US6512303B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flip chip adaptor package for bare die
Assignee: Round Rock Research LLC
•
Filing: 2001-07-23
•
Granted: 2003-01-28
•
Expires: 2021-07-23
Abstract
Abstract A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement. The board comprises a printed circuit board including first elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the board and the master board, and second elements, such as minute solder balls, pins, or bond wires, for making electrical contact between the semiconductor die and the board. The board has circuit traces for electrical communication between the board/master board electrical contact elements, and the semiconductor die board electrical contact elements.
Inventors
- 👤 Walter L. Moden
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:15
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/328; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/68; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/111; H10W74/15; H10W90/00; H10W90/701; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H05K2201/00; H05K2201/04; H05K2201/049; H05K2201/10; H05K2201/10431; H05K2201/10439; H05K2201/10477; H05K2203/00; H05K2203/04; H05K2203/0415; H05K2203/049; H05K3/36; H05K3/368; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/071; H10W72/0711; H10W72/072; H10W72/07231; H10W72/07236; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5445; H10W72/851; H10W72/853; H10W72/856; H10W72/865; H10W72/874; H10W72/884; H10W72/90; H10W72/941; H10W72/9415; H10W90/721; H10W90/724; H10W90/751; H10W90/754; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 122
Claim 1
Independent Claim
246 words
A substrate having a plurality of circuits thereon for connecting a bare semiconductor die having a plurality of bond pads on a portion of a surface thereof to another substrate, said substrate using a plurality of bond wires to connect the plurality of bond pads on said bare semiconductor die and the plurality of circuits on said substrate, comprising: a substrate including at least a portion of a printed circuit board having a first die side surface for attaching a portion of the surface having a plurality of bond pads of said bare semiconductor die thereto, a second attachment surface having a plurality of bond pads located thereon for connecting said plurality of bond wires thereto, at least one via extending therethrough for having a portion of said plurality of bond wires extending therethrough, and a plurality of circuit traces having at least one circuit trace connected to at least one bond pad of said plurality of bond pads of said second attachment surface for connecting to said plurality of bond wires for connecting to said plurality of bond pads of said bare semiconductor die and for electrically connecting between said bare semiconductor die and said another substrate; and at least a portion of a plurality of electrical connectors located on the second attachment surface of the substrate for electrically connecting said substrate and said another substrate, the at least a portion of a plurality of electrical connectors for connecting to the plurality of circuit traces.
Claim 2
Dependent Claim
246 words
A substrate having a plurality of circuits thereon for connecting a bare semiconductor die having a plurality of bond pads on a portion of a surface thereof to another substrate, said substrate using a plurality of bond wires to connect the plurality of bond pads on said bare semiconductor die and the plurality of circuits on said substrate, comprising: a substrate including at least a portion of a printed circuit board having a first die side surface for attaching a portion of the surface having a plurality of bond pads of said bare semiconductor die thereto, a second attachment surface having a plurality of bond pads located thereon for connecting said plurality of bond wires thereto, at least one via extending therethrough for having a portion of said plurality of bond wires extending therethrough, and a plurality of circuit traces having at least one circuit trace connected to at least one bond pad of said plurality of bond pads of said second attachment surface for connecting to said plurality of bond wires for connecting to said plurality of bond pads of said bare semiconductor die and for electrically connecting between said bare semiconductor die and said another substrate; and at least a portion of a plurality of electrical connectors located on the second attachment surface of the substrate for electrically connecting said substrate and said another substrate, the at least a portion of a plurality of electrical connectors for connecting to the plurality of circuit traces.
Claim 3
Dependent Claim
18 words
The substrate of claim 1 , wherein the plurality of electrical connectors comprise a plurality of solder balls.
Claim 4
Dependent Claim
17 words
The substrate of claim 1 , wherein the plurality of electrical connectors comprise a plurality of pins.
Claim 5
Dependent Claim
38 words
The substrate of claim 1 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located in the substrate.
Claim 6
Dependent Claim
43 words
The substrate of claim 1 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the second attachment surface of the substrate.
Claim 7
Dependent Claim
51 words
The substrate of claim 1 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the second attachment surface of the substrate and a portion thereof located in the substrate.
Claim 8
Dependent Claim
44 words
The substrate of claim 1 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the first die side surface of the substrate.
