EMF shielding of an integrated circuit package

Claim 2

An electromagnetically shielded circuit package, comprising: a leadframe having a plurality of lead fingers, an electrically conductive heat sink disposed on said leadframe, said heat sink having a recess that faces said leadframe, a ground connection for said heat sink, a first electrically insulating layer between said heat sink and said leadframe, an electrically conductive layer disposed on a side of said leadframe facing away from said heat sink and, together with said heat sink, forming an electromagnetic field shielded enclosure, a ground connection for said electrically conductive layer, a second electrically insulating layer between said electrically conductive layer and said leadframe, a first electrical device disposed within said enclosure in thermal communication with said heat sink and shielded from outside electromagnetic fields by said heat sink and electrically conductive layer, a third electrically insulating layer on a side of said electrically conductive layer that faces away from said heat sink, electrically conductive tracks on said third electrically insulating layer, said tracks in electrical communication with said lead fingers, at least one other electrical device disposed outside of said enclosure and attached to said third electrically insulating layer, said at least one other electrical device having leads in electrical communication with said electrically conductive tracks, and being shielded from electromagnetic energy emitted from said first electrical device within said enclosure, and an electrically insulating molding material encapsulating said heat sink, leadframe, electrically conductive layer, electrically insulating layers, and all of said electrical devices.

Claim 3

The package of claim 1, wherein said first electrical device is attached to said heat sink.

Claim 4

The package of claim 2, wherein said first electrical device is attached with a thermally conductive and electrically insulating adhesive.

Claim 5

The package of claim 1, wherein said ground connection for said electrically conductive layer comprises an electrical connection between said electrically conductive layer and a lead finger that is electrically grounded.

Claim 6

The package of claim 4, further comprising a thermal conduction path for conducting heat away from said at least one other electrical device.

Claim 7

The package of claim 5, wherein said thermal conduction path comprises heat spreaders disposed on a side of said second electrically insulating layer that faces said heat sink, said heat spreaders in thermal communication with said at least one other electrical device and said heat sink to dissipate heat from said at least one other electrical device through said heat sink.

Claim 8

The package of claim 6, wherein said thermal communication between said at least one other electrical device and said heat spreaders comprises one or more thermal conductors in thermal communication with said heat spreaders, said thermal conductors extending through said electrically conductive layer and said second and third insulating layers to said at least one other electrical device, said thermal conductors in thermal communication with said at least one other electrical device, and said thermal conductors electrically insulated from said electrically conductive layer.

Claim 9

The package of claim 6, further comprising: electrically conductive tracks disposed on said second electrically insulating layer, said first electrical device disposed on said second electrically insulating layer, and leads on said first electrical device in electrical communication with said electrically conductive tracks on said second electrically insulating layer, said lead fingers in electrical communication with said electrically conductive tracks on said second electrically insulating layer.

Claim 10

The package of claim 8, wherein said thermal communication between said first electrical device and said heat sink comprises thermally conductive material disposed between said first electrical device and said heat sink.

Claim 11

The package of claim 8, wherein said first electrical device and said heat sink are in thermal communication with said heat spreaders.

Claim 12

The package of claim 10, wherein said thermal communication between said first electrical device, heat sink and heat spreaders comprise thermally conductive and electrically insulating material disposed between said first electrical device and said heat spreaders, and between said heat sink and said heat spreaders.

Claim 13

An electromagnetically shielded circuit package, comprising: a leadframe having a plurality of lead fingers, an electrically conductive heat sink disposed on said leadframe, said heat sink having a recess that faces said leadframe, a ground connection for said heat sink, a first electrically insulating layer disposed between said heat sink and said leadframe, an electrically conductive layer disposed on a side of said leadframe facing away from said heat sink, a ground connection for said electrically conductive layer, said ground connection comprising an electrical connection between said electrically conductive layer and a lead finger that is electrically grounded, said conductive layer together with said heat sink forming an electromagnetic field shielded enclosure, a second electrically insulating layer disposed between said leadframe and said electrically conductive layer, an electrical device disposed within said enclosure, attached to said heat sink, and shielded from outside electromagnetic fields by said heat sink and said electrically conductive layer, a third electrically insulating layer on a side of said electrically conductive layer that faces away from said heat sink, electrically conductive tracks on said third electrically insulating layer, said tracks in electrical communication with said lead fingers, at least one other electrical device disposed outside of said enclosure and attached to said third electrically insulating layer, said at least one other electrical device having leads in electrical communication with said electrically conductive tracks, and being shielded from electromagnetic energy emitted from said electrical device within said enclosure, and electrically insulating molding material encapsulating said leadframe, heat sink, electrically conductive layer, electrical devices, and electrically insulating layers.

