US5825628A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic package with enhanced pad design
Assignee: Adeia Semiconductor Technologies LLC
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Filing: 1996-10-03
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Granted: 1998-10-20
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Expires: 2016-10-03
Abstract
Abstract An electronic package (400), particularly a BGA, including a circuitized substrate (120) and one or more active devices (110) attached thereon by means of corresponding conductive pads provided on a surface of the substrate (120); each conductive pad is splitted in a plurality of parts (212-218) not in contact. Such parts (212-218) may be separated by a wireable area of the substrate (120), thereby providing one or more wiring channels. In addition, the same parts (212-218) may be connected in interfacing couples at different electrical potentials (ground and power) and decoupled to each other by means of capacitors (410); the connections to the ground and power are achieved by metallized holes provided through the substrate (120).
Inventors
- 👤 Francesco Garbelli
- 👤 Stefano Oggioni
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 10:49
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/601; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/685; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/071; H10W72/073; H10W72/07351; H10W72/07353; H10W72/30; H10W72/331; H10W72/334; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
72 words
An electronic package including a substrate (120) and at least one device (110), said at least one device (110) being attached to said substrate (120) by means of a first conductive pad provided on a first surface of said substrate (120), said first conductive pad being segmented into a plurality of parts (212-218), wherein each of said plurality of parts being not in contact with any other of said plurality of parts.
Claim 2
Dependent Claim
72 words
An electronic package including a substrate (120) and at least one device (110), said at least one device (110) being attached to said substrate (120) by means of a first conductive pad provided on a first surface of said substrate (120), said first conductive pad being segmented into a plurality of parts (212-218), wherein each of said plurality of parts being not in contact with any other of said plurality of parts.
Claim 3
Dependent Claim
24 words
The electronic package according to claim 1, wherein said plurality of parts (212-218) are separated by a wireable area (222-228) of said substrate (120).
Claim 4
Dependent Claim
122 words
An electronic package including a substrate (120) and at least one device (110), said at least one device (110) being attached to said substrate (120) by means of a first conductive pad provided on a first surface of said substrate (120), said first conductive pad being segmented into a plurality of parts (212-218), wherein each of said plurality of parts being not in contact with any other of said plurality of parts, wherein said plurality of parts (212-218) are separated by a wireable area (222-228) of said substrate (120), and wherein said device (110) includes four corners, said first conductive pad being segmented into four parts (212-218) and said wireable area (222-228) having the form of a cross extending from said corners.
Claim 5
Dependent Claim
122 words
An electronic package including a substrate (120) and at least one device (110), said at least one device (110) being attached to said substrate (120) by means of a first conductive pad provided on a first surface of said substrate (120), said first conductive pad being segmented into a plurality of parts (212-218), wherein each of said plurality of parts being not in contact with any other of said plurality of parts, wherein said plurality of parts (212-218) are separated by a wireable area (222-228) of said substrate (120), and wherein said device (110) includes four corners, said first conductive pad being segmented into four parts (212-218) and said wireable area (222-228) having the form of a cross extending from said corners.
Claim 6
Dependent Claim
16 words
The electronic package according to claim 1, wherein said electronic package is a multi chip module.
Claim 7
Dependent Claim
123 words
An electronic package including a substrate (120) and at least one device (110), said at least one device (110) being attached to said substrate (120) by means of a first conductive pad provided on a first surface of said substrate (120), said first conductive pad being segmented into a plurality of parts (212-218), wherein each of said plurality of parts being not in contact with any other of said plurality of parts, and wherein at least a first of said parts (216) is connected to a ground potential and at least a second of said parts (218) is connected to a power potential, said first (216) and said second (218) parts being connected to each other by means of a decoupling capacitor (410).
Claim 8
Dependent Claim
123 words
An electronic package including a substrate (120) and at least one device (110), said at least one device (110) being attached to said substrate (120) by means of a first conductive pad provided on a first surface of said substrate (120), said first conductive pad being segmented into a plurality of parts (212-218), wherein each of said plurality of parts being not in contact with any other of said plurality of parts, and wherein at least a first of said parts (216) is connected to a ground potential and at least a second of said parts (218) is connected to a power potential, said first (216) and said second (218) parts being connected to each other by means of a decoupling capacitor (410).
Claim 9
Dependent Claim
28 words
The electronic package according to claim 1, wherein said substrate (310) includes at least one conductive hole (326) connected to at least one (216) of said parts (212-218).
Claim 10
Dependent Claim
93 words
The electronic package according to claim 6, comprising a second conductive pad provided on a second surface of said substrate (310), said second conductive pad being segmented into a plurality of further parts (334-338), wherein each of said plurality of further parts being not in contact with any other of said plurality of further parts, at least one of said further parts (336) of said second conductive pad being connected to a corresponding one of said parts (216) of said first conductive pad by means of at least one of said holes (326).