Claim 9
Dependent Claim
51 words
The substrate of claims 1 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the first die side surface of the substrate and a portion located in the substrate.
Claim 10
Dependent Claim
14 words
The substrate of claim 1 , where the substrate comprises a printed circuit board.
Claim 11
Dependent Claim
23 words
The substrate of claim 1 , wherein the substrate further includes a plurality of bond pads connected to the plurality of circuit traces.
Claim 12
Dependent Claim
22 words
The substrate of claim 10 , wherein the plurality of bond pads are located on the second attachment surface of the substrate.
Claim 13
Dependent Claim
23 words
The substrate of claim 10 , wherein the plurality of bond pads are located on the first die side surface of the substrate.
Claim 14
Dependent Claim
272 words
A substrate having a plurality of circuits for connecting one or more bare semiconductor die to another substrate, each bare semiconductor die of the one or more bare semiconductor die having a plurality of bond pads on a portion of a surface thereof for connecting to said another substrate, said substrate using a plurality of bond wires for connecting between the plurality of bond pads on said each bare semiconductor die of said one or more bare semiconductor die and said plurality of circuits on said substrate, comprising: a multilayer substrate having a first die side surface for attaching thereto a portion of the surface having a plurality of bond pads of said one or more bare semiconductor die, a second attachment surface having a plurality of bond pads located thereon for connecting said plurality of bond wires thereto, one or more vias extending therethrough for said plurality of bond wires to extend therethrough from said plurality of bond pads of said one or more bare semiconductor die, and a plurality of circuit traces having at least one circuit trace connected to at least one bond pad of said plurality of bond pads of said second attachment surface for connecting said plurality of bond wires connected to said plurality of bond pads of said one or more bare semiconductor die and for electrically connecting between said one or more bare semiconductor die and said another substrate; and a plurality of electrical connectors located on the second attachment surface of the substrate for electrically connecting said substrate and said another substrate, the plurality of electrical connectors connected to the plurality of circuit traces.
Claim 15
Dependent Claim
272 words
A substrate having a plurality of circuits for connecting one or more bare semiconductor die to another substrate, each bare semiconductor die of the one or more bare semiconductor die having a plurality of bond pads on a portion of a surface thereof for connecting to said another substrate, said substrate using a plurality of bond wires for connecting between the plurality of bond pads on said each bare semiconductor die of said one or more bare semiconductor die and said plurality of circuits on said substrate, comprising: a multilayer substrate having a first die side surface for attaching thereto a portion of the surface having a plurality of bond pads of said one or more bare semiconductor die, a second attachment surface having a plurality of bond pads located thereon for connecting said plurality of bond wires thereto, one or more vias extending therethrough for said plurality of bond wires to extend therethrough from said plurality of bond pads of said one or more bare semiconductor die, and a plurality of circuit traces having at least one circuit trace connected to at least one bond pad of said plurality of bond pads of said second attachment surface for connecting said plurality of bond wires connected to said plurality of bond pads of said one or more bare semiconductor die and for electrically connecting between said one or more bare semiconductor die and said another substrate; and a plurality of electrical connectors located on the second attachment surface of the substrate for electrically connecting said substrate and said another substrate, the plurality of electrical connectors connected to the plurality of circuit traces.
Claim 16
Dependent Claim
18 words
The substrate of claim 13 , wherein the plurality of electrical connectors comprise a plurality of solder balls.
Claim 17
Dependent Claim
17 words
The substrate of claim 13 , wherein the plurality of electrical connectors comprise a plurality of pins.
Claim 18
Dependent Claim
38 words
The substrate of claim 13 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located in the substrate.
Claim 19
Dependent Claim
43 words
The substrate of claim 13 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the second attachment surface of the substrate.
Claim 20
Dependent Claim
51 words
The substrate of claim 13 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the second attachment surface of the substrate and a portion thereof located in the substrate.
Claim 21
Dependent Claim
44 words
The substrate of claim 13 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the first die side surface of the substrate.
Claim 22
Dependent Claim
51 words
The substrate of claim 13 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the first die side surface of the substrate and a portion located in the substrate.
Claim 23
Dependent Claim
14 words
The substrate of claim 13 , wherein the substrate comprises a printed circuit board.
Claim 24
Dependent Claim
23 words
The substrate of claim 13 , wherein the substrate further includes a plurality of bond pads connected to the plurality of circuit traces.
