Vertically integrated component assembly incorporating active and passive components

Claim 3

The apparatus of claim 1, wherein the first conductive layer and the second conductive layer are electrically connected through a conducting via formed within the dielectric layer and the substrate layer.

Claim 4

The apparatus of claim 1, further comprising: an integrated circuit device electrically and mechanically mounted onto the second conductive layer of the substrate layer; whereby the integrated circuit device and the plurality of passive components are electrically interconnected in a vertical fashion, occupying an area substantially the same as the integrated circuit device.

Claim 5

The apparatus of claim 1, further comprising: a main substrate board for electrically and mechanically mounting the first conductive layer of the substrate layer thereon; and an integrated circuit device electrically and mechanically mounted onto the second conductive layer of the substrate layer; whereby the integrated circuit device and the plurality of passive components are electrically connected to the main substrate board in a vertical fashion, occupying an area on the main substrate board substantially the same as the integrated circuit device.

Claim 6

The apparatus of claim 1, wherein the passive components comprise resistors.

Claim 7

The apparatus of claim 1, wherein the passive components comprise capacitors.

Claim 8

The apparatus of claim 1, wherein the passive components comprise inductors.

Claim 9

The apparatus of claim 1, wherein the passive components comprise resistors and capacitors.

Claim 10

The apparatus of claim 1, wherein the substrate layer is a thick-film substrate.

Claim 11

The apparatus of claim 1, wherein the substrate layer is a co-fired ceramic material.

Claim 12

The apparatus of claim 3, wherein: the integrated circuit device includes a plurality of input/output contact pads positioned proximal to the contact pads on the substrate layer to permit interconnection therebetween.

Claim 13

The apparatus of claim 3, wherein the dielectric layer and the second conductive layer each have an outside boundary that is interior to an outside boundary of the substrate layer such that an edge of the substrate layer is exposed.

Claim 14

A three-dimensional microelectronic integrated circuit package comprising: an integrated circuit including a bottom surface having a first periphery; a component assembly formed with passive-circuit components and having a mounting surface for mounting the bottom surface of the integrated circuit thereon, the mounting surface having a second periphery sized such that the first periphery of the integrated circuit is substantially contiguous with the second periphery, the component assembly comprising: a ceramic substrate having the passive-circuit components printed on a first planar surface of the substrate, the passive components having connection terminals extending to an edge of the first planar surface for establishing electrical communication with the integrated circuit; a layer of dielectric material placed over the passive components such that the connection terminals are exposed; conductive means, placed over the layer of dielectric material, for providing the mounting surface for the integrated circuit device, the conductive means further including means for electrically connecting the bottom surface of the integrated circuit with a bottom surface of the component assembly.

Claim 15

A three-dimensional microelectronic integrated circuit package comprising: an integrated circuit including a bottom surface having a first periphery; a component assembly formed with passive-circuit components and having a mounting surface for mounting the bottom surface of the integrated circuit thereon, the mounting surface having a second periphery sized such that the first periphery of the integrated circuit is substantially contiguous with the second periphery, the component assembly comprising: a ceramic substrate having the passive-circuit components printed on a first planar surface of the substrate, the passive components having connection terminals extending to an edge of the first planar surface for establishing electrical communication with the integrated circuit; a layer of dielectric material placed over the passive components such that the connection terminals are exposed; conductive means, placed over the layer of dielectric material, for providing the mounting surface for the integrated circuit device, the conductive means further including means for electrically connecting the bottom surface of the integrated circuit with a bottom surface of the component assembly.

Claim 16

The integrated circuit package of claim 13, wherein the edge comprises a side surface of the substrate.

Claim 17

The integrated circuit package of claim 13, wherein the conductive means comprises: a first ground plane mounted on the bottom surface of the substrate; a second ground plane mounted on a top surface of the substrate; and a conductor between the first ground plane and the second ground plane.

Claim 18

The integrated circuit package of claim 13, wherein the passive circuit components are resistors.

Claim 19

The integrated circuit package of claim 13, wherein the substrate is a thick-film substrate.

Claim 20

The integrated circuit package of claim 13, wherein the substrate is a co-fired ceramic material.

Claim 21

The integrated circuit package of claim 15, wherein the conductor between the first and second ground planes are electrically connected through a conductive via formed in the substrate and the dielectric material.

Claim 22

A three-dimensional electronic package combining an integrated circuit with passive electronic components for incorporation into a main substrate board of a cardiac stimulation device comprising: a substrate layer having a plurality of passive circuit components formed on a first surface of the substrate layer, the passive components having electrical fingers extending to an edge of the substrate layer; a first metallic pad defining a first outer boundary, the first metallic pad being printed on the second surface of the substrate layer with the first outer boundary substantially within the confines of the substrate layer; a dielectric layer printed on the first surface of the substrate layer for insulating the passive components, the dielectric layer defining a second outer boundary smaller than the first outer boundary to expose the electrical fingers; a second metallic pad printed on the dielectric layer and substantially within the second outer boundary, the second metallic pad in electrical communication with the first metallic pad; and an integrated circuit mounted on the second metallic pad and substantially within the second outer boundary, the integrated circuit having electrical contact pads proximate the electrical fingers enabling interconnection between the contact pads and the fingers.

Claim 23

A three-dimensional electronic package combining an integrated circuit with passive electronic components for incorporation into a main substrate board of a cardiac stimulation device comprising: a substrate layer having a plurality of passive circuit components formed on a first surface of the substrate layer, the passive components having electrical fingers extending to an edge of the substrate layer; a first metallic pad defining a first outer boundary, the first metallic pad being printed on the second surface of the substrate layer with the first outer boundary substantially within the confines of the substrate layer; a dielectric layer printed on the first surface of the substrate layer for insulating the passive components, the dielectric layer defining a second outer boundary smaller than the first outer boundary to expose the electrical fingers; a second metallic pad printed on the dielectric layer and substantially within the second outer boundary, the second metallic pad in electrical communication with the first metallic pad; and an integrated circuit mounted on the second metallic pad and substantially within the second outer boundary, the integrated circuit having electrical contact pads proximate the electrical fingers enabling interconnection between the contact pads and the fingers.

Claim 24

The apparatus of claim 20, wherein the main substrate board includes means for electrically and mechanically mounting the first metallic pad of the substrate layer thereon, the main substrate board having a plurality of wirebond pads thereon, further comprising: a first set of wirebonds between the integrated circuit and the plurality of wirebond pads on the main substrate board; a second set of wirebonds between the electrical fingers on the substrate layer and the plurality of wirebond pads on the main substrate board; whereby the integrated circuit and the substrate layer are electrically connected to the main substrate board in a vertical fashion, occupying an area substantially the same as the integrated circuit.