US5113241A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device mounted upon an insulating adhesive with silicon dioxide and nickel chromium steel filling particles
Assignee: Toshiba Corp
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Filing: 1990-12-14
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Granted: 1992-05-12
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Expires: 2010-12-14
Abstract
Abstract A semiconductor device comprises a plurality of pellets fixed on a bed by a conductive adhesive agent, an insulating substrate having a junction wiring fixed on the bed between the semiconductor pellets, and wires for connecting the pellets and insulating substrate. The insulating substrate is fixed on the bed by an insulating adhesive agent including filling material such as particles of silicon dioxide and metal particles. The surfaces of the filling material particles are coated with an oxide film.
Inventors
- 👤 Satoru Yanagida
- 👤 Kouji Araki
- 👤 Hikaru Okunoyama
- 👤 Tetsunori Niimi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 08:32
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/417; H10W70/464; H10W70/468; H10W90/00; H10W90/811; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/50; H10W72/541; H10W72/5449; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
82 words
A semiconductor device comprising: a plurality of pellets fixed on a bed by means of a conductive adhesive agent, an insulating substrate having a junction wiring, fixed on said bed between said semiconductor pellets, and wires for connecting said plurality of semiconductor pellets and said insulating substrate therebetween, said insulating substrate being fixed on said bed by an insulating adhesive agent including, as a filling material, particles of silicon dioxide and metal particles of which surfaces are coated with an oxide film.
Claim 2
Dependent Claim
82 words
A semiconductor device comprising: a plurality of pellets fixed on a bed by means of a conductive adhesive agent, an insulating substrate having a junction wiring, fixed on said bed between said semiconductor pellets, and wires for connecting said plurality of semiconductor pellets and said insulating substrate therebetween, said insulating substrate being fixed on said bed by an insulating adhesive agent including, as a filling material, particles of silicon dioxide and metal particles of which surfaces are coated with an oxide film.
Claim 3
Dependent Claim
15 words
A semiconductor device as set forth in claim 1, wherein said metal is nickel-chromium steel.
Claim 4
Dependent Claim
26 words
A semiconductor device as set forth in claim 1, wherein particles of said metal has a size smaller than that of particles of said silicon dioxide.
Claim 5
Dependent Claim
15 words
A semiconductor device as set forth in claim 1, wherein said metal particles are circular.
Claim 6
Dependent Claim
19 words
A semiconductor device as set forth in claim 1, wherein said metal particles are in the form of flakes.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-05-12 | 1995-11-11 | 1996-05-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-05-12 | 1999-11-11 | 2000-05-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-05-12 | 2003-11-11 | 2004-05-12 | $7700.00 | Window Closed / Lapsed |