Claim 25
Dependent Claim
22 words
The substrate of claim 22 , wherein the plurality of bond pads are located on the second attachment surface of the substrate.
Claim 26
Dependent Claim
267 words
A substrate having a plurality of circuits thereon for connecting a plurality of bare semiconductor die to another substrate, each bare semiconductor of said plurality of bare semiconductor die having a plurality of bond pads on a portion of a surface thereof for connecting to said another substrate, said substrate using a plurality of bond wires for connecting between the plurality of bond pads on said plurality of bare semiconductor die and a plurality of circuits on said substrate, comprising: a substrate having at least one layer, having a first die side surface for attaching thereto a portion of the surface having a plurality of bond pads of said plurality of bare semiconductor die, a second attachment surface having a plurality of bond pads located thereon for connecting of said plurality of bond wires thereto, a plurality of vias extending therethrough for said plurality of bond wires to extend therethrough from said plurality of bond pads of said plurality of bare semiconductor die, and a plurality of circuit traces having at least one circuit trace connected to at least one bond pad of said plurality of bond pads of said second attachment surface for connection to said plurality of bond wires connected to said plurality of bond pads of said plurality of bare semiconductor die and for electrically connecting between said plurality of bare semiconductor die and said another substrate; and a plurality of electrical connectors located on the second attachment surface of the substrate for electrically connecting said substrate and said another substrate, the plurality of electrical connectors for connecting to the plurality of circuit traces.
Claim 27
Dependent Claim
267 words
A substrate having a plurality of circuits thereon for connecting a plurality of bare semiconductor die to another substrate, each bare semiconductor of said plurality of bare semiconductor die having a plurality of bond pads on a portion of a surface thereof for connecting to said another substrate, said substrate using a plurality of bond wires for connecting between the plurality of bond pads on said plurality of bare semiconductor die and a plurality of circuits on said substrate, comprising: a substrate having at least one layer, having a first die side surface for attaching thereto a portion of the surface having a plurality of bond pads of said plurality of bare semiconductor die, a second attachment surface having a plurality of bond pads located thereon for connecting of said plurality of bond wires thereto, a plurality of vias extending therethrough for said plurality of bond wires to extend therethrough from said plurality of bond pads of said plurality of bare semiconductor die, and a plurality of circuit traces having at least one circuit trace connected to at least one bond pad of said plurality of bond pads of said second attachment surface for connection to said plurality of bond wires connected to said plurality of bond pads of said plurality of bare semiconductor die and for electrically connecting between said plurality of bare semiconductor die and said another substrate; and a plurality of electrical connectors located on the second attachment surface of the substrate for electrically connecting said substrate and said another substrate, the plurality of electrical connectors for connecting to the plurality of circuit traces.
Claim 28
Dependent Claim
18 words
The substrate of claim 24 , wherein the plurality of electrical connectors comprise a plurality of solder balls.
Claim 29
Dependent Claim
17 words
The substrate of claim 24 , wherein the plurality of electrical connectors comprise a plurality of pins.
Claim 30
Dependent Claim
38 words
The substrate of claim 24 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located in the substrate.
Claim 31
Dependent Claim
43 words
The substrate of claim 24 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the second attachment surface of the substrate.
Claim 32
Dependent Claim
51 words
The substrate of claim 24 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the second attachment surface of the substrate and a portion thereof located in the substrate.
Claim 33
Dependent Claim
44 words
The substrate of claim 24 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the first die side surface of the substrate.
Claim 34
Dependent Claim
51 words
The substrate of claim 24 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the first die side surface of the substrate and a portion located in the substrate.
Claim 35
Dependent Claim
14 words
The substrate of claim 24 , wherein the substrate comprises a printed circuit board.
Claim 36
Dependent Claim
23 words
The substrate of claim 24 , wherein the substrate further includes a plurality of bond pads connected to the plurality of circuit traces.
Claim 37
Dependent Claim
22 words
The substrate of claim 33 , wherein the plurality of bond pads are located on the second attachment surface of the substrate.
