Fabrication of packages for integrated circuits
Abstract
Abstract A process useful for fabricating articles having a ceramic thermetic sealing member and a high density of relatively thin electricallyconductive leads comprising fabricating an electrically conductive member having a frame portion extending around the perimeter thereof and a relatively small central pad portion connected to two opposing sides frame portion by a plurality of component leads and at least one connecting lead, applying a heat decomposable adhesive suitable for bonding a metal foil to the pad and to a segment of each of the component leads and the connecting lead, compacting a metal foil over the coated pad and the coated segment of the leads and into the spacing between the leads, severing the component leads adjacent to the pad, forming a ceramic hermetic seal, by the application of heat, around a substantial portion of all of the leads between the foil and the frame and removing the foil and the decomposition products of the adhesive.
Inventors
- 👤 Thomas D Bunker
- 👤 David F Thompson
Bibliographic Details
Claims Analysis
Total Claims: 0References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1975-09-05 | 1976-03-06 | 1976-09-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-09-05 | 1980-03-06 | 1980-09-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-09-05 | 1984-03-06 | 1984-09-05 | $7700.00 | Window Closed / Lapsed |