Lead frame and semiconductor integrated circuit device using it

Abstract

Abstract PURPOSE:To restrain a resin-molded package from being cracked at a test process such as a temperature cycle test, a thermal shock test or the like and at a soldering and mounting process by a method wherein a cutout part is formed and a die pad is divided by using the cutout part. CONSTITUTION:A semiconductor chip 4 is bonded to a die pad 8 via a thin bonding part composed of a silver paste; cutout parts 9 which are extended to the central direction from its outer circumference are formed in the die pad 8; and the pad 8 is divided into four parts by the parts 9. Molding resins on both the surface side and the rear surface side of the die pad 8 are bonded through the portions situated on the outer side of a chip mounting region 10 out of the parts 9; and it is possible to restrain that the molding resin on the rear surface side of the die pad 8 is contracted thanks to its bonding part. Thereby, it is possible to restrain a package crack caused by a thermal stress at a temperature cycle test, a thermal shock test and the like and a package crack caused by expansion of moisture at a soldering and mounting operation. It is possible to sharply increase the reliability and the yield of a semiconductor integrated circuit device 1.

Inventors

• 👤 Yasuhisa Hagiwara
• 👤 靖久 萩原
• 👤 Fujio Ito
• 👤 富士夫 伊藤
• 👤 Kazunari Suzuki
• 👤 一成 鈴木
• 👤 Hiromichi Suzuki
• 👤 博通 鈴木

Bibliographic Details