Claim 38
Dependent Claim
188 words
An electrical assembly for connection to a substrate having a plurality of circuits comprising: a bare semiconductor die having a surface having a plurality of bond pads located thereon; a substrate having a die side surface, an attachment surface, a via extending through the substrate from the die side surface to the attachment surface, a plurality of circuit traces, and at least one bond pad connected to at least one circuit trace of said plurality of circuit traces, a portion of the surface having the plurality of bond pads of said bare semiconductor die attached to a portion of the die side surface of the substrate; a plurality of wire bonds for extending through the via extending through the substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connection to the plurality of bond pads of the bare semiconductor die and the plurality of circuit traces; and a plurality of electrical connectors located on the attachment surface of the substrate for electrically connecting the substrate and another substrate, the plurality of electrical connectors connected to the plurality of circuit traces.
Claim 39
Dependent Claim
188 words
An electrical assembly for connection to a substrate having a plurality of circuits comprising: a bare semiconductor die having a surface having a plurality of bond pads located thereon; a substrate having a die side surface, an attachment surface, a via extending through the substrate from the die side surface to the attachment surface, a plurality of circuit traces, and at least one bond pad connected to at least one circuit trace of said plurality of circuit traces, a portion of the surface having the plurality of bond pads of said bare semiconductor die attached to a portion of the die side surface of the substrate; a plurality of wire bonds for extending through the via extending through the substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connection to the plurality of bond pads of the bare semiconductor die and the plurality of circuit traces; and a plurality of electrical connectors located on the attachment surface of the substrate for electrically connecting the substrate and another substrate, the plurality of electrical connectors connected to the plurality of circuit traces.
Claim 40
Dependent Claim
28 words
The electrical assembly of claim 35 , wherein the electrical connection between the attachment surface of the substrate and said another substrate comprises a plurality of solder balls.
Claim 41
Dependent Claim
27 words
The electrical assembly of claim 35 , wherein the electrical connection between the attachment surface of the substrate and said another substrate comprises a plurality of pins.
Claim 42
Dependent Claim
39 words
The electrical assembly of claim 35 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located in the substrate.
Claim 43
Dependent Claim
43 words
The electrical assembly of claim 35 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the attachment surface of the substrate.
Claim 44
Dependent Claim
51 words
The electrical assembly of claim 35 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the attachment surface of the substrate and a portion thereof located in the substrate.
Claim 45
Dependent Claim
44 words
The electrical assembly of claim 35 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the die side surface of the substrate.
Claim 46
Dependent Claim
51 words
The electrical assembly of claim 35 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the die side surface of the substrate and a portion located in the substrate.
Claim 47
Dependent Claim
15 words
The electrical assembly of claim 35 , wherein the substrate comprises a printed circuit board.
Claim 48
Dependent Claim
24 words
The electrical assembly of claim 35 , wherein the substrate further includes a plurality of bond pads connected to the plurality of circuit traces.
Claim 49
Dependent Claim
22 words
The electrical assembly of claim 44 , wherein the plurality of bond pads are located on the attachment surface of the substrate.
Claim 50
Dependent Claim
23 words
The electrical assembly of claim 44 , wherein the plurality of bond pads are located on the die side surface of the substrate.
Claim 51
Dependent Claim
32 words
The electrical assembly of claim 35 , further comprising: a sealant located in a portion of the via in the substrate encasing at least a portion of the plurality of bond wires.
Claim 52
Dependent Claim
67 words
The electrical assembly of claim 35 , further comprising: an adhesive attaching a portion of the surface having a plurality of bond pads of the bare semiconductor die to the die side surface of the substrate having the plurality of bond pads of the bare semiconductor die located in the via extending through the substrate from the die side surface to the attachment surface of the substrate.
Claim 53
Dependent Claim
14 words
The electrical assembly of claim 48 , wherein the adhesive comprises a sealing adhesive.
Claim 54
Dependent Claim
14 words
The electrical assembly of claim 48 , wherein the adhesive comprises an adhesive tape.
Claim 55
Dependent Claim
231 words
An electrical assembly for connection to a substrate having a plurality of circuits comprising: at least two bare semiconductor die, each bare semiconductor die of the at least two bare semiconductor die having a surface having a plurality of bond pads located thereon; a substrate having a die side surface, an attachment surface, at least two vias extending through the substrate from the die side surface to the attachment surface, a plurality of circuit traces, and at least one bond pad connected to at least one circuit trace of said plurality of circuit traces, a portion of the surface having the plurality of bond pads of said each bare semiconductor die of the at least two bare semiconductor die attached to a portion of the die side surface of the substrate; a plurality of wire bonds for extending through each via of the at least two vias extending through the substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connecting the plurality of bond pads of said each bare semiconductor die of the at least two bare semiconductor die and the plurality of circuit traces of the substrate; and a plurality of electrical connectors located on the die side surface of the substrate for electrically connecting the substrate and another substrate, the plurality of electrical connectors connected to the plurality of circuit traces.
