US6316828B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Structure of a solder mask for the circuit module of a BGA substrate
Assignee: Advanced Semiconductor Engineering Inc
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Filing: 1999-11-09
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Granted: 2001-11-13
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Expires: 2019-11-09
Abstract
Abstract The structure of a solder mask for the circuit module of a BGA substrate mainly comprises a power ring, a ground ring, a plurality of holes, a plurality of first holes and a plurality of second holes. The power ring and the ground ring are arranged between the chip area and the wire bonding area; the first openings are arranged on the power ring and the ground ring for receiving the electronic part. Thus the substrate meets the requirement of keeping the electronic part close to the chip. The second openings are arranged over the associated holes which electrically connect to the power ring and the ground ring by traces; these holes do need not to electrically connect the power layer and the ground layer of the substrate. The openings of the present invention use the power ring, ground ring and the holes of the substrate to electrically connect to the electronic parts, so that the present invention does not need to provide other holes or traces thus simplifying the structure of the substrate. The distance of two openings of the present invention can, moreover, be adjusted according to the length of the electronic part.
Inventors
- 👤 Su Tao
- 👤 Tao-Yu Chen
- 👤 Kao-Yu Hsu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 16:46
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W72/541; H10W72/5445; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W72/951; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
114 words
A circuit module of a BGA substrate comprising: a substrate including a power ring, a ground ring and a plurality of holes, the power ring and the ground ring are arranged between a chip area and a wire bonding area and provide for a power pad and a ground pad for chip wire bonding; a solder mask having a plurality of openings corresponding to the power ring and the ground ring such that when the solder mask covers the substrate part of the power ring and the ground ring are located in the openings; and an electronic part for attachment diagonally through the openings for connection to the power ring and the ground ring.
Claim 2
Dependent Claim
114 words
A circuit module of a BGA substrate comprising: a substrate including a power ring, a ground ring and a plurality of holes, the power ring and the ground ring are arranged between a chip area and a wire bonding area and provide for a power pad and a ground pad for chip wire bonding; a solder mask having a plurality of openings corresponding to the power ring and the ground ring such that when the solder mask covers the substrate part of the power ring and the ground ring are located in the openings; and an electronic part for attachment diagonally through the openings for connection to the power ring and the ground ring.
Claim 3
Dependent Claim
20 words
A circuit module of a BGA substrate as defined in claim 1 , wherein the substrate is a dual-layer PCB.
Claim 4
Dependent Claim
37 words
A circuit module of a BGA substrate as defined in claim 1 , wherein the electronic part is adhered to the openings by surface mount technology to electrically connect to the power ring and the ground ring.
Claim 5
Dependent Claim
23 words
A circuit module of a BGA substrate as defined in claim 1 , wherein the openings are printed to form a pad therein.
Claim 6
Dependent Claim
95 words
A circuit module of BGA substrate comprising: a substrate including a plurality of holes which are electrically connected to a power ring and a ground ring by traces on a surface of the substrate; a solder mask having a plurality of openings corresponding to the holes such that, when the solder mask covers on the substrate, the power ring and the ground ring are electrically connected to the associated holes corresponding to the openings; and an electronic part which is attached diagonally to the openings for connection to the power ring and the ground ring.
Claim 7
Dependent Claim
95 words
A circuit module of BGA substrate comprising: a substrate including a plurality of holes which are electrically connected to a power ring and a ground ring by traces on a surface of the substrate; a solder mask having a plurality of openings corresponding to the holes such that, when the solder mask covers on the substrate, the power ring and the ground ring are electrically connected to the associated holes corresponding to the openings; and an electronic part which is attached diagonally to the openings for connection to the power ring and the ground ring.
Claim 8
Dependent Claim
20 words
A circuit module of a BGA substrate as defined in claim 5 , wherein the substrate is a dual-layer PCB.
Claim 9
Dependent Claim
37 words
A circuit module of a BGA substrate as defined in claim 5 , wherein the electronic part is adhered to the openings by surface mount technology to electrically connect to the power ring and the ground ring.
