Pad array semiconductor device with thermal conductor and process for making the same

Claim 2

A semiconductor device comprising: a circuitized substrate having a top surface, a bottom surface, a plurality of conductive traces formed on the top surface, a plurality of conductive vias extending through the substrate and electrically coupled to the plurality of conductive traces, and a die receiving area; an opening in the substrate which extends from the die receiving area to the bottom surface, the opening being smaller in area than the die receiving area and larger in area than each of the conductive vias; a thermal conductor fixedly positioned in and filling the opening in the substrate which is substantially planar with the die receiving area and with the bottom surface of the substrate; a metallized area covering the thermal conductor on the bottom surface of the substrate; a semiconductor die mounted to the substrate within the die receiving area, overlying the opening and the thermal conductor, and electrically coupled to the plurality of conductive traces; a plurality of terminals physically coupled to the bottom surface of the substrate and electrically coupled to the plurality of conductive vias; and at least one terminal physically coupled to the metallized area and thermally coupled to the thermal conductor.

Claim 3

The semiconductor device of claim 1 wherein the at least one terminal thermally coupled to the thermal conductor comprises at least one terminal physically coupled to, and directly beneath, the thermal conductor.

Claim 4

The semiconductor device of claim 2 wherein the plurality of terminals and the at least one terminal each comprise solder ball terminals.

Claim 5

The semiconductor device of claim 1 wherein the thermal conductor is a disk comprised of copper.

Claim 6

The semiconductor device of claim 4 wherein the disk has a thickness not greater than 0.5 mm.

Claim 7

The semiconductor device of claim 1 wherein the metallized area extends beyond the thermal conductor onto the bottom surface of the substrate.

Claim 8

The semiconductor device of claim 6 wherein the at least one terminal thermally coupled to the thermal conductor comprises at least one terminal attached to the metallized area on the bottom surface of the substrate and displaced from the thermal conductor.

Claim 9

The semiconductor device of claim 1 wherein the substrate has a plurality of openings which extend from the die receiving area to the bottom surface of the substrate and wherein the thermal conductor fills each opening.

Claim 10

The semiconductor device of claim 1 further comprising a recess in the top surface of the substrate which does not extend completely through to the bottom surface of the substrate, the recess having a bottom surface which defines the die receiving area.

Claim 11

A semiconductor device comprising: a circuitized substrate having a top surface, a bottom surface and a die receiving area; a first plurality of conductive traces formed on the top surface of the substrate; a second plurality of conductive traces formed on the bottom surface of the substrate; a plurality of conductive vias which extend through the substrate and electrically couple the first and second pluralities of conductive traces; an opening centrally located in the substrate within the die receiving area and extending from the top surface to the bottom surface, the opening being larger in area than each of the conductive vias; a metal disk having a top surface, a bottom surface, and a first area, the disk being fixedly positioned in the opening such that the top and bottom surfaces of the disk are approximately planar with the top and bottom surfaces of the substrate, respectively; a metallized area covering the bottom surface of the metal disk; a semiconductor die having a second area larger than the first area and mounted to the substrate within the die receiving area and above the metal disk such that the die and metal disk are in thermal contact; means for electrically coupling the semiconductor die to the first plurality of conductive traces; a plurality of solder balls physically coupled to the bottom surface of the substrate and electrically coupled to the second plurality of conductive traces; and at least one solder ball physically coupled to the metallized area and thermally coupled to the metal disk.

Claim 12

A semiconductor device comprising: a circuitized substrate having a top surface, a bottom surface and a die receiving area; a first plurality of conductive traces formed on the top surface of the substrate; a second plurality of conductive traces formed on the bottom surface of the substrate; a plurality of conductive vias which extend through the substrate and electrically couple the first and second pluralities of conductive traces; an opening centrally located in the substrate within the die receiving area and extending from the top surface to the bottom surface, the opening being larger in area than each of the conductive vias; a metal disk having a top surface, a bottom surface, and a first area, the disk being fixedly positioned in the opening such that the top and bottom surfaces of the disk are approximately planar with the top and bottom surfaces of the substrate, respectively; a metallized area covering the bottom surface of the metal disk; a semiconductor die having a second area larger than the first area and mounted to the substrate within the die receiving area and above the metal disk such that the die and metal disk are in thermal contact; means for electrically coupling the semiconductor die to the first plurality of conductive traces; a plurality of solder balls physically coupled to the bottom surface of the substrate and electrically coupled to the second plurality of conductive traces; and at least one solder ball physically coupled to the metallized area and thermally coupled to the metal disk.

Claim 13

The semiconductor device of claim 10 wherein the at least one solder ball is physically coupled to the metallized area and is directly beneath the metal disk.