Claim 56
Dependent Claim
231 words
An electrical assembly for connection to a substrate having a plurality of circuits comprising: at least two bare semiconductor die, each bare semiconductor die of the at least two bare semiconductor die having a surface having a plurality of bond pads located thereon; a substrate having a die side surface, an attachment surface, at least two vias extending through the substrate from the die side surface to the attachment surface, a plurality of circuit traces, and at least one bond pad connected to at least one circuit trace of said plurality of circuit traces, a portion of the surface having the plurality of bond pads of said each bare semiconductor die of the at least two bare semiconductor die attached to a portion of the die side surface of the substrate; a plurality of wire bonds for extending through each via of the at least two vias extending through the substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connecting the plurality of bond pads of said each bare semiconductor die of the at least two bare semiconductor die and the plurality of circuit traces of the substrate; and a plurality of electrical connectors located on the die side surface of the substrate for electrically connecting the substrate and another substrate, the plurality of electrical connectors connected to the plurality of circuit traces.
Claim 57
Dependent Claim
30 words
The electrical assembly of claim 51 , wherein the plurality of electrical connectors between the attachment surface of the substrate and said another substrate comprises a plurality of solder balls.
Claim 58
Dependent Claim
29 words
The electrical assembly of claim 51 , wherein the plurality of electrical connectors between the attachment surface of the substrate and said another substrate comprises a plurality of pins.
Claim 59
Dependent Claim
39 words
The electrical assembly of claim 51 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located in the substrate.
Claim 60
Dependent Claim
43 words
The electrical assembly of claim 51 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the attachment surface of the substrate.
Claim 61
Dependent Claim
51 words
The electrical assembly of claim 51 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the attachment surface of the substrate and a portion thereof located in the substrate.
Claim 62
Dependent Claim
44 words
The electrical assembly of claim 51 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the die side surface of the substrate.
Claim 63
Dependent Claim
51 words
The electrical assembly of claim 51 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the die side surface of the substrate and a portion located in the substrate.
Claim 64
Dependent Claim
15 words
The electrical assembly of claim 51 , wherein the substrate comprises a printed circuit board.
Claim 65
Dependent Claim
25 words
The electrical assembly of claim 51 , wherein the die substrate further includes a plurality of bond pads connected to the plurality of circuit traces.
Claim 66
Dependent Claim
22 words
The electrical assembly of claim 60 , wherein the plurality of bond pads are located on the attachment surface of the substrate.
Claim 67
Dependent Claim
23 words
The electrical assembly of claim 60 , wherein the plurality of bond pads are located on the die side surface of the substrate.
Claim 68
Dependent Claim
40 words
The electrical assembly of claim 51 , further comprising: a sealant located in a portion of said each via of the at least two vias in the substrate for encasing at least a portion of the plurality of bond wires.
Claim 69
Dependent Claim
88 words
The electrical assembly of claim 51 , further comprising: an adhesive attaching a portion of the surface having a plurality of bond pads of said each bare semiconductor die of the at least two bare semiconductor die to the die side surface of the substrate having the plurality of bond pads of said each bare semiconductor die of the at least two bare semiconductor die located in the at least two vias extending through the substrate from the die side surface to the attachment surface of the substrate.
Claim 70
Dependent Claim
14 words
The electrical assembly of claim 64 , wherein the adhesive comprises a sealing adhesive.
Claim 71
Dependent Claim
14 words
The electrical assembly of claim 64 , wherein the adhesive comprises an adhesive tape.