Claim 10
Dependent Claim
23 words
A circuit module of a BGA substrate as defined in claim 5 , wherein the openings are printed to form a pad therein.
Claim 11
Dependent Claim
125 words
A structure for utilizing a solder mask for a circuit, wherein the structure comprises: a substrate having a power ring, a ground ring and a plurality of holes, wherein the power ring and the ground ring are arranged in between a chip area and a wire bonding area; a solder mask covers the substrate, wherein a plurality openings are formed over the solder mask, positions of the opening are corresponding to the power ring and the ground ring; an electronic part is electrically connected from the power ring and the ground ring to the openings in such a way that a location of the electronic part is close to the chip area; a chip is electrical connected to the substrate by a plurality of wires.
Claim 12
Dependent Claim
125 words
A structure for utilizing a solder mask for a circuit, wherein the structure comprises: a substrate having a power ring, a ground ring and a plurality of holes, wherein the power ring and the ground ring are arranged in between a chip area and a wire bonding area; a solder mask covers the substrate, wherein a plurality openings are formed over the solder mask, positions of the opening are corresponding to the power ring and the ground ring; an electronic part is electrically connected from the power ring and the ground ring to the openings in such a way that a location of the electronic part is close to the chip area; a chip is electrical connected to the substrate by a plurality of wires.
Claim 13
Dependent Claim
15 words
A structure as defined in claim 9 , wherein the substrate is a dual-layer PCB.
Claim 14
Dependent Claim
21 words
A structure as defined in claim 9 , wherein the electronic part is diagonally connected to the openings on the substrate.
Claim 15
Dependent Claim
32 words
A structure as defined in claim 9 , wherein the electronic part is adhered to the openings by surface mount technology to electrically connect to the power ring and the ground ring.
Claim 16
Dependent Claim
18 words
A structure as defined in claim 9 , wherein the openings are printed to form a pad therein.
Claim 17
Dependent Claim
159 words
A structure for utilizing a solder mask for a circuit, wherein the structure comprises: a substrate having a power ring, a ground ring and a plurality of holes, wherein the power ring and the ground ring are arranged in between a chip area and a wire bonding area, and a plurality of traces, which are formed on the substrate are electrically connected the power ring and the ground ring, a solder mask covers the substrate, wherein a plurality openings are formed over the solder mask, positions of the opening are corresponding to the power ring and the ground ring, and an electronic part is electrical diagonally connected from the power ring and the ground ring to the openings, wherein a location of the electronic part is close to the chip area; and a chip has a plurality of pads, which are electrical connected to the power ring and the ground ring of the substrate by a plurality of wires.
Claim 18
Dependent Claim
159 words
A structure for utilizing a solder mask for a circuit, wherein the structure comprises: a substrate having a power ring, a ground ring and a plurality of holes, wherein the power ring and the ground ring are arranged in between a chip area and a wire bonding area, and a plurality of traces, which are formed on the substrate are electrically connected the power ring and the ground ring, a solder mask covers the substrate, wherein a plurality openings are formed over the solder mask, positions of the opening are corresponding to the power ring and the ground ring, and an electronic part is electrical diagonally connected from the power ring and the ground ring to the openings, wherein a location of the electronic part is close to the chip area; and a chip has a plurality of pads, which are electrical connected to the power ring and the ground ring of the substrate by a plurality of wires.
Claim 19
Dependent Claim
15 words
A structure as defined in claim 14 , wherein the substrate is a dual-layer PCB.
Claim 20
Dependent Claim
21 words
A structure as defined in claim 14 , wherein the electronic part is diagonally connected to the openings on the substrate.
Claim 21
Dependent Claim
32 words
A structure as defined in claim 14 , wherein the electronic part is adhered to the openings by surface mount technology to electrically connect to the power ring and the ground ring.
Claim 22
Dependent Claim
18 words
A structure as defined in claim 14 , wherein the openings are printed to form a pad therein.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-11-12 | 2005-05-14 | 2005-11-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-11-12 | 2009-05-14 | 2009-11-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-11-12 | 2013-05-14 | 2013-11-13 | $7700.00 | Window Closed / Lapsed |