US4280132A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multi-lead frame member with means for limiting mold spread
Assignee: Sharp Corp
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Filing: 1979-10-15
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Granted: 1981-07-21
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Expires: 1999-10-15
Abstract
Abstract Blocking members are provided for limiting mold spread over a desirable area while a semiconductor is molded. The blocking members are composed within a metallic layer together with metallic leads by photoetching techniques. The blocking members are positioned at four corners of an aperture in a predetermined pattern of generally radial fingers extending cantilever-wise inwardly beyond the periphery of the aperture. The semiconductor is adapted to engage bumps on the semiconductor to the metallic leads by wire bonding methods. Extended portions of the metallic leads may also function as the blocking members, with the metallic leads being positioned at the four corners of the aperture.
Inventors
- 👤 Masao Hayakawa
- 👤 Takamichi Maeda
- 👤 Masao Kumura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 13:24
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/131; H10W70/00; H10W70/40; H10W70/421; H10W70/435; H10W70/60; H10W70/62; H10W70/65; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
83 words
A multiple-lead frame member comprising a semiconductor unit disposed within an aperture, a plurality of metallic lead connectors bonded to said semiconductor unit by bump means, and blocking means provided for limiting mold spread when the semiconductor unit is molded, said blocking means being positioned at at least one corner of said aperture and being composed of a metallic material common to said leads, wherein the semiconductor unit is disposed in a predetermined pattern extending cantileverwise inwardly, beyond the periphery of the aperture.
Claim 2
Dependent Claim
83 words
A multiple-lead frame member comprising a semiconductor unit disposed within an aperture, a plurality of metallic lead connectors bonded to said semiconductor unit by bump means, and blocking means provided for limiting mold spread when the semiconductor unit is molded, said blocking means being positioned at at least one corner of said aperture and being composed of a metallic material common to said leads, wherein the semiconductor unit is disposed in a predetermined pattern extending cantileverwise inwardly, beyond the periphery of the aperture.
Claim 3
Dependent Claim
25 words
The multiple-lead frame member of claim 1, wherein the blocking member is disposed at all corners of the aperture wherein the semiconductor unit is disposed.
Claim 4
Dependent Claim
40 words
The multiple-lead frame member as specified in claim 1, wherein the blocking means is an extended portion of at least one lead connector which is positioned at least at one corner of said aperture where the semiconductor unit is disposed.
Claim 5
Dependent Claim
18 words
The multiple-lead frame member as specified in claim 1, wherein the blocking means has an approximately rectangular shape.
Claim 6
Dependent Claim
18 words
The multiple-lead frame member as specified in claim 3, wherein the extended portion has a substantially rectangular shape.
Claim 7
Dependent Claim
27 words
The multiple-lead frame member as specified in claim 3, wherein the extended portion is positioned in a predetermined pattern extending cantilever-wise over the periphery of the aperture.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-07-20 | 1985-01-19 | 1985-07-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-07-20 | 1989-01-19 | 1989-07-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-07-20 | 1993-01-19 | 1993-07-21 | $7700.00 | Window Closed / Lapsed |