Claim 72
Dependent Claim
228 words
An electrical assembly for connection to a substrate having a plurality of circuits comprising: a plurality of bare semiconductor die, each bare semiconductor die of said plurality of bare semiconductor die having a surface having a plurality of bond pads located thereon; a substrate having a die side surface; an attachment surface, a plurality of vias extending through the substrate from the die side surface to the attachment surface, a plurality of circuit traces, and at least one bond pad connected to at least one circuit trace of said plurality of circuit traces, a portion of the surface having the plurality of bond pads of said each bare semiconductor die of said plurality of bare semiconductor die for attaching to a portion of the die side surface of the substrate; a plurality of wire bonds extending through each via of the plurality of vias extending through the substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connecting the plurality of bond pads of said each bare semiconductor die of said plurality of bare semiconductor die and the plurality of circuit traces of the substrate; and a plurality of electrical connectors located on the die side surface of the substrate for electrically connecting the substrate and another substrate, the plurality of electrical connectors for connection to the plurality of circuit traces.
Claim 73
Dependent Claim
228 words
An electrical assembly for connection to a substrate having a plurality of circuits comprising: a plurality of bare semiconductor die, each bare semiconductor die of said plurality of bare semiconductor die having a surface having a plurality of bond pads located thereon; a substrate having a die side surface; an attachment surface, a plurality of vias extending through the substrate from the die side surface to the attachment surface, a plurality of circuit traces, and at least one bond pad connected to at least one circuit trace of said plurality of circuit traces, a portion of the surface having the plurality of bond pads of said each bare semiconductor die of said plurality of bare semiconductor die for attaching to a portion of the die side surface of the substrate; a plurality of wire bonds extending through each via of the plurality of vias extending through the substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connecting the plurality of bond pads of said each bare semiconductor die of said plurality of bare semiconductor die and the plurality of circuit traces of the substrate; and a plurality of electrical connectors located on the die side surface of the substrate for electrically connecting the substrate and another substrate, the plurality of electrical connectors for connection to the plurality of circuit traces.
Claim 74
Dependent Claim
30 words
The electrical assembly of claim 67 , wherein the plurality of electrical connectors between the attachment surface of the substrate and said another substrate comprises a plurality of solder balls.
Claim 75
Dependent Claim
29 words
The electrical assembly of claim 67 , wherein the plurality of electrical connectors between the attachment surface of the substrate and said another substrate comprises a plurality of pins.
Claim 76
Dependent Claim
39 words
The electrical assembly of claim 67 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located in the substrate.
Claim 77
Dependent Claim
43 words
The electrical assembly of claim 67 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the attachment surface of the substrate.
Claim 78
Dependent Claim
51 words
The electrical assembly of claim 67 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the attachment surface of the substrate and a portion thereof located in the substrate.
Claim 79
Dependent Claim
44 words
The electrical assembly of claim 67 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the die side surface of the substrate.
Claim 80
Dependent Claim
51 words
The electrical assembly of claim 67 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the die side surface of the substrate and a portion located in the substrate.
Claim 81
Dependent Claim
15 words
The electrical assembly of claim 67 , wherein the substrate comprises a printed circuit board.
Claim 82
Dependent Claim
24 words
The electrical assembly of claim 67 , wherein the substrate further includes a plurality of bond pads connected to the plurality of circuit traces.
Claim 83
Dependent Claim
22 words
The electrical assembly of claim 76 , wherein the plurality of bond pads are located on the attachment surface of the substrate.
Claim 84
Dependent Claim
23 words
The electrical assembly of claim 76 , wherein the plurality of bond pads are located on the die side surface of the substrate.
Claim 85
Dependent Claim
39 words
The electrical assembly of claim 67 , further comprising: a sealant located in a portion of said each via of the plurality of vias in the substrate for encasing at least a portion of the plurality of bond wires.
Claim 86
Dependent Claim
85 words
The electrical assembly of claim 67 , further comprising: an adhesive attaching a portion of the surface having a plurality of bond pads of said each bare semiconductor die of said plurality of bare semiconductor die to the die side surface of the substrate having the plurality of bond pads of said each bare semiconductor die of said plurality of bare semiconductor die located in the plurality of vias extending through the substrate from the die side surface to the attachment surface of the substrate.
Claim 87
Dependent Claim
14 words
The electrical assembly of claim 80 , wherein the adhesive comprises a sealing adhesive.
Claim 88
Dependent Claim
14 words
The electrical assembly of claim 80 , wherein the adhesive comprises an adhesive tape.