Claim 14

The semiconductor device of claim 10 wherein the metallized area extends beyond the metal disk onto the bottom surface of the substrate and wherein the at least one solder ball is attached to the metallized area and displaced from the metal disk.

Claim 15

The semiconductor device of claim 10 further comprising a metallized area on the top surface of the substrate which covers the top surface of the metal disk.

Claim 16

The semiconductor device of claim 13 wherein the metallized area on the top surface of the substrate and the metal disk are electrically coupled to at least one of the conductive traces of the first plurality of conductive traces, and wherein the at least one conductive trace is designated as a ground potential trace.

Claim 17

The semiconductor device of claim 10 wherein the metal disk has a thickness not greater than 0.5 mm.

Claim 18

The semiconductor device of claim 10 wherein the circuitized substrate is a resin-based circuitized substrate comprised of a resin selected from a group consisting of epoxy, polyimide, triazine, and phenolic resins.

Claim 19

A process for making a semiconductor device, comprising the steps of: providing a circuitized substrate having a top surface, a bottom surface, a plurality of conductive traces formed on the top surface, a plurality of conductive vias extending through the substrate and electrically coupled to the plurality of conductive traces, a die receiving area, an opening which extends from the die receiving area to the bottom surface and is smaller in area than the die receiving area and larger in area than each of the vias, a thermal conductor filling and fixedly positioned in the opening of the substrate such that the thermal conductor is substantially planar with the die receiving area and the bottom surface of the substrate, and a metallized area covering the thermal conductor on the bottom surface of the substrate; providing a semiconductor die; mounting the semiconductor die to the substrate within the die receiving area and overlying the thermal conductor; electrically coupling the semiconductor die to the plurality of conductive traces; physically coupling a plurality of signal terminals to the bottom surface of the substrate such that the signal terminals are electrically coupled to the plurality of vias; and physically coupling at least one terminal to the metallized area such that the at least one terminal is thermally coupled to the thermal conductor.

Claim 20

A process for making a semiconductor device, comprising the steps of: providing a circuitized substrate having a top surface, a bottom surface, a plurality of conductive traces formed on the top surface, a plurality of conductive vias extending through the substrate and electrically coupled to the plurality of conductive traces, a die receiving area, an opening which extends from the die receiving area to the bottom surface and is smaller in area than the die receiving area and larger in area than each of the vias, a thermal conductor filling and fixedly positioned in the opening of the substrate such that the thermal conductor is substantially planar with the die receiving area and the bottom surface of the substrate, and a metallized area covering the thermal conductor on the bottom surface of the substrate; providing a semiconductor die; mounting the semiconductor die to the substrate within the die receiving area and overlying the thermal conductor; electrically coupling the semiconductor die to the plurality of conductive traces; physically coupling a plurality of signal terminals to the bottom surface of the substrate such that the signal terminals are electrically coupled to the plurality of vias; and physically coupling at least one terminal to the metallized area such that the at least one terminal is thermally coupled to the thermal conductor.

Claim 21

The process of claim 17 wherein the steps of physically coupling a plurality of signal terminals and physically coupling at least one terminal comprise physically coupling a plurality of solder balls and physically coupling at least one solder ball, respectively.

Claim 22

The process of claim 18 wherein the step of physically coupling at least one solder ball to the metallized area comprises physically coupling the at least one solder ball to the metallized area such that the at least one solder ball is displaced from the metal disk.

Claim 23

The process of claim 18 wherein the step of physically coupling at least one solder ball comprises physically coupling at least one solder ball to, and directly beneath, the thermal conductor.

Claim 24

A process of making a circuitized substrate comprising the steps of: providing a resin-based substrate having a top surface, a bottom surface, and a die receiving area; forming a first plurality of conductive traces on the top surface of the substrate; forming a second plurality of conductive traces on the bottom surface of the substrate; forming a plurality of conductive vias which extend through the substrate and electrically coupling the first and second pluralities of conductive traces; forming an opening in the die receiving area of the substrate which extends through the substrate and which is larger in area than each of the conductive vias; providing a thermal conductor having dimensions to allow at least a portion of the thermal conductor to fit through the opening; positioning the thermal conductor in the opening; and compressing the thermal conductor to deform the thermal conductor into a shape which fills the opening and is substantially planar with both the top and bottom surfaces of the substrate, such that the thermal conductor is affixed within the opening by a compression fit.

