US6864566B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Duel die package
Assignee: Samsung Electronics Co Ltd
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Filing: 2002-05-28
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Granted: 2005-03-08
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Expires: 2022-05-28
Abstract
Abstract An improved dual die package is disclosed. The dual die package includes a first lead frame connected to a first semiconductor chip and a second lead frame connected to a second semiconductor chip. The first leads and the second leads are electrically connected to one another using a wirebonding process rather than a thermocompression process thereby allowing conventional packaging equipment to be used when manufacturing a dual die package.
Inventors
- 👤 Ill Heung Choi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:14
CPC Classifications
H; H10; H10W; H10W72/00; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/421; H10W70/442; H10W90/00; H10W90/811; H10W72/071; H10W72/075; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/59; H10W72/851; H10W72/853; H10W72/865; H10W72/90; H10W72/931; H10W72/932; H10W72/934; H10W72/941; H10W72/944; H10W72/9445; H10W72/951; H10W74/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
246 words
A dual die package comprising: a first semiconductor chip having a plurality of first electrode pads located at a center portion of its active surface; a first lead frame having a plurality of first leads, the first leads comprising: first contact portions disposed above the active surface of said first chip; first connection portions stepwise connected to the first contact portions; and connection pads, each protruding from a side surface of a corresponding first connection portion; first bonding wires that electrically connect the first electrode pads to the first contact portions; a second semiconductor chip having a plurality of second electrode pads located at a center portion of its active surface, wherein a back surface of the second semiconductor chip is attached to a back surface of the first semiconductor chip; a second lead frame having a plurality of second leads, the second leads comprising: second contact portions disposed above the active surface of said second chip; and second connection portions stepwise connected to the second contact portions; second bonding wires that electrically connect the second electrode pads to the second contact portions; third bonding wires that electrically connect the connection pads of the first leads to the second connection portions of the second leads; and a package body that encapsulates the first chip, the second chip, the first bonding wires, the second bonding wires, the third bonding wires, the first connection portions of the first leads and the second connection portions of the second leads.
Claim 2
Dependent Claim
246 words
A dual die package comprising: a first semiconductor chip having a plurality of first electrode pads located at a center portion of its active surface; a first lead frame having a plurality of first leads, the first leads comprising: first contact portions disposed above the active surface of said first chip; first connection portions stepwise connected to the first contact portions; and connection pads, each protruding from a side surface of a corresponding first connection portion; first bonding wires that electrically connect the first electrode pads to the first contact portions; a second semiconductor chip having a plurality of second electrode pads located at a center portion of its active surface, wherein a back surface of the second semiconductor chip is attached to a back surface of the first semiconductor chip; a second lead frame having a plurality of second leads, the second leads comprising: second contact portions disposed above the active surface of said second chip; and second connection portions stepwise connected to the second contact portions; second bonding wires that electrically connect the second electrode pads to the second contact portions; third bonding wires that electrically connect the connection pads of the first leads to the second connection portions of the second leads; and a package body that encapsulates the first chip, the second chip, the first bonding wires, the second bonding wires, the third bonding wires, the first connection portions of the first leads and the second connection portions of the second leads.
Claim 3
Dependent Claim
30 words
The dual die package of claim 1 wherein the second lead frame further comprises outer leads, which are integrated with the second connection portions and protrude from the package body.
Claim 4
Dependent Claim
20 words
The dual die package of claim 1 wherein the connection pads and the second connection portions are plated with silver.
Claim 5
Dependent Claim
29 words
The dual die package of claim 1 wherein the connection pads of the first connection portions are electrically connected to the second connection portions of the corresponding second leads.
References Cited (Backward Citations)
JPH04320365A
Cited
JPH0567726A
Cited
US5303120A
Cited
JPH05291486A
Cited
JPH08316403A
Cited
US5804874A
Cited
KR20000005048A
Cited
KR980003411A
Cited
KR19990008522A
Cited
US6252299B1
Cited
US6407333B1
Cited
KR20000035276A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2008-03-07 | 2008-09-06 | 2009-03-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2012-03-07 | 2012-09-06 | 2013-03-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2016-03-07 | 2016-09-06 | 2017-03-08 | $7700.00 | Window Closed / Lapsed |