Claim 89
Dependent Claim
193 words
An electrical assembly for connection to a substrate having a plurality of circuits comprising: a substrate; a bare semiconductor die having a surface having a plurality of bond pads located thereon; a substrate having a die side surface, an attachment surface, a via extending through the substrate from the die side surface to the attachment surface, a plurality of circuit traces, and at least one bond pad connected to at least one circuit trace of said plurality of circuit traces, a portion of the surface having the plurality of bond pads of said bare semiconductor die for attaching to a portion of the die side surface of the substrate; a plurality of wire bonds extending through the via extending through the substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connection to the plurality of bond pads of the bare semiconductor die and the plurality of circuit traces; and a plurality of electrical connectors located on the attachment surface of the substrate electrically connecting the substrate and the substrate having a via, the plurality of electrical connectors for connection to the plurality of circuit traces.
Claim 90
Dependent Claim
193 words
An electrical assembly for connection to a substrate having a plurality of circuits comprising: a substrate; a bare semiconductor die having a surface having a plurality of bond pads located thereon; a substrate having a die side surface, an attachment surface, a via extending through the substrate from the die side surface to the attachment surface, a plurality of circuit traces, and at least one bond pad connected to at least one circuit trace of said plurality of circuit traces, a portion of the surface having the plurality of bond pads of said bare semiconductor die for attaching to a portion of the die side surface of the substrate; a plurality of wire bonds extending through the via extending through the substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connection to the plurality of bond pads of the bare semiconductor die and the plurality of circuit traces; and a plurality of electrical connectors located on the attachment surface of the substrate electrically connecting the substrate and the substrate having a via, the plurality of electrical connectors for connection to the plurality of circuit traces.
Claim 91
Dependent Claim
27 words
The electrical assembly of claim 83 , wherein the electrical connection between the attachment surface of the substrate and said substrate comprises a plurality of solder balls.
Claim 92
Dependent Claim
26 words
The electrical assembly of claim 83 , wherein the electrical connection between the attachment surface of the substrate and said substrate comprises a plurality of pins.
Claim 93
Dependent Claim
39 words
The electrical assembly of claim 83 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located in the substrate.
Claim 94
Dependent Claim
43 words
The electrical assembly of claim 83 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the attachment surface of the substrate.
Claim 95
Dependent Claim
51 words
The electrical assembly of claim 83 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the attachment surface of the substrate and a portion thereof located in the substrate.
Claim 96
Dependent Claim
44 words
The electrical assembly of claim 83 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the die side surface of the substrate.
Claim 97
Dependent Claim
51 words
The electrical assembly of claim 83 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the die side surface of the substrate and a portion located in the substrate.
Claim 98
Dependent Claim
15 words
The electrical assembly of claim 83 , wherein the substrate comprises a printed circuit board.
Claim 99
Dependent Claim
24 words
The electrical assembly of claim 83 , wherein the substrate further includes a plurality of bond pads connected to the plurality of circuit traces.
Claim 100
Dependent Claim
22 words
The electrical assembly of claim 92 , wherein the plurality of bond pads are located on the attachment surface of the substrate.
Claim 101
Dependent Claim
23 words
The electrical assembly of claim 92 , wherein the plurality of bond pads are located on the die side surface of the substrate.
Claim 102
Dependent Claim
33 words
The electrical assembly of claim 83 , further comprising: a sealant located in a portion of the via in the substrate for encasing at least a portion of the plurality of bond wires.
Claim 103
Dependent Claim
67 words
The electrical assembly of claim 83 , further comprising: an adhesive attaching a portion of the surface having a plurality of bond pads of the bare semiconductor die to the die side surface of the substrate having the plurality of bond pads of the bare semiconductor die located in the via extending through the substrate from the die side surface to the attachment surface of the substrate.
Claim 104
Dependent Claim
14 words
The electrical assembly of claim 96 , wherein the adhesive comprises a sealing adhesive.
Claim 105
Dependent Claim
14 words
The electrical assembly of claim 96 , wherein the adhesive comprises an adhesive tape.
Claim 106
Dependent Claim
230 words
An electrical assembly for connection to a substrate having a plurality of circuits comprising: a substrate; a plurality of bare semiconductor die, each bare semiconductor die of said plurality of bare semiconductor die having a surface having a plurality of bond pads located thereon; a substrate having a die side surface, an attachment surface, a plurality of vias extending through the substrate from the die side surface to the attachment surface, a plurality of circuit traces, and at least one bond pad connected to at least one circuit of said plurality of circuits, a portion of the surface having the plurality of bond pads of said each bare semiconductor die of said plurality of bare semiconductor die for attaching to a portion of the die side surface of the substrate; a plurality of wire bonds extending through each via of the plurality of vias extending through the substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connecting the plurality of bond pads of said each bare semiconductor die of said plurality of bare semiconductor die and the plurality of circuit traces of the substrate; and a plurality of electrical connectors located on the die side surface of the substrate for electrically connecting the substrate and the substrate having a via, the plurality of electrical connectors connected to the plurality of circuit traces.
