US5371404A — Thermally conductive integrated circuit package w…

Claim 1

Independent Claim 182 words

A semiconductor device package, comprising: a leadless circuit carrying substrate having two opposed sides, a first side having a metallization pattern, one portion of the metallization pattern being a circuit ground, and a second side having a substantially coplanar array of surface mount solder pads, the metallization pattern being electrically connected to the surface mount solder pads by means of at least one conductive via through the leadless circuit carrying substrate; an integrated circuit die flip-chip mounted on the metallization pattern and the first side of the leadless circuit carrying substrate; an underfill adhesive between the integrated circuit die and the first side of the leadless circuit carrying substrate; and a thermally and electrically conductive plastic material transfer molded to form a cover and encapsulating the integrated circuit die and a portion of the first side of the leadless circuit carrying substrate, the conductive plastic material electrically coupled to the circuit ground and forming a radio frequency energy shield about the integrated circuit die, and mechanically coupled to the integrated circuit die, forming a heat sink to dissipate heat from the die.

Claim 2

Dependent Claim 182 words

A semiconductor device package, comprising: a leadless circuit carrying substrate having two opposed sides, a first side having a metallization pattern, one portion of the metallization pattern being a circuit ground, and a second side having a substantially coplanar array of surface mount solder pads, the metallization pattern being electrically connected to the surface mount solder pads by means of at least one conductive via through the leadless circuit carrying substrate; an integrated circuit die flip-chip mounted on the metallization pattern and the first side of the leadless circuit carrying substrate; an underfill adhesive between the integrated circuit die and the first side of the leadless circuit carrying substrate; and a thermally and electrically conductive plastic material transfer molded to form a cover and encapsulating the integrated circuit die and a portion of the first side of the leadless circuit carrying substrate, the conductive plastic material electrically coupled to the circuit ground and forming a radio frequency energy shield about the integrated circuit die, and mechanically coupled to the integrated circuit die, forming a heat sink to dissipate heat from the die.

Claim 3

Dependent Claim 38 words

The semiconductor device package of claim 1, wherein the cover is smaller than the leadless circuit carrying substrate, thereby exposing a portion of the first side of the leadless circuit carrying substrate about a perimeter of the cover.

Claim 4

Dependent Claim 29 words

The semiconductor device package of claim 1, wherein the cover encapsulates all of the first side of the leadless circuit carrying substrate not covered by the integrated circuit die.

Claim 5

Dependent Claim 17 words

The semiconductor device package of claim 1, wherein the cover has fins molded into an upper surface.

Claim 6

Dependent Claim 21 words

The semiconductor device package of claim 1, further comprising a metal heat sink attached to an upper surface of the cover.

Claim 7

Dependent Claim 22 words

The semiconductor device package of claim 1, wherein the thermally and electrically conductive plastic material comprises a thermoset resin filled with metal.

Claim 8

Dependent Claim 20 words

The semiconductor device package of claim 1, wherein the leadless circuit carrying substrate is a glass reinforced printed circuit board.

Claim 9

Dependent Claim 27 words

The semiconductor device package of claim 1, wherein the leadless circuit carrying substrate is a flexible film selected from the group consisting of polyimide, polyester, or polyetherimide.

Claim 10

Dependent Claim 17 words

The semiconductor device package of claim 1, wherein the surface mount solder pads are bumped with solder.

Claim 11

Dependent Claim 18 words

The semiconductor device package of claim 1, further comprising metal pins attached to the surface mount solder pads.

Claim 12

Dependent Claim 202 words

A thermally conductive integrated circuit package with radio frequency shielding, comprising: a printed circuit substrate having two opposed sides, a first side having a metallization pattern, one portion of the metallization pattern being a circuit ground, and a second side having a substantially coplanar array of surface mount solder pads, the metallization pattern being electrically connected to the surface mount solder pads by means of at least one conductive via through the leadless circuit carrying substrate; an integrated circuit die flip-chip mounted on the metallization pattern and the first side of the printed circuit substrate by means of metal bumps; an underfill adhesive between the integrated circuit die and the first side of the printed circuit substrate; and a plastic material filled with metal particles transfer molded to encapsulate and form a cover for the integrated circuit die and a portion of the first side of the printed circuit substrate wherein a portion of the first side of the printed circuit substrate about a perimeter of the cover is revealed, the cover electrically coupled to the circuit ground to shield the integrated circuit die from radio frequency energy, and mechanically coupled to the integrated circuit die to dissipate heat from the die.