Claim 11
Dependent Claim
149 words
An electronic package including a substrate (120) and at least one device (110), said at least one device (110) being attached to said substrate (120) by means of a first conductive pad provided on a first surface of said substrate (120), said first conductive pad being segmented into a plurality of parts (212-218), wherein each of said plurality of parts being not in contact with any other of said plurality of parts, wherein said substrate (310) includes at least one conductive hole (326) connected to at least one (216) of said parts (212-218), and wherein said substrate (310) includes a ground layer (342) and a power layer (344), said first part (216) being connected to said ground layer (342) by means of a first (326) of said holes and said second part (218) being connected to said power layer (344) by means of a second (328) of said holes.
Claim 12
Dependent Claim
149 words
An electronic package including a substrate (120) and at least one device (110), said at least one device (110) being attached to said substrate (120) by means of a first conductive pad provided on a first surface of said substrate (120), said first conductive pad being segmented into a plurality of parts (212-218), wherein each of said plurality of parts being not in contact with any other of said plurality of parts, wherein said substrate (310) includes at least one conductive hole (326) connected to at least one (216) of said parts (212-218), and wherein said substrate (310) includes a ground layer (342) and a power layer (344), said first part (216) being connected to said ground layer (342) by means of a first (326) of said holes and said second part (218) being connected to said power layer (344) by means of a second (328) of said holes.
Claim 13
Dependent Claim
245 words
An electronic package including a substrate (120) and at least one device (110), said at least one device (110) being attached to said substrate (120) by means of a first conductive pad provided on a first surface of said substrate (120), said first conductive pad being segmented into a plurality of parts (212-218), wherein each of said plurality of parts being not in contact with any other of said plurality of parts, wherein said substrate (310) includes at least one conductive hole (326) connected to at least one (216) of said parts (212-218), further comprising a second conductive pad provided on a second surface of said substrate (310), said second conductive pad being segmented into a plurality of further parts (334-338), wherein each of said plurality of further parts being not in contact with any other of said plurality of further parts, at least one of said further parts (336) of said second conductive pad being connected to a corresponding one of said parts (216) of said first conductive pad by means of at least one of said holes (326), and wherein a first part (216) of said first conductive pad being connected to a ground potential by means of a corresponding first (326) of said further parts of said second conductive pad and a second part (218) of said first conductive pad being connected to a power potential by means of a corresponding second (328) of said further parts of said second conductive pad.
Claim 14
Dependent Claim
245 words
An electronic package including a substrate (120) and at least one device (110), said at least one device (110) being attached to said substrate (120) by means of a first conductive pad provided on a first surface of said substrate (120), said first conductive pad being segmented into a plurality of parts (212-218), wherein each of said plurality of parts being not in contact with any other of said plurality of parts, wherein said substrate (310) includes at least one conductive hole (326) connected to at least one (216) of said parts (212-218), further comprising a second conductive pad provided on a second surface of said substrate (310), said second conductive pad being segmented into a plurality of further parts (334-338), wherein each of said plurality of further parts being not in contact with any other of said plurality of further parts, at least one of said further parts (336) of said second conductive pad being connected to a corresponding one of said parts (216) of said first conductive pad by means of at least one of said holes (326), and wherein a first part (216) of said first conductive pad being connected to a ground potential by means of a corresponding first (326) of said further parts of said second conductive pad and a second part (218) of said first conductive pad being connected to a power potential by means of a corresponding second (328) of said further parts of said second conductive pad.
Claim 15
Dependent Claim
79 words
An electronic package including a substrate (120) and at least one device (110), said at least one device (110) being attached to said substrate (120) by means of a first conductive pad provided on a first surface of said substrate (120), said first conductive pad being segmented into a plurality of parts (212-218), wherein each of said plurality of parts being not in contact with any other of said plurality of parts, wherein said electronic package is a BGA.
Claim 16
Dependent Claim
79 words
An electronic package including a substrate (120) and at least one device (110), said at least one device (110) being attached to said substrate (120) by means of a first conductive pad provided on a first surface of said substrate (120), said first conductive pad being segmented into a plurality of parts (212-218), wherein each of said plurality of parts being not in contact with any other of said plurality of parts, wherein said electronic package is a BGA.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-10-19 | 2002-04-20 | 2002-10-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-10-19 | 2006-04-20 | 2006-10-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-10-19 | 2010-04-20 | 2010-10-20 | $7700.00 | Window Closed / Lapsed |