US6424050B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Seiko Epson Corp
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Filing: 2000-09-20
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Granted: 2002-07-23
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Expires: 2020-09-20
Abstract
Abstract An IC chip 1 is a flip chip type, which defines a main surface as a mounting surface that is externally exposed and is provided with external terminals 15 on pads 14 . An IC chip 2 within a sealant member 6 is stacked on a rear surface of the IC chip 1 through an insulation adhesive member 3 . A wiring substrate 4 for the IC chip 2 is provided around the IC chip 1 . The wiring substrate 4 includes a base substrate 41 and an insulation film 43 having a conductive pattern 42 provided thereon. Specified portions of the conductive pattern 42 are connected respectively to pads 21 on the IC chip 2 by, for example, bonding wires 5 . External terminals 45 for the IC chip 2 connect to a plurality of vias 44 in the wiring substrate 4 . The above structure provides a semiconductor device that can achieve a thinner package while maintaining the reliability of each of the stacked IC chips at a high level.
Inventors
- 👤 Tadashi Komiyama
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:46
CPC Classifications
H; H10; H10W; H10W90/00; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W90/701; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/853; H10W72/856; H10W72/874; H10W72/884; H10W72/90; H10W72/941; H10W72/9415; H10W72/944; H10W72/9445; H10W90/20; H10W90/22; H10W90/291; H10W90/721; H10W90/724; H10W90/731; H10W90/732; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
115 words
A semiconductor device comprising: a first IC chip having a main surface as a mounting surface on which electrode pads are provided, the main surface being externally exposed and provided with external terminals connected electrically to the electrode pads; a second IC chip that is stacked through an insulation member on a rear surface of the first IC chip opposite to the main surface thereof; a wiring substrate for the second IC chip provided around the first IC chip; external terminals for the second IC chip provided at least on a mounting surface of the wiring substrate; and a sealant member that seals electrical connection components between the second IC chip; and the wiring substrate.
Claim 2
Dependent Claim
115 words
A semiconductor device comprising: a first IC chip having a main surface as a mounting surface on which electrode pads are provided, the main surface being externally exposed and provided with external terminals connected electrically to the electrode pads; a second IC chip that is stacked through an insulation member on a rear surface of the first IC chip opposite to the main surface thereof; a wiring substrate for the second IC chip provided around the first IC chip; external terminals for the second IC chip provided at least on a mounting surface of the wiring substrate; and a sealant member that seals electrical connection components between the second IC chip; and the wiring substrate.
Claim 3
Dependent Claim
15 words
A semiconductor device according to claim 1 , wherein the insulation member includes an adhesive.
Claim 4
Dependent Claim
139 words
A semiconductor device, comprising: a first IC chip having a main surface as a mounting surface on which electrode pads are provided, the main surface being externally exposed and provided with external terminals; a second IC chip that is stacked through an insulation member on a rear surface of the first IC chip opposite to the main surface thereof; a wiring substrate for the second IC chip provided around the first IC chip, wherein the insulation member includes a conductive film-like pattern at a specified region of the wiring substrate that serves as an electrical connection between the second IC chip and the wiring substrate; external terminals for the second IC chip provided on a mounting surface of the wiring substrate; and a sealant member that seals electrical connection components between the second IC chip and the wiring substrate.
Claim 5
Dependent Claim
139 words
A semiconductor device, comprising: a first IC chip having a main surface as a mounting surface on which electrode pads are provided, the main surface being externally exposed and provided with external terminals; a second IC chip that is stacked through an insulation member on a rear surface of the first IC chip opposite to the main surface thereof; a wiring substrate for the second IC chip provided around the first IC chip, wherein the insulation member includes a conductive film-like pattern at a specified region of the wiring substrate that serves as an electrical connection between the second IC chip and the wiring substrate; external terminals for the second IC chip provided on a mounting surface of the wiring substrate; and a sealant member that seals electrical connection components between the second IC chip and the wiring substrate.
Claim 6
Dependent Claim
156 words
A semiconductor device, comprising: a first IC chip having a main surface as a mounting surface on which electrode pads are provided, the main surface being externally exposed and provided with external terminals; a second IC chip that is stacked through an insulation member on a rear surface of the first IC chip opposite to the main surface thereof; a wiring substrate for the second IC chip provided around the first IC chip, wherein the insulation member includes a conductive film-like pattern at a specified region of the wiring substrate that serves as an electrical connection between the second IC chip and the wiring substrate, and extends at least in a peripheral region about a rear surface of the first IC chip; external terminals for the second IC chip provided on a mounting surface of the wiring substrate; and a sealant member that seals electrical connection components between the second IC chip and the wiring substrate.
Claim 7
Dependent Claim
156 words
A semiconductor device, comprising: a first IC chip having a main surface as a mounting surface on which electrode pads are provided, the main surface being externally exposed and provided with external terminals; a second IC chip that is stacked through an insulation member on a rear surface of the first IC chip opposite to the main surface thereof; a wiring substrate for the second IC chip provided around the first IC chip, wherein the insulation member includes a conductive film-like pattern at a specified region of the wiring substrate that serves as an electrical connection between the second IC chip and the wiring substrate, and extends at least in a peripheral region about a rear surface of the first IC chip; external terminals for the second IC chip provided on a mounting surface of the wiring substrate; and a sealant member that seals electrical connection components between the second IC chip and the wiring substrate.
