US6570249B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor package
Assignee: Siliconware Precision Industries Co Ltd
•
Filing: 2002-01-30
•
Granted: 2003-05-27
•
Expires: 2022-01-30
Abstract
Abstract A semiconductor device and a fabrication method of the same are proposed, in which at least one electronic component is firstly mounted on a first substrate, and then the first substrate is attached onto a semiconductor chip or a second substrate. Further, with the chip being deposited on the second substrate, electrical connection is established among the first substrate, the second substrate and the chip. This combined structure is subsequently subjected to molding, ball implantation and singulation processes, and thus completes the fabrication of the semiconductor device. Such a semiconductor device provides significant advantages, including prevention of the occurrence of wire short-circuiting, no need to alter the substrate design, no need to use a circuit pattern with fine pitches or an expensive substrate integrated with electronic components.
Inventors
- 👤 Chih-Chin Liao
- 👤 Han-Ping Pu
- 👤 Chien-Ping Huang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:22
CPC Classifications
H; H10; H10W; H10W72/00; H10W90/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/5449; H10W72/547; H10W72/551; H10W72/552; H10W72/5522; H10W72/90; H10W72/931; H10W72/932; H10W74/00; H10W90/701; H10W90/731; H10W90/732; H10W90/751; H10W90/752; H10W90/754; H10W90/756; H10W90/811
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
207 words
A semiconductor device, comprising: at least one electronic component having a first surface and a second surface, wherein the electronic component is a passive component; a first substrate having a first surface and a second surface, wherein the second surface of the electronic component is electrically connected to the first surface of the first substrate, and the electronic component is reflow-soldered onto the first surface of the first substrate; a semiconductor chip having a first surface and a second surface; a second substrate having a first surface and a second surface, wherein the second surface of the semiconductor chip is attached to the first surface of the second substrate, which combined structure of the semiconductor chip and the second substrate accommodates the second surface of the first substrate associated with the electronic component thereon; a plurality of bonding wires for establishing electrical connection among the first surface of the semiconductor chip, the first surface of the first substrate and the first surface of the second substrate; an encapsulant formed on the first surface of the second substrate, for encapsulating the electronic component, the first substrate, the semiconductor chip and the bonding wires; and a plurality of solder balls implanted on the second surface of the second substrate.
Claim 2
Dependent Claim
207 words
A semiconductor device, comprising: at least one electronic component having a first surface and a second surface, wherein the electronic component is a passive component; a first substrate having a first surface and a second surface, wherein the second surface of the electronic component is electrically connected to the first surface of the first substrate, and the electronic component is reflow-soldered onto the first surface of the first substrate; a semiconductor chip having a first surface and a second surface; a second substrate having a first surface and a second surface, wherein the second surface of the semiconductor chip is attached to the first surface of the second substrate, which combined structure of the semiconductor chip and the second substrate accommodates the second surface of the first substrate associated with the electronic component thereon; a plurality of bonding wires for establishing electrical connection among the first surface of the semiconductor chip, the first surface of the first substrate and the first surface of the second substrate; an encapsulant formed on the first surface of the second substrate, for encapsulating the electronic component, the first substrate, the semiconductor chip and the bonding wires; and a plurality of solder balls implanted on the second surface of the second substrate.
Claim 3
Dependent Claim
30 words
The semiconductor device of claim 1 , wherein the second surface of the first substrate associated with the electronic component is attached to the first surface of the semiconductor chip.
Claim 4
Dependent Claim
30 words
The semiconductor device of claim 1 , wherein the second surface of the first substrate associated with the electronic component is attached to the first surface of the second substrate.
Claim 5
Dependent Claim
85 words
The semiconductor device of claim 1 , wherein the bonding wires include a first set of bonding wires that electrically connect the first surface of the first substrate to the first surface of the semiconductor chip, a second set of bonding wires that electrically connect the first surface of the semiconductor chip to the first surface of the second substrate, and a third set of bonding wires that electrically connect the first surface of the first substrate to the first surface of the second substrate.
Claim 6
Dependent Claim
61 words
The semiconductor device of claim 1 , wherein the bonding wires include a first set of bonding wires that electrically connect the first surface of the first substrate to the first surface of the semiconductor chip, and a second set of bonding wires that electrically connect the first surface of the semiconductor chip to the first surface of the second substrate.
Claim 7
Dependent Claim
61 words
The semiconductor device of claim 1 , wherein the bonding wires include a first set of bonding wires that electrically connect the first surface of the first substrate to the first surface of the second substrate, and a second set of bonding wires that electrically connect the first surface of the semiconductor chip to the first surface of the second substrate.
Claim 8
Dependent Claim
162 words
A semiconductor device, comprising: at least one electronic component having a first surface, wherein the electronic component is a passive component and a second surface; a substrate having a first surface and a second surface, wherein the second surface of the electronic component is electrically connected to the first surface of the substrate; a semiconductor chip having a first surface and a second surface, wherein the second surface of the substrate associated with the electronic component is attached to the first surface of the semiconductor chip; a die pad for accommodating the second surface of the semiconductor chip; a plurality of leads formed around a side of the semiconductor chip; a plurality of bonding wires for establishing electrical connection among the first surface of the semiconductor chip, the first surface of the substrate and inner portions of the leads; and an encapsulant for encapsulating the electronic component, the substrate, the semiconductor chip, the bonding wires and the inner portions of the leads.
Claim 9
Dependent Claim
162 words
A semiconductor device, comprising: at least one electronic component having a first surface, wherein the electronic component is a passive component and a second surface; a substrate having a first surface and a second surface, wherein the second surface of the electronic component is electrically connected to the first surface of the substrate; a semiconductor chip having a first surface and a second surface, wherein the second surface of the substrate associated with the electronic component is attached to the first surface of the semiconductor chip; a die pad for accommodating the second surface of the semiconductor chip; a plurality of leads formed around a side of the semiconductor chip; a plurality of bonding wires for establishing electrical connection among the first surface of the semiconductor chip, the first surface of the substrate and inner portions of the leads; and an encapsulant for encapsulating the electronic component, the substrate, the semiconductor chip, the bonding wires and the inner portions of the leads.
Claim 10
Dependent Claim
20 words
The semiconductor device of claim 7 , wherein the electronic component is reflow-soldered onto the first surface of the substrate.
References Cited (Backward Citations)
JPS59136963A
Cited
JPS63179764A
Cited
US5264730A
Cited
US5311405A
Cited
US5670824A
Cited
US5739581A
Cited
US5796165A
Cited
US5811880A
Cited
US5825628A
Cited
US6291880B1
Cited
US6316828B1
Cited
US20020027295A1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-05-26 | 2006-11-25 | 2007-05-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-05-26 | 2010-11-25 | 2011-05-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-05-26 | 2014-11-25 | 2015-05-27 | $7700.00 | Window Closed / Lapsed |