Claim 13

Dependent Claim 202 words

A thermally conductive integrated circuit package with radio frequency shielding, comprising: a printed circuit substrate having two opposed sides, a first side having a metallization pattern, one portion of the metallization pattern being a circuit ground, and a second side having a substantially coplanar array of surface mount solder pads, the metallization pattern being electrically connected to the surface mount solder pads by means of at least one conductive via through the leadless circuit carrying substrate; an integrated circuit die flip-chip mounted on the metallization pattern and the first side of the printed circuit substrate by means of metal bumps; an underfill adhesive between the integrated circuit die and the first side of the printed circuit substrate; and a plastic material filled with metal particles transfer molded to encapsulate and form a cover for the integrated circuit die and a portion of the first side of the printed circuit substrate wherein a portion of the first side of the printed circuit substrate about a perimeter of the cover is revealed, the cover electrically coupled to the circuit ground to shield the integrated circuit die from radio frequency energy, and mechanically coupled to the integrated circuit die to dissipate heat from the die.

Claim 14

Dependent Claim 19 words

The thermally conductive integrated circuit package of claim 11, wherein the cover has fins molded into an upper surface.

Claim 15

Dependent Claim 23 words

The thermally conductive integrated circuit package of claim 11, further comprising a metal heat sink attached to an upper surface of the cover.

Claim 16

Dependent Claim 19 words

The thermally conductive integrated circuit package of claim 11, further comprising solder bumps on the surface mount solder pads.

Claim 17

Dependent Claim 151 words

An electronic component assembly, comprising: an electronic component having a plurality of terminals; an electronic component carrier including a substrate having first and second opposed major surfaces, and a conductive pattern on the first major surface for receiving the electronic component, and at least one ground pad on the same major surface as the conductive pattern; the electronic component flip-chip bonded to the conductive pattern of said electronic component carrier; an underfill adhesive between the electronic component and the first major surface; and a thermally and electrically conductive plastic material transfer molded to form a cover and encapsulate the electronic component and a portion of the first major surface, the conductive plastic material electrically coupled to the ground pad to provide a shield for substantially reducing the ingress or egress of radio frequency signals through the cover, and mechanically coupled to the electronic component to dissipate heat from the electronic component.

Claim 18

Dependent Claim 151 words

An electronic component assembly, comprising: an electronic component having a plurality of terminals; an electronic component carrier including a substrate having first and second opposed major surfaces, and a conductive pattern on the first major surface for receiving the electronic component, and at least one ground pad on the same major surface as the conductive pattern; the electronic component flip-chip bonded to the conductive pattern of said electronic component carrier; an underfill adhesive between the electronic component and the first major surface; and a thermally and electrically conductive plastic material transfer molded to form a cover and encapsulate the electronic component and a portion of the first major surface, the conductive plastic material electrically coupled to the ground pad to provide a shield for substantially reducing the ingress or egress of radio frequency signals through the cover, and mechanically coupled to the electronic component to dissipate heat from the electronic component.

Claim 19

Dependent Claim 185 words

A radio, ,comprising a transmitter, said transmitter having a heat producing amplifier, comprising: a leadless circuit carrying substrate having two opposed sides, a first side having a metallization pattern, one portion of the metallization pattern being a circuit ground, and a second side having a substantially coplanar array of surface mount solder pads, the metallization pattern being electrically connected to the surface mount solder pads by means of at least one conductive via through the leadless circuit carrying substrate; an integrated circuit flip-chip mounted on the metallization pattern and the first side of the leadless circuit carrying substrate by means of metal bumps; an underfill adhesive between the integrated circuit and the first side of the leadless circuit carrying substrate; and a thermally and electrically conductive plastic material transfer molded to form a cover and encapsulate the integrated circuit and a portion of the first side of the leadless circuit carrying substrate, the conductive plastic material electrically coupled to the circuit ground to shield the integrated circuit from radio frequency energy and mechanically coupled to the integrated circuit to dissipate heat from the integrated circuit.

Claim 20

Dependent Claim 185 words

A radio, ,comprising a transmitter, said transmitter having a heat producing amplifier, comprising: a leadless circuit carrying substrate having two opposed sides, a first side having a metallization pattern, one portion of the metallization pattern being a circuit ground, and a second side having a substantially coplanar array of surface mount solder pads, the metallization pattern being electrically connected to the surface mount solder pads by means of at least one conductive via through the leadless circuit carrying substrate; an integrated circuit flip-chip mounted on the metallization pattern and the first side of the leadless circuit carrying substrate by means of metal bumps; an underfill adhesive between the integrated circuit and the first side of the leadless circuit carrying substrate; and a thermally and electrically conductive plastic material transfer molded to form a cover and encapsulate the integrated circuit and a portion of the first side of the leadless circuit carrying substrate, the conductive plastic material electrically coupled to the circuit ground to shield the integrated circuit from radio frequency energy and mechanically coupled to the integrated circuit to dissipate heat from the integrated circuit.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	1997-12-05	1998-06-06	1998-12-06	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2001-12-05	2002-06-06	2002-12-06	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2005-12-05	2006-06-06	2006-12-06	$7700.00	Window Closed / Lapsed

Thermally conductive integrated circuit package with radio frequency shielding

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