Claim 8
Dependent Claim
107 words
A semiconductor device comprising: a first IC chip having a main surface as a mounting surface on which electrode pads are provided, the main surface being externally exposed and provided with external terminals connected electrically to the electrode pads; a second IC chip that is stacked through an insulation member on a rear surface of the first IC chip opposite to the main surface thereof; a wiring substrate provided around the first IC chip and having an electrical connection component to be connected to the second IC chip; and external terminals for the second IC chip provided at least on a mounting surface of the wiring substrate.
Claim 9
Dependent Claim
107 words
A semiconductor device comprising: a first IC chip having a main surface as a mounting surface on which electrode pads are provided, the main surface being externally exposed and provided with external terminals connected electrically to the electrode pads; a second IC chip that is stacked through an insulation member on a rear surface of the first IC chip opposite to the main surface thereof; a wiring substrate provided around the first IC chip and having an electrical connection component to be connected to the second IC chip; and external terminals for the second IC chip provided at least on a mounting surface of the wiring substrate.
Claim 10
Dependent Claim
29 words
A semiconductor device according to claim 5 , wherein at least the electrical connection component to be connected to the second IC chip is covered by a protective member.
Claim 11
Dependent Claim
40 words
A semiconductor device according to claim 1 , wherein the insulation member includes a conductive film-like pattern at a specified region of the wiring substrate that serves as an electrical connection between the second IC chip and the wiring substrate.
Claim 12
Dependent Claim
40 words
A semiconductor device according to claim 4 , wherein the insulation member includes a conductive film-like pattern at a specified region of the wiring substrate that serves as an electrical connection between the second IC chip and the wiring substrate.
Claim 13
Dependent Claim
40 words
A semiconductor device according to claim 5 , wherein the insulation member includes a conductive film-like pattern at a specified region of the wiring substrate that serves as an electrical connection between the second IC chip and the wiring substrate.
Claim 14
Dependent Claim
57 words
A semiconductor device according to claim 1 , wherein the insulation member includes a conductive film-like pattern at a specified region of the wiring substrate that serves as an electrical connection between the second IC chip and the wiring substrate, and extends at least in a peripheral region about a rear surface of the first IC chip.
Claim 15
Dependent Claim
57 words
A semiconductor device according to claim 3 , wherein the insulation member includes a conductive film-like pattern at a specified region of the wiring substrate that serves as an electrical connection between the second IC chip and the wiring substrate, and extends at least in a peripheral region about a rear surface of the first IC chip.
Claim 16
Dependent Claim
57 words
A semiconductor device according to claim 5 , wherein the insulation member includes a conductive film-like pattern at a specified region of the wiring substrate that serves as an electrical connection between the second IC chip and the wiring substrate, and extends at least in a peripheral region about a rear surface of the first IC chip.
Claim 17
Dependent Claim
15 words
A semiconductor device according to claim 3 , wherein the insulation member includes an adhesive.
Claim 18
Dependent Claim
15 words
A semiconductor device according to claim 4 , wherein the insulation member includes an adhesive.
Claim 19
Dependent Claim
20 words
A semiconductor device according to claim 3 , wherein the conductive film-like pattern contains conductive particles dispersed in epoxy resin.
Claim 20
Dependent Claim
21 words
A semiconductor device according to claim 4 , wherein the conductive film-like pattern contains conductive e particles dispersed in epoxy resin.
Claim 21
Dependent Claim
16 words
A semiconductor device according to claim 1 , wherein the wiring substrate includes aplurality of vias.
Claim 22
Dependent Claim
17 words
A semiconductor device according to claim 3 , wherein the wiring substrate includes a plurality of vias.
Claim 23
Dependent Claim
16 words
A semiconductor device according to claim 4 , wherein the wiring substrate includes aplurality of vias.
Claim 24
Dependent Claim
17 words
A semiconductor device according to claim 5 , wherein the wiring substrate includes a plurality of vias.
Claim 25
Dependent Claim
20 words
A semiconductor device according to claim 7 , wherein the conductive film-like pattern contains conductive particles dispersed in epoxy resin.
Claim 26
Dependent Claim
20 words
A semiconductor device according to claim 8 , wherein the conductive film-like pattern contains conductive particles dispersed in epoxy resin.
Claim 27
Dependent Claim
20 words
A semiconductor device according to claim 9 , wherein the conductive film-like pattern contains conductive particles dispersed in epoxy resin.
Claim 28
Dependent Claim
20 words
A semiconductor device according to claim 10 , wherein the conductive film-like pattern contains conductive particles dispersed in epoxy resin.
Claim 29
Dependent Claim
20 words
A semiconductor device according to claim 11 , wherein the conductive film-like pattern contains conductive particles dispersed in epoxy resin.
Claim 30
Dependent Claim
20 words
A semiconductor device according to claim 12 , wherein the conductive film-like pattern contains conductive particles dispersed in epoxy resin.
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US6208521B1
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-07-22 | 2006-01-21 | 2006-07-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-07-22 | 2010-01-21 | 2010-07-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-07-22 | 2014-01-21 | 2014-07-23 | $7700.00 | Window Closed / Lapsed |