Claim 14

An electromagnetically shielded circuit package, comprising: a leadframe having a plurality of lead fingers, an electrically conductive heat sink disposed on said leadframe, said heat sink having a recess that faces said leadframe, a ground connection for said heat sink, a first electrically insulating layer disposed between said heat sink and said leadframe, an electrically conductive layer disposed on a side of said leadframe facing away from said heat sink, a ground connection for said electrically conductive layer, said ground connection comprising an electrical connection between said electrically conductive layer and a lead finger that is electrically grounded, said conductive layer together with said heat sink forming an electromagnetic field shielded enclosure, a second electrically insulating layer disposed between said leadframe and said electrically conductive layer, an electrical device disposed within said enclosure, attached to said heat sink, and shielded from outside electromagnetic fields by said heat sink and said electrically conductive layer, a third electrically insulating layer on a side of said electrically conductive layer that faces away from said heat sink, electrically conductive tracks on said third electrically insulating layer, said tracks in electrical communication with said lead fingers, at least one other electrical device disposed outside of said enclosure and attached to said third electrically insulating layer, said at least one other electrical device having leads in electrical communication with said electrically conductive tracks, and being shielded from electromagnetic energy emitted from said electrical device within said enclosure, and electrically insulating molding material encapsulating said leadframe, heat sink, electrically conductive layer, electrical devices, and electrically insulating layers.

Claim 15

The package of claim 12, further comprising a thermal conduction path for conducting heat away from said at least one other electrical device.

Claim 16

The package of claim 13, wherein said thermal conduction path comprises heat spreaders disposed on a side of said second electrically insulating layer that faces said heat sink, said heat spreaders in thermal communication with said at least one other electrical device and said heat sink so that heat from said at least one other electrical device is dissipated through said heat sink.

Claim 17

The package of claim 14, wherein said thermal communication between said at least one other electrical device and said heat spreaders comprises one or more thermal conductors in thermal communication with said heat spreaders, said thermal conductors extending through said electrically conductive layer and said second and third insulating layers to said at least one other electrical device, said thermal conductors in thermal communication with said at least one other electrical device, and said thermal conductors electrically insulated from said electrically conductive layer.

Claim 18

An electromagnetically shielded circuit package, comprising: a leadframe having a plurality of lead fingers, an electrically conductive heat sink disposed on said leadframe, said heat sink having a recess that faces said leadframe, a ground connection for said heat sink, an electrically conductive layer disposed on a side of said leadframe facing away from said heat sink and, together with said heat sink, forming an electromagnetic field shielded enclosure, a ground connection for said electrically conductive layer, said ground connection comprising an electrical connection between said electrically conductive layer and a lead finger that is electrically grounded, a first electrical device disposed within said enclosure in thermal communication with said heat sink and shielded from outside electromagnetic fields by said heat sink and electrically conductive layer, at least one other electrical device disposed outside of said enclosure, said at least one other electrical device being shielded from electromagnetic energy emitted from said first electrical device within said enclosure, a first electrically insulating layer disposed between said heat sink and said leadframe, a second electrically insulating layer disposed between said leadframe and said electrically conductive layer, a third electrically insulating layer disposed on a side of said electrically conductive layer that faces away from said heat sink, electrically conductive tracks disposed on said third electrically insulating layer, said tracks in electrical communication with said lead fingers and with leads on said at least one other electrical device, a thermal conduction path for conducting heat away from said at least one other electrical device, and an electrically insulating molding material encapsulating said heat sink, leadframe, electrically conductive layer, and all of said electrical devices.

Claim 19

An electromagnetically shielded circuit package, comprising: a leadframe having a plurality of lead fingers, an electrically conductive heat sink disposed on said leadframe, said heat sink having a recess that faces said leadframe, a ground connection for said heat sink, an electrically conductive layer disposed on a side of said leadframe facing away from said heat sink and, together with said heat sink, forming an electromagnetic field shielded enclosure, a ground connection for said electrically conductive layer, said ground connection comprising an electrical connection between said electrically conductive layer and a lead finger that is electrically grounded, a first electrical device disposed within said enclosure in thermal communication with said heat sink and shielded from outside electromagnetic fields by said heat sink and electrically conductive layer, at least one other electrical device disposed outside of said enclosure, said at least one other electrical device being shielded from electromagnetic energy emitted from said first electrical device within said enclosure, a first electrically insulating layer disposed between said heat sink and said leadframe, a second electrically insulating layer disposed between said leadframe and said electrically conductive layer, a third electrically insulating layer disposed on a side of said electrically conductive layer that faces away from said heat sink, electrically conductive tracks disposed on said third electrically insulating layer, said tracks in electrical communication with said lead fingers and with leads on said at least one other electrical device, a thermal conduction path for conducting heat away from said at least one other electrical device, and an electrically insulating molding material encapsulating said heat sink, leadframe, electrically conductive layer, and all of said electrical devices.

