
Dependent Claim
14 words
A mounted semiconductor device as in claim 5, wherein said bonding layer contains silver.
Claim 6
Dependent Claim
36 words
A mounted semiconductor device as in claim 5, wherein said semiconducting body has a second layer of palladium united directly to it, with said bonding layer disposed between and joining both of said palladium layers together.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-08-22 | 1976-02-21 | 1976-08-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-08-22 | 1980-02-21 | 1980-08-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-08-22 | 1984-02-21 | 1984-08-22 | $7700.00 | Window Closed / Lapsed |