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US5811880A Expired / Lapsed US ⏱️ 0.0 years remaining

Design for mounting discrete components inside an integrated circuit package for frequency governing of microprocessors

Assignee: Intel Corp
•
Filing: 1997-10-21
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Granted: 1998-09-22
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Expires: 2017-10-21
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Abstract

Abstract An electronic package which contains discrete resistive and capacitive components used to control the operating device of an integrated circuit located within the package. The package has a bonding shelf that has a plurality of bond fingers which are connected to the integrated circuit. The discrete passive components are mounted to the bonding shelf and connected to the bond fingers by lead traces. The lead traces terminate at the discrete devices so that the resistor and capacitor cannot be accessed through the external contacts of the package. The integrated circuit and discrete components are typically enclosed by a molded plastic material to prevent physical access to the devices without damaging the package.

Inventors

  • 👤 Koushik Banerjee
  • 👤 Barbara Jane Ultis
  • 👤 Sanjay Gupta
  • 👤 John F. McMahon

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 19:01
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W44/00; H10W44/601; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/5445; H10W72/547; H10W72/90; H10W72/931; H10W72/932; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10S; Y10S257/00; Y10S257/924

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 94 words
An electronic package, comprising: a package which has a plurality of bond fingers that are located on a plurality of bond shelves, said package further having a plurality of external contacts and a plurality of surface pads located within a recess of said bond shelves; an electrical device that is mounted to said surface pads; and, a pair of lead traces that extend from said bond fingers and terminate at said surface pads, wherein said electrical device and said lead traces are enclosed by said package and cannot be accessed through said external contacts.
Claim 2
Dependent Claim 94 words
An electronic package, comprising: a package which has a plurality of bond fingers that are located on a plurality of bond shelves, said package further having a plurality of external contacts and a plurality of surface pads located within a recess of said bond shelves; an electrical device that is mounted to said surface pads; and, a pair of lead traces that extend from said bond fingers and terminate at said surface pads, wherein said electrical device and said lead traces are enclosed by said package and cannot be accessed through said external contacts.
Claim 3
Dependent Claim 19 words
The package as recited in claim 1, wherein said electrical device is located within a recess in said package.
Claim 4
Dependent Claim 14 words
The package as recited in claim 2, wherein said electrical device is a capacitor.
Claim 5
Dependent Claim 14 words
The package as recited in claim 2, wherein said electrical device is a resistor.
Claim 6
Dependent Claim 109 words
An electronic package, comprising: a package which has a plurality of bond fingers that are located on a plurality of bond shelves, said package further having a plurality of external contacts and a plurality of surface pads located within a recess of said bond shelves; an electrical device that is mounted to said surface pads; a pair of lead traces that extend from said bond fingers and terminate at said surface pads; and, an integrated circuit that is mounted to said package and connected to said bond fingers, wherein said electrical device and said lead traces are enclosed by said package and cannot be accessed through said external contacts.
Claim 7
Dependent Claim 109 words
An electronic package, comprising: a package which has a plurality of bond fingers that are located on a plurality of bond shelves, said package further having a plurality of external contacts and a plurality of surface pads located within a recess of said bond shelves; an electrical device that is mounted to said surface pads; a pair of lead traces that extend from said bond fingers and terminate at said surface pads; and, an integrated circuit that is mounted to said package and connected to said bond fingers, wherein said electrical device and said lead traces are enclosed by said package and cannot be accessed through said external contacts.
Claim 8
Dependent Claim 19 words
The package as recited in claim 5, wherein said electrical device is located within a recess in said package.
Claim 9
Dependent Claim 14 words
The package as recited in claim 5, wherein said electrical device is a capacitor.
Claim 10
Dependent Claim 14 words
The package as recited in claim 5, wherein said electrical device is a resistor.

References Cited (Backward Citations)

JPS59222948A Cited
US5237204A Cited
JPS62290159A Cited
JPS62291128A Cited
JPS6332954A Cited
JPS63173347A Cited
US5103283A Cited
JPH04245467A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2001-09-21 2002-03-23 2002-09-22 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2005-09-21 2006-03-23 2006-09-22 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2009-09-21 2010-03-23 2010-09-22 $7700.00 Window Closed / Lapsed

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