US3564109A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device with housing
Assignee: Siemens AG
•
Filing: 1968-08-20
•
Granted: 1971-02-16
•
Expires: 1988-08-20
Abstract
Abstract The present invention relates to a semiconductor device with housing and with a cooling device particularly cooling ribs provided at the housing wall. The invention is characterized by the fact that the cooling device and the adjacent housing portion are comprised of a single piece of heat-conducting synthetic material. The technical progress derived from the invention is realized to a particularly full extent if the cooling device and the adjacent housing portion are produced in a single work process by injection molding.
Inventors
- 👤 Hugo Ruchardt
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 15:14
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/251; H10W40/22; H10W40/70
Claims Analysis
Total Claims: 1
Claim 1
Independent Claim
35 words
The semiconductor device of claim 1, wherein the wrapping is provided with a duct to be transversed by a fluid coolant, said duct being removed from the semiconductor device by a maximum of 1 mm.
References Cited (Backward Citations)
US2758261A
Cited
US2850687A
Cited
US2763822A
Cited
US3264248A
Cited
US3035419A
Cited
US3390226A
Cited
US3317796A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-02-15 | 1974-08-17 | 1975-02-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-02-15 | 1978-08-17 | 1979-02-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-02-15 | 1982-08-17 | 1983-02-16 | $7700.00 | Window Closed / Lapsed |