High density integrated circuit package assembly with a heatsink between stacked dies

Claim 2

An integrated circuit (IC) package assembly for supporting dies and providing access to dies, the package assembly comprising: a substrate having a top surface, a bottom surface and a plurality of first traces from the top surface to the bottom surface; a first die disposed over the top surface of the substrate and electrically connected to the first traces at the top surface of the substrate; a heatsink having a top surface and a bottom surface, with the bottom surface of the heatsink disposed over the top surface of the substrate and over the first die; a leadframe having a plurality of leadframe leads, with the leadframe disposed over the top surface of the heatsink; and a second die disposed over the top surface of the heatsink and electrically connected to the leads of the leadframe.

Claim 3

The package assembly according to claim 1, further comprising a plurality of solder balls respectively connected to each of the plurality of first traces at the bottom surface of the substrate.

Claim 4

The package assembly according to claim 1, further comprising a lid that at least partially covers the package assembly.

Claim 5

The package assembly according to claim 1, further comprising an over-mold that at least partially covers the package assembly.

Claim 6

The package assembly according to claim 1, wherein the package assembly is at least partially covered by an encapsulant.

Claim 7

The package assembly according to claim 1, wherein the heatsink has a cavity defined in its bottom surface for accommodating the first die.

Claim 8

The package assembly according to claim 6, further comprising: a plurality of bonding wires for electrically connecting the first die to the traces at the top surface of the substrate; and wherein the cavity has a depth measured from the bottom surface of the heatsink which is greater than a combined height of a thickness of the first die and a wire bond loop height of the bonding wires.

Claim 9

The package assembly according to claim 1, wherein the heatsink is made of anodized aluminum.

Claim 10

The package assembly according to claim 1, wherein the heatsink is made of copper.

Claim 11

The package assembly according to claim 1, wherein the heatsink is made of ceramic.

Claim 12

The package assembly according to claim 1, further comprising a layer of insulating material between at least a portion of the top surface of the substrate and at least a portion of the bottom surface of the heatsink.

Claim 13

The package assembly according to claim 11, wherein the layer of insulating material is made of adhesive insulating tape.

Claim 14

The package assembly according to claim 11, wherein the layer of insulating material is made of non-conductive epoxy.

Claim 15

The package assembly according to claim 1, further comprising a layer of insulating material between at least a portion of the top surface of the heatsink and at least a portion of the leadframe.

Claim 16

The package assembly according to claim 14, wherein the layer of insulating material is made of adhesive insulating tape.

Claim 17

The package assembly according to claim 14, wherein the layer of insulating material is made of non-conductive epoxy.

Claim 18

The package assembly according to claim 1, further comprising: a first layer of insulating material between at least a portion of the top surface of the substrate and at least a portion of the bottom surface of the heatsink; and a second layer of insulating material between at least a portion of the top surface of the heatsink and at least a portion of the leadframe.

Claim 19

The package assembly according to claim 1, wherein the bottom surface of the heatsink is disposed on the top surface of the substrate.

Claim 20

The package assembly according to claim 1, wherein the leadframe is disposed on the top surface of the heatsink.

Claim 21

The package assembly according to claim 1, wherein at least one of the plurality of first traces runs from the top surface of the substrate to the bottom surface of the substrate through a via defined in the substrate.

Claim 22

The package assembly according to claim 1, wherein at least one of the plurality of first traces runs from the top surface of the substrate to the bottom surface of the substrate by running around a peripheral edge of the substrate.

Claim 23

The package assembly according to claim 1, wherein the first die is connected to the first traces by tape automated bonding.

Claim 24

The package assembly according to claim 1, wherein the first die is connected to the first traces by flip chip bonding.

Claim 25

The package assembly according to claim 1, further comprising bonding wires for connecting the first die to the first traces by wirebonding.

Claim 26

The package assembly according to claim 1, wherein the second die is connected to the leadframe by tape automated bonding.

Claim 27

The package assembly according to claim 1, wherein the second die is connected to the leadframe by flip chip bonding.

Claim 28

The package assembly according to claim 1, further comprising bonding wires for connecting the second die to the leadframe by wirebonding.

Claim 29

The package assembly according to claim 1, wherein: the heatsink has a plurality of second traces from the top surface of the heatsink to the bottom surface of the heatsink; the substrate has a plurality of third traces from the top surface of the substrate to the bottom surface of the substrate; and the second traces of at the bottom surface of the heatsink respectively contact third traces at the top surface of the substrate; and the second die is electrically connected to the second traces at the top surface of the heatsink.

