Electronic component

Abstract

Abstract PURPOSE:To simplify shipping operation and electric character inspection, by connecting a mold part and a lead frame by means of resin at the time of resin molding, in an electronic component to be assembled by using a lead frame. CONSTITUTION:Circuit element 21 is fixed on tab 20, and it is connected by lead 19 and wire 22. When circuit element 21, wire 22 and the inner end of the lead are molded, resin linking part 12 is also formed simultaneously. Corner 4 of dam 13 is supported by supporting piece 18 extending from lead frame 9. The semiconductor device is connected to the lead frame by means of the resin linking part. Hence, it is possible to measure (+ or -)power supply and operate high-precision inspection of electric characteristics. At the same time, it is possible to handle in lead frame units, and thereby work efficiency can be increased.

Inventors

• 👤 Fumihito Inoue
• 👤 Kazuo Shimizu
• 👤 Keizo Otsuki
• 👤 Susumu Okikawa

Bibliographic Details