US5264730A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Resin mold package structure of integrated circuit
Assignee: Fujitsu Ltd
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Filing: 1992-09-11
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Granted: 1993-11-23
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Expires: 2012-09-11
Abstract
Abstract A hybrid integrated circuit is provided having a substrate with at least one active and passive element disposed thereon. A lead frame has a plurality of leads and a support plate. The support plate supports the substrate. The support plate and inner leads are encapsulated in a resin mold package. An opening is formed in the support plate to thermally connect the bottom surface of the substrate to the resin mold package, and a plurality of devoid portions are formed in the substrate causing the amount of edge area contacting the resin mold package to be increased and adhesion between the substrate and the resin mold package improved.
Inventors
- 👤 Toshio Matsuzaki
- 👤 Hiroaki Toshima
- 👤 Nobuo Hirasawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 16:16
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/464; H10W70/468; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H10W72/00; H10W72/50; H10W72/541; H10W72/547; H10W72/5473; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
79 words
A hybrid integrated circuit comprising: a lead frame including a plurality of leads and a support plate; a substrate having a plurality of devoid portions formed therein and mounted on said support plate; at least one active element and/or passive element disposed on said substrate; and a resin mold encapsulating said substrate, said support plate, said active element and/or passive element and a portion of said leads, said resin mold filling said plurality of devoid portions of said substrate.
Claim 2
Dependent Claim
79 words
A hybrid integrated circuit comprising: a lead frame including a plurality of leads and a support plate; a substrate having a plurality of devoid portions formed therein and mounted on said support plate; at least one active element and/or passive element disposed on said substrate; and a resin mold encapsulating said substrate, said support plate, said active element and/or passive element and a portion of said leads, said resin mold filling said plurality of devoid portions of said substrate.
Claim 3
Dependent Claim
31 words
A hybrid integrated circuit as recited in claim 1, wherein said support plate has an opening formed therein exposing most of a bottom surface of said substrate to said resin mold.
Claim 4
Dependent Claim
22 words
A hybrid integrated circuit as recited in claim 1, wherein said devoid portions comprise notches formed along a periphery of said substrate.
Claim 5
Dependent Claim
28 words
A hybrid integrated circuit as recited in claim 3, wherein each of said notches are selected from any one of a semicircular shape, a V-shape and a U-shape.
Claim 6
Dependent Claim
18 words
A hybrid integrated circuit as recited in claim 1, wherein each of said devoid portions comprises a through-hole.
Claim 7
Dependent Claim
19 words
A hybrid integrated circuit as recited in claim 3, wherein said devoid portions further comprise a plurality of through-holes.
Claim 8
Dependent Claim
24 words
A hybrid integrated circuit as recited in claim 3, wherein said devoid portions are formed in said substrate at regular intervals along the periphery.
Claim 9
Dependent Claim
33 words
A hybrid integrated circuit as recited in claim 5, wherein said substrate has a rectangular or square shape; and wherein said through-holes are formed along lines parallel with respective sides of said substrate.
Claim 10
Dependent Claim
23 words
A hybrid integrated circuit as recited in claim 5, wherein said through-holes are formed in said substrate beside said active and passive elements.
Claim 11
Dependent Claim
34 words
A hybrid integrated circuit as recited in claim 2, wherein said support plate comprises four stages arranged at each of four corners in a rectangular shape, said substrate supportingly mounted on said four stages.
Claim 12
Dependent Claim
48 words
An integrated circuit comprising: a lead frame; a substrate supportingly disposed on said lead frame, said substrate including a plurality of devoid portions; and a resin mold encapsulating said substrate and at least a portion of said lead frame, said resin mold filling said plurality of devoid portions.
Claim 13
Dependent Claim
48 words
An integrated circuit comprising: a lead frame; a substrate supportingly disposed on said lead frame, said substrate including a plurality of devoid portions; and a resin mold encapsulating said substrate and at least a portion of said lead frame, said resin mold filling said plurality of devoid portions.
Claim 14
Dependent Claim
31 words
An integrated circuit according to claim 11, wherein said lead frame includes a plurality of leads and a support plate; and wherein said substrate is supportingly disposed on said support plate.
Claim 15
Dependent Claim
44 words
An integrated circuit according to claim 12, wherein said support plate has an opening formed therein exposing most of a bottom surface of said substrate to said resin mold; and wherein said substrate is in thermal communication with said resin mold through said opening.
Claim 16
Dependent Claim
32 words
An integrated circuit according to claim 13, wherein said opening has a size such that substantially all of a bottom surface of said substrate is in thermal communication with said resin mold.
Claim 17
Dependent Claim
21 words
An integrated circuit as recited in claim 11, wherein said devoid portions comprise notches formed along a periphery of said substrate.
Claim 18
Dependent Claim
30 words
An integrated circuit as recited in claim 15, wherein each of said notches are selected from any one of a semicircular shape, an elliptical shape, a V-shape and a U-shape.
Claim 19
Dependent Claim
18 words
An integrated circuit as recited in claim 15, wherein said devoid portions further comprise a plurality of through-holes.
Claim 20
Dependent Claim
24 words
An hybrid integrated circuit as recited in claim 15, wherein said devoid portions are formed in said substrate at regular intervals along the periphery.
Claim 21
Dependent Claim
17 words
An integrated circuit as recited in claim 11, wherein each of said devoid portions comprises a through-hole.
Claim 22
Dependent Claim
30 words
An integrated circuit as recited in claim 19, wherein said substrate has a rectangular shape; and wherein said through-holes are formed along lines parallel with respective sides of said substrate.
Claim 23
Dependent Claim
15 words
An integrated circuit as recited in claim 11, wherein said substrate comprises a ceramic substrate.
Claim 24
Dependent Claim
19 words
A hybrid integrated circuit as recited in claim 1, wherein said resin mold consists of an epoxy resin material.
Claim 25
Dependent Claim
18 words
An integrated circuit as recited in claim 11, wherein said resin mold consists of an epoxy resin material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-11-22 | 1997-05-24 | 1997-11-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-11-22 | 2001-05-24 | 2001-11-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-11-22 | 2005-05-24 | 2005-11-23 | $7700.00 | Window Closed / Lapsed |