Claim 30

The package assembly according to claim 1, further comprising: an insulating layer disposed on at least a portion of the leadframe; and a conductive plane disposed on the insulating layer, the second die being electrically connected to the conductive plane.

Claim 31

The package assembly according to claim 29, wherein the conductive plane is a power plane.

Claim 32

The package assembly according to claim 29, wherein the conductive plane is a ground plane.

Claim 33

An integrated circuit (IC) package assembly for supporting dies and providing access to dies, the package assembly comprising: a first substrate having a top surface, a bottom surface and a plurality of first traces from the top surface to the bottom surface; a first die disposed over the top surface of the first substrate and electrically connected to the first traces at the top surface of the first substrate; a heatsink having a top surface and a bottom surface, with the bottom surface of the heatsink disposed over the top surface of the first substrate and the first die; a second substrate having a top surface, a bottom surface, and a plurality of second traces, with the bottom surface of the second substrate disposed over the top surface of the heatsink; a leadframe electrically connected to the second traces; and a second die disposed on the top surface of the second substrate and electrically connected to the second traces.

Claim 34

An integrated circuit (IC) package assembly for supporting dies and providing access to dies, the package assembly comprising: a first substrate having a top surface, a bottom surface and a plurality of first traces from the top surface to the bottom surface; a first die disposed over the top surface of the first substrate and electrically connected to the first traces at the top surface of the first substrate; a heatsink having a top surface and a bottom surface, with the bottom surface of the heatsink disposed over the top surface of the first substrate and the first die; a second substrate having a top surface, a bottom surface, and a plurality of second traces, with the bottom surface of the second substrate disposed over the top surface of the heatsink; a leadframe electrically connected to the second traces; and a second die disposed on the top surface of the second substrate and electrically connected to the second traces.

Claim 35

An integrated circuit (IC) package assembly for supporting dies and providing access to dies, the package assembly comprising: a first substrate having a top surface, a bottom surface and a plurality of traces from the top surface to the bottom surface; a first die disposed over the top surface of the first substrate and electrically connected to the first traces at the top surface of the first substrate; a heatsink having a top surface and a bottom surface, with the bottom surface of the heatsink disposed over the top surface of the first substrate and the first die; a second substrate having an integrated leadframe, a top surface and a bottom surface, with the bottom surface of the second substrate disposed over the top surface of the heatsink; and a second die disposed on the top surface of the second substrate and electrically connected to the second traces.

Claim 36

An integrated circuit (IC) package assembly for supporting dies and providing access to dies, the package assembly comprising: a first substrate having a top surface, a bottom surface and a plurality of traces from the top surface to the bottom surface; a first die disposed over the top surface of the first substrate and electrically connected to the first traces at the top surface of the first substrate; a heatsink having a top surface and a bottom surface, with the bottom surface of the heatsink disposed over the top surface of the first substrate and the first die; a second substrate having an integrated leadframe, a top surface and a bottom surface, with the bottom surface of the second substrate disposed over the top surface of the heatsink; and a second die disposed on the top surface of the second substrate and electrically connected to the second traces.

Claim 37

An integrated circuit (IC) package assembly for supporting dies and providing access to dies, the package assembly comprising: a substrate having a top surface, a bottom surface and a plurality of first traces from the top surface to the bottom surface; a first die disposed on the top surface of the substrate and electrically connected to the first traces at the top surface of the substrate; a heatsink having a top surface and a bottom surface, and a plurality of second traces, with the bottom surface of the heatsink disposed over the top surface of the substrate and the first die; a second die disposed over the top surface of the heatsink and electrically connected to the second traces; and a leadframe electrically connected to the second traces.

Claim 38

An integrated circuit (IC) package assembly for supporting dies and providing access to dies, the package assembly comprising: a substrate having a top surface, a bottom surface and a plurality of first traces from the top surface to the bottom surface; a first die disposed on the top surface of the substrate and electrically connected to the first traces at the top surface of the substrate; a heatsink having a top surface and a bottom surface, and a plurality of second traces, with the bottom surface of the heatsink disposed over the top surface of the substrate and the first die; a second die disposed over the top surface of the heatsink and electrically connected to the second traces; and a leadframe electrically connected to the second traces.

Claim 39

The package assembly according to claim 34, wherein the traces of heatsink comprise a thin film located at the top surface of the heatsink which is made by thin film techniques.