US7057269B2
Expired / Lapsed
US
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Semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package
Assignee: Stats Chippac Pte Ltd
•
Filing: 2003-10-08
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Granted: 2006-06-06
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Expires: 2023-10-08
Abstract
Abstract A semiconductor multi-package module has a second package inverted and stacked over a first package, each of the packages having a die attached to a substrate, in which the second package substrate and the first package substrate are interconnected by wire bonding, and in which the first package includes a ball grid array package. Also, a method for making a semiconductor multi-package module, by providing a lower molded ball grid array package including a lower substrate and a die, affixing an upper molded package including an upper substrate in inverted orientation onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.
Inventors
- 👤 Marcos Karnezos
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:20
CPC Classifications
H; H10; H10W; H10W90/00; H10W40/00; H10W40/10; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W40/70; H10W40/77; H10W40/778; H10W42/00; H10W42/20; H10W70/00; H10W70/60; H10W70/611; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W74/121; H10W74/15; H10W90/401; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5438; H10W72/551; H10W72/851; H10W72/853; H10W72/856; H10W72/865; H10W72/874; H10W72/877; H10W72/884; H10W72/90; H10W72/951; H10W72/952; H10W74/127; H10W90/20; H10W90/22; H10W90/231; H10W90/288; H10W90/701; H10W90/721; H10W90/722; H10W90/724; H10W90/731; H10W90/732; H10W90/734; H10W90/751; H10W90/752; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
60 words
A multipackage module having a second package inverted and stacked over a first package, each said package comprising a die attached to a substrate, wherein the substrate comprises a dielectric layer and a pattern metal layer, the second package substrate and the first package substrate being interconnected by wire bonding, wherein the first package comprises a ball grid array package.
Claim 2
Dependent Claim
60 words
A multipackage module having a second package inverted and stacked over a first package, each said package comprising a die attached to a substrate, wherein the substrate comprises a dielectric layer and a pattern metal layer, the second package substrate and the first package substrate being interconnected by wire bonding, wherein the first package comprises a ball grid array package.
Claim 3
Dependent Claim
33 words
The multipackage module of claim 1 wherein at least one said package has wire bond interconnect of the die with the substrate, and the said wire bonded package is at least partly encapsulated.
Claim 4
Dependent Claim
21 words
The multipackage module of claim 1 wherein the inverted second package has wire bond interconnect of the die with the substrate.
Claim 5
Dependent Claim
16 words
The multipackage module of claim 3 wherein the inverted second package is at least partially encapsulated.
Claim 6
Dependent Claim
17 words
The multipackage module of claim 1 wherein the inverted second package is a land grid array package.
Claim 7
Dependent Claim
19 words
The multipackage module of claim 1 wherein the second package substrate is a bump chip carrier type package substrate.
Claim 8
Dependent Claim
25 words
The multipackage module of claim 1 , further comprising a heat spreader having a generally planar upper surface exposed at the top of the module.
Claim 9
Dependent Claim
24 words
The multipackage module of claim 7 wherein a planar part of the heat spreader is supported by support members over the first package substrate.
Claim 10
Dependent Claim
26 words
The multipackage module of claim 7 wherein a planar part of the heat spreader is affixed onto an upward facing surface of the inverted second package.
Claim 11
Dependent Claim
19 words
The multipackage module of claim 1 , further comprising an electromagnetic shield for at least one of the packages.
Claim 12
Dependent Claim
16 words
The multipackage module of claim 1 , further comprising an electromagnetic shield for the first package.
Claim 13
Dependent Claim
21 words
The multipackage module of claim 11 wherein the inverted second package is affixed onto an upper surface of the electromagnetic shield.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2009-06-05 | 2009-12-05 | 2010-06-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2013-06-05 | 2013-12-05 | 2014-06-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2017-06-05 | 2017-12-05 | 2018-06-06 | $7700.00 | Window Closed / Lapsed |