Claim 25

A process of making a circuitized substrate comprising the steps of: providing a resin-based substrate having a top surface, a bottom surface, and a die receiving area; forming a first plurality of conductive traces on the top surface of the substrate; forming a second plurality of conductive traces on the bottom surface of the substrate; forming a plurality of conductive vias which extend through the substrate and electrically coupling the first and second pluralities of conductive traces; forming an opening in the die receiving area of the substrate which extends through the substrate and which is larger in area than each of the conductive vias; providing a thermal conductor having dimensions to allow at least a portion of the thermal conductor to fit through the opening; positioning the thermal conductor in the opening; and compressing the thermal conductor to deform the thermal conductor into a shape which fills the opening and is substantially planar with both the top and bottom surfaces of the substrate, such that the thermal conductor is affixed within the opening by a compression fit.

Claim 26

The process of claim 21 wherein the step of compressing the thermal conductor comprises compressing the thermal conductor to deform the thermal conductor into a disk shape.

Claim 27

The process of claim 21 wherein the step of providing a thermal conductor comprises providing a thermal conductor comprised of copper.

Claim 28

The process of claim 21 wherein the step of providing a thermal conductor comprises providing a thermal conductor having a stem portion and a first head portion, wherein the step of positioning the thermal conductor comprises positioning the stem portion of the thermal conductor in the opening, and wherein the step of compressing the thermal conductor comprises compressing the stem portion of the thermal conductor to form a second head portion, wherein the first and second head portions are both substantially planar with one of the top and bottom surfaces of the substrate.

Claim 29

The process of claim 21 wherein the step of forming an opening comprises drilling through the substrate.

Claim 30

The process of claim 21 further comprising the step of forming a metallized area on the bottom surface of the substrate which covers the thermal conductor.

Claim 31

The process of claim 26 further comprising the step of plating the metallized area and a portion of the thermal conductor exposed on the bottom surface of the substrate in order to establish an electrical connection between the thermal conductor and the metallized area.

Claim 32

A process of making a semiconductor device comprising the steps of: providing a circuitized substrate made according to a method comprising the steps of: providing a resin-based circuitized substrate having a top surface, a bottom surface, and a die receiving area; forming an opening in the die receiving area of the substrate which extends through the substrate; providing a thermal conductor having dimensions to allow at least a portion of the thermal conductor to fit through the opening; positioning the thermal conductor in the opening; and compressing the thermal conductor to deform the thermal conductor into a shape which fills the opening and affixes the thermal conductor within the opening, whereupon deforming the thermal conductor becomes substantially planar with the top and bottom surfaces of the substrate; providing a semiconductor die; mounting the semiconductor die to the substrate within the die receiving area of the substrate and overlying the compressed thermal conductor; electrically coupling the semiconductor die to the circuitized substrate; encapsulating the semiconductor die and portions of the top surface of the substrate; and physically coupling a plurality of terminals to the bottom surface of the substrate, wherein a first portion of the plurality of terminals is electrically coupled to the semiconductor die and wherein at least one terminal of the plurality of terminals is electrically and thermally coupled to the thermal conductor.

Claim 33

A process of making a semiconductor device comprising the steps of: providing a circuitized substrate made according to a method comprising the steps of: providing a resin-based circuitized substrate having a top surface, a bottom surface, and a die receiving area; forming an opening in the die receiving area of the substrate which extends through the substrate; providing a thermal conductor having dimensions to allow at least a portion of the thermal conductor to fit through the opening; positioning the thermal conductor in the opening; and compressing the thermal conductor to deform the thermal conductor into a shape which fills the opening and affixes the thermal conductor within the opening, whereupon deforming the thermal conductor becomes substantially planar with the top and bottom surfaces of the substrate; providing a semiconductor die; mounting the semiconductor die to the substrate within the die receiving area of the substrate and overlying the compressed thermal conductor; electrically coupling the semiconductor die to the circuitized substrate; encapsulating the semiconductor die and portions of the top surface of the substrate; and physically coupling a plurality of terminals to the bottom surface of the substrate, wherein a first portion of the plurality of terminals is electrically coupled to the semiconductor die and wherein at least one terminal of the plurality of terminals is electrically and thermally coupled to the thermal conductor.

Claim 34

The process of claim 27 wherein the step of physically coupling a plurality of terminals comprises attaching a plurality of solder balls.

Claim 35

The device of claim 3 wherein the thermal conductor is larger in area than the at least one solder ball thermally coupled thereto.

Claim 36

The device of claim 10 wherein the metal disk is larger in area than the at least one solder ball thermally coupled thereto.

Claim 37

The process of claim 18 wherein the step of physically coupling at least one solder ball comprises physically coupling at least one solder ball to the thermal conductor, wherein the at least one solder ball is smaller in area than the thermal conductor.