Claim 20

The package of claim 16, wherein said thermal conduction path comprises heat spreaders disposed on a side of said second electrically insulating layer that faces said heat sink, said heat spreaders in thermal communication with said at least one other electrical device and said heat sink to dissipate heat from said at least one other electrical device through said heat sink.

Claim 21

The package of claim 17, wherein said thermal communication between said at least one other electrical device and said heat spreaders comprises one or more thermal conductors in thermal communication with said heat spreaders, said thermal conductors extending through said electrically conductive layer and said second and third insulating layers to said at least one other electrical device, said thermal conductors in thermal communication with said at least one other electrical device, and said thermal conductors electrically insulated from said electrically conductive layer.

Claim 22

The package of claim 17, further comprising: electrically conductive tracks disposed on said second electrically insulating layer, said first electrical device disposed on said second electrically insulating layer, and leads on said first electrical device in electrical communication with said electrically conductive tracks on said second electrically insulating layer, said lead fingers in electrical communication with said electrically conductive tracks on said second electrically insulating layer.

Claim 23

The package of claim 19, wherein said thermal communication between said first electrical device and said heat sink comprises thermally conductive material disposed between said first electrical device and said heat sink.

Claim 24

The package of claim 19, wherein said first electrical device and said heat sink are in thermal communication with said heat spreaders.

Claim 25

The package of claim 21, wherein said thermal communication between said first electrical device, heat sink and heat spreaders comprise thermally conductive and electrically insulating material disposed between said first electrical device and said heat spreaders, and between said heat sink and said heat spreaders.

Claim 26

An electromagnetically shielded circuit package, comprising: a leadframe having a plurality of lead fingers, an electrically conductive heat sink disposed on said leadframe, said heat sink having a recess that faces said leadframe, a ground connection for said heat sink, a first electrically insulating layer disposed between said heat sink and said leadframe, an electrically conductive layer disposed on a side of said leadframe facing away from said heat sink, a ground connection for said electrically conductive layer, said ground connection comprising an electrical connection between said electrically conductive layer and a lead finger that is electrically grounded, said conductive layer together with said heat sink forming an electromagnetic field shielded enclosure, a second electrically insulating layer disposed between said leadframe and said electrically conductive layer, an electrical device disposed within said enclosure, attached to said heat sink, and shielded from outside electromagnetic fields by said heat sink and said electrically conductive layer, at least one other electrical device disposed outside of said enclosure, said at least one other electrical device being shielded from electromagnetic energy emitted from said electrical device within said enclosure, a third electrically insulating layer disposed on a side of said electrically conductive layer that faces away from said heat sink, electrically conductive tracks disposed on said third electrically insulating layer, leads on said at least one other electrical device in electrical communication with said lead fingers, a thermal conduction path for conducting heat away from said additional electrical devices, and electrically insulating molding material encapsulating said leadframe, heat sink, electrically conductive layer, electrical devices, and electrically insulating layers.

Claim 27

An electromagnetically shielded circuit package, comprising: a leadframe having a plurality of lead fingers, an electrically conductive heat sink disposed on said leadframe, said heat sink having a recess that faces said leadframe, a ground connection for said heat sink, a first electrically insulating layer disposed between said heat sink and said leadframe, an electrically conductive layer disposed on a side of said leadframe facing away from said heat sink, a ground connection for said electrically conductive layer, said ground connection comprising an electrical connection between said electrically conductive layer and a lead finger that is electrically grounded, said conductive layer together with said heat sink forming an electromagnetic field shielded enclosure, a second electrically insulating layer disposed between said leadframe and said electrically conductive layer, an electrical device disposed within said enclosure, attached to said heat sink, and shielded from outside electromagnetic fields by said heat sink and said electrically conductive layer, at least one other electrical device disposed outside of said enclosure, said at least one other electrical device being shielded from electromagnetic energy emitted from said electrical device within said enclosure, a third electrically insulating layer disposed on a side of said electrically conductive layer that faces away from said heat sink, electrically conductive tracks disposed on said third electrically insulating layer, leads on said at least one other electrical device in electrical communication with said lead fingers, a thermal conduction path for conducting heat away from said additional electrical devices, and electrically insulating molding material encapsulating said leadframe, heat sink, electrically conductive layer, electrical devices, and electrically insulating layers.

Claim 28

The package of claim 23, wherein said thermal conduction path comprises heat spreaders disposed on a side of said second electrically insulating layer that faces said heat sink, said heat spreaders in thermal communication with said at least one other electrical device and said heat sink so that heat from said at least one other electrical device is dissipated through said heat sink.

Claim 29

The package of claim 24, wherein said thermal communication between said at least one other electrical device and said heat spreaders comprises one or more thermal conductors in thermal communication with said heat spreaders, said thermal conductors extending through said electrically conductive layer and said second and third insulating layers to said at least one other electrical device, said thermal conductors in thermal communication with said at least one other electrical device, and said thermal conductors electrically insulated from said electrically conductive layer.