US5218234A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device with controlled spread polymeric underfill
Assignee: NXP USA Inc
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Filing: 1991-12-23
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Granted: 1993-06-08
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Expires: 2011-12-23
Abstract
Abstract A semiconductor device assembly comprises a semiconductor device (10) attached to a substrate (20). The substrate has a metallization pattern (22) on the surface and a polymeric film (24) covering most of the surface and the metallization pattern. A window-frame shaped opening (26) is created in the film, exposing portions of the substrate surface. The semiconductor device is attached to the substrate in such a manner that it lies in the interior perimeter (28) of the window-frame shaped opening in the film. An adhesive material (18) is applied to fill the space between the semiconductor device and the substrate. The window frame opening in the polymeric film serves to confine the adhesive to the area in the opening and underneath the device and prevents unwanted spread of the underfill material by forming an ideal fillet geometry. In another embodiment of the invention, the semiconductor device is in a package and the package is attached directly to the substrate.
Inventors
- 👤 Kenneth R. Thompson
- 👤 Kingshuk Banerj
- 👤 Francisco da Costa Alves
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 21:40
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W72/00; H10W72/30; H10W74/012; H10W74/10; H10W74/131; H10W74/15; H10W76/00; H10W76/40; H10W76/42; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/681; H10W72/071; H10W72/072; H10W72/073; H10W72/851; H10W72/853; H10W72/856; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
153 words
A semiconductor device assembly, comprising: a semiconductor device having a perimeter and an active surface; a substrate having a metallization pattern; a polymeric film substantially covering the first surface and the metallization pattern, said polymeric film having a semiconductor device mounting area, comprising: a first opening exposing a portion of the substrate, substantially the same shape as the semiconductor device and larger than the device perimeter; and a portion of the polymeric film situated within and concentric to the first opening, said portion substantially the same shape and smaller than the first opening, creating a window frame opening in the mounting area; the semiconductor device being electrically attached to the metallization pattern with the active surface facing the substrate; and an adhesive material situated between the device and the substrate, said adhesive material substantially filling a void between the device active surface and the substrate and extending laterally to the window frame opening.
Claim 2
Dependent Claim
153 words
A semiconductor device assembly, comprising: a semiconductor device having a perimeter and an active surface; a substrate having a metallization pattern; a polymeric film substantially covering the first surface and the metallization pattern, said polymeric film having a semiconductor device mounting area, comprising: a first opening exposing a portion of the substrate, substantially the same shape as the semiconductor device and larger than the device perimeter; and a portion of the polymeric film situated within and concentric to the first opening, said portion substantially the same shape and smaller than the first opening, creating a window frame opening in the mounting area; the semiconductor device being electrically attached to the metallization pattern with the active surface facing the substrate; and an adhesive material situated between the device and the substrate, said adhesive material substantially filling a void between the device active surface and the substrate and extending laterally to the window frame opening.
Claim 3
Dependent Claim
20 words
The assembly of claim 1, wherein the window frame opening is between about 5 mils and about 20 mils wide.
Claim 4
Dependent Claim
24 words
The assembly of claim 1, wherein the window frame opening is between about 15 mils and about 100 mils distant from the semiconductor device.
Claim 5
Dependent Claim
19 words
The assembly of claim 1, wherein the polymeric film is between about 0.5 mils and about 10 mils thick.
Claim 6
Dependent Claim
19 words
The assembly of claim 1, wherein the semiconductor device is attached to the substrate by means of solder spheres.
Claim 7
Dependent Claim
22 words
The assembly of claim 1, wherein the adhesive material extends into the window frame opening, and substantially fills the window frame opening.
Claim 8
Dependent Claim
16 words
The assembly of claim 1, wherein the adhesive material extends slightly beyond the window frame opening.
Claim 9
Dependent Claim
16 words
The assembly of claim 1, wherein the adhesive material does not fill the window frame opening.
Claim 10
Dependent Claim
132 words
A semiconductor device assembly, comprising: a substrate having a flip chip attached by means of a plurality of metal bumps, said substrate having a solder mask substantially covering the substrate surface, said solder mask having a flip chip mounting area, comprising: a first opening exposing a portion of the substrate, substantially the same shape as the flip chip and larger than the flip chip; and a portion of the solder mask situated within and concentric to the first opening, the portion substantially the same shape and smaller than the first opening, creating a window frame opening in the mounting area; and an adhesive underfill material applied between the flip chip and the substrate, the underfill material extending beyond the flip chip perimeter to the window frame opening, and not beyond the opening.