Claim 107
Dependent Claim
230 words
An electrical assembly for connection to a substrate having a plurality of circuits comprising: a substrate; a plurality of bare semiconductor die, each bare semiconductor die of said plurality of bare semiconductor die having a surface having a plurality of bond pads located thereon; a substrate having a die side surface, an attachment surface, a plurality of vias extending through the substrate from the die side surface to the attachment surface, a plurality of circuit traces, and at least one bond pad connected to at least one circuit of said plurality of circuits, a portion of the surface having the plurality of bond pads of said each bare semiconductor die of said plurality of bare semiconductor die for attaching to a portion of the die side surface of the substrate; a plurality of wire bonds extending through each via of the plurality of vias extending through the substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds for connecting the plurality of bond pads of said each bare semiconductor die of said plurality of bare semiconductor die and the plurality of circuit traces of the substrate; and a plurality of electrical connectors located on the die side surface of the substrate for electrically connecting the substrate and the substrate having a via, the plurality of electrical connectors connected to the plurality of circuit traces.
Claim 108
Dependent Claim
29 words
The electrical assembly of claim 99 , wherein the plurality of electrical connectors between the attachment surface of the substrate and said substrate comprises a plurality of solder balls.
Claim 109
Dependent Claim
28 words
The electrical assembly of claim 99 , wherein the plurality of electrical connectors between the attachment surface of the substrate and said substrate comprises a plurality of pins.
Claim 110
Dependent Claim
39 words
The electrical assembly of claim 99 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located in the substrate.
Claim 111
Dependent Claim
43 words
The electrical assembly of claim 99 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the attachment surface of the substrate.
Claim 112
Dependent Claim
51 words
The electrical assembly of claim 99 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the attachment surface of the substrate and a portion thereof located in the substrate.
Claim 113
Dependent Claim
44 words
The electrical assembly of claim 99 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the die side surface of the substrate.
Claim 114
Dependent Claim
51 words
The electrical assembly of claim 99 , wherein the plurality of circuit traces comprise a plurality of circuit traces having at least one circuit trace of the plurality of circuit traces having a portion thereof located on the die side surface of the substrate and a portion located in the substrate.
Claim 115
Dependent Claim
15 words
The electrical assembly of claim 99 , wherein the substrate comprises a printed circuit board.
Claim 116
Dependent Claim
25 words
The electrical assembly of claim 99 , wherein the die substrate further includes a plurality of bond pads connected to the plurality of circuit traces.
Claim 117
Dependent Claim
22 words
The electrical assembly of claim 108 , wherein the plurality of bond pads are located on the attachment surface of the substrate.
Claim 118
Dependent Claim
23 words
The electrical assembly of claim 108 , wherein the plurality of bond pads are located on the die side surface of the substrate.
Claim 119
Dependent Claim
39 words
The electrical assembly of claim 99 , further comprising: a sealant located in a portion of said each via of the plurality of vias in the die substrate encasing at least a portion of the plurality of bond wires.
Claim 120
Dependent Claim
86 words
The electrical assembly of claim 99 , further comprising: an adhesive attaching a portion of the surface having a plurality of bond pads of said each bare semiconductor die of said plurality of bare semiconductor die to the die side surface of the substrate having the plurality of bond pads of said each bare semiconductor die of said plurality of bare semiconductor die located in the plurality of vias extending through the substrate from the die side surface to a second attachment surface of the substrate.
Claim 121
Dependent Claim
14 words
The electrical assembly of claim 112 , wherein the adhesive comprises a sealing adhesive.
Claim 122
Dependent Claim
14 words
The electrical assembly of claim 112 , wherein the adhesive comprises an adhesive tape.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-01-27 | 2006-07-29 | 2007-01-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-01-27 | 2010-07-29 | 2011-01-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-01-27 | 2014-07-29 | 2015-01-28 | $7700.00 | Window Closed / Lapsed |