Claim 11
Dependent Claim
132 words
A semiconductor device assembly, comprising: a substrate having a flip chip attached by means of a plurality of metal bumps, said substrate having a solder mask substantially covering the substrate surface, said solder mask having a flip chip mounting area, comprising: a first opening exposing a portion of the substrate, substantially the same shape as the flip chip and larger than the flip chip; and a portion of the solder mask situated within and concentric to the first opening, the portion substantially the same shape and smaller than the first opening, creating a window frame opening in the mounting area; and an adhesive underfill material applied between the flip chip and the substrate, the underfill material extending beyond the flip chip perimeter to the window frame opening, and not beyond the opening.
Claim 12
Dependent Claim
20 words
The assembly of claim 9, wherein the window frame opening is between about 5 mils and about 20 mils wide.
Claim 13
Dependent Claim
24 words
The assembly of claim 9, wherein the window frame opening is between about 15 mils and about 100 mils distant from the flip chip.
Claim 14
Dependent Claim
19 words
The assembly of claim 9, wherein the solder mask is between about 0.5 mils and about 10 mils thick.
Claim 15
Dependent Claim
12 words
The assembly of claim 9, wherein the underfill material is an epoxy.
Claim 16
Dependent Claim
18 words
The assembly of claim 9, wherein the flip chip is attached to the substrate by means of solder.
Claim 17
Dependent Claim
22 words
The assembly of claim 9, wherein the underfill material extends into the window frame opening, and substantially fills the window frame opening.
Claim 18
Dependent Claim
16 words
The assembly of claim 9, wherein the underfill material extends slightly beyond the window frame opening.
Claim 19
Dependent Claim
16 words
The assembly of claim 9, wherein the underfill material does not fill the window frame opening.
Claim 20
Dependent Claim
134 words
An electronic assembly, comprising: a semiconductor device package having a body; a circuit carrying substrate having a first surface and a metallization pattern on said first surface; a polymeric film substantially covering said first surface and said metallization pattern; a window-frame opening defined in said polymeric film, said opening being substantially the same shape as said package body and larger than said device package, and extending through said film so as to expose said first surface, and; said semiconductor device package electrically attached to said metallization pattern and situated within said window-frame opening so as to provide a space between said package and said substrate; an underfill material situated between said package body and said circuit carrying substrate, said underfill material substantially filling said space and restricted within the limits of said window-frame opening.
Claim 21
Dependent Claim
134 words
An electronic assembly, comprising: a semiconductor device package having a body; a circuit carrying substrate having a first surface and a metallization pattern on said first surface; a polymeric film substantially covering said first surface and said metallization pattern; a window-frame opening defined in said polymeric film, said opening being substantially the same shape as said package body and larger than said device package, and extending through said film so as to expose said first surface, and; said semiconductor device package electrically attached to said metallization pattern and situated within said window-frame opening so as to provide a space between said package and said substrate; an underfill material situated between said package body and said circuit carrying substrate, said underfill material substantially filling said space and restricted within the limits of said window-frame opening.
Claim 22
Dependent Claim
18 words
The assembly of claim 18, wherein the window-frame opening between about 5 mils and about 20 mils wide.
Claim 23
Dependent Claim
35 words
The assembly of claim 18, wherein the window-frame opening has an interior perimeter and an exterior perimeter, said interior perimeter being between about 15 mils and about 100 mils larger than perimeter of said package.
Claim 24
Dependent Claim
19 words
The assembly of claim 18, wherein the polymeric film is between about 0.5 mils and about 10 mils thick.
Claim 25
Dependent Claim
12 words
The assembly of claim 18, wherein the underfill material is an epoxy.
Claim 26
Dependent Claim
17 words
The assembly of claim 18, wherein the package is attached to the substrate by means of solder.
Claim 27
Dependent Claim
20 words
The assembly of claim 18, wherein the underfill material extends into the window-frame opening, and substantially fills the window-frame opening.
Claim 28
Dependent Claim
15 words
The assembly of claim 18, wherein the underfill material extends slightly beyond the window-frame opening.
Claim 29
Dependent Claim
15 words
The assembly of claim 18, wherein the underfill material does not fill the window-frame opening.
Claim 30
Dependent Claim
37 words
The assembly of claim 1, further comprising a second opening situated within and concentric to the portion of the polymeric film, said second opening substantially the same shape and smaller than said portion of the polymeric film.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-06-07 | 1996-12-07 | 1997-06-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-06-07 | 2000-12-07 | 2001-06-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-06-07 | 2004-12-07 | 2005-06-08 | $7700.00 | Window Closed / Lapsed |