US5486723A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Packaged integrated circuit add-on card
Assignee: Super Talent Electronics Inc
•
Filing: 1994-11-07
•
Granted: 1996-01-23
•
Expires: 2014-11-07
Abstract
Abstract An add-on card which has a flat surface on the top side on which a plastic quad flat pack integrated circuit packaged integrated circuit can be soldered upon. The other side of the add-on card has downwardly protruding pins that can plug into a pin grid array integrated circuit socket. A method of manufacturing a add-on card whereby bonding pads are disposed on one side of the add-on card and pins are disposed on the other side of the add-on card.
Inventors
- 👤 Abraham C. Ma
- 👤 Paul Y. J. Hsueh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 18:30
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H05K7/00; H05K7/02; H05K7/10; H05K7/1015; H05K7/1023; H05K1/0201; H05K1/0203; H05K1/0272; H05K1/18; H05K1/181; H05K2201/00; H05K2201/04; H05K2201/049; H05K2201/09; H05K2201/09009; H05K2201/09072; H05K2201/10; H05K2201/10227; H05K2201/10295; H05K2201/10303; H05K2201/1031; H05K2201/10318; H05K2201/10325; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K2201/10704; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/36; H05K3/368
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
154 words
An add-on card which may be used to connect a land gate array packaged integrated circuit to an integrated circuit socket comprising: a board having a bonding surface and a pin surface, said board having a first board layer with containing said bonding surface and a second board layer containing said pin surface; an array of rows and columns of mounting pads disposed on said bonding surface of said board, said plurality of mounting pads having greater surface area than solder points on the land gate array packaged integrated circuit that will be bonded thereto; and a plurality of pins fastened to said pin surface of said circuit board, said plurality of pins arranged so that said plurality of pins fit into a pin grid array socket, each of said plurality of pins electrically connected to said one of said mounting pads via circuitries between said first board layer and said second board layer.
Claim 2
Dependent Claim
154 words
An add-on card which may be used to connect a land gate array packaged integrated circuit to an integrated circuit socket comprising: a board having a bonding surface and a pin surface, said board having a first board layer with containing said bonding surface and a second board layer containing said pin surface; an array of rows and columns of mounting pads disposed on said bonding surface of said board, said plurality of mounting pads having greater surface area than solder points on the land gate array packaged integrated circuit that will be bonded thereto; and a plurality of pins fastened to said pin surface of said circuit board, said plurality of pins arranged so that said plurality of pins fit into a pin grid array socket, each of said plurality of pins electrically connected to said one of said mounting pads via circuitries between said first board layer and said second board layer.
Claim 3
Dependent Claim
22 words
The add-on card of claim 1 wherein said first board layer and said second board layer are comprised of a fiberglass material.
Claim 4
Dependent Claim
56 words
The add-on card of claim 2 further comprising a first and second copper area, said first copper area disposed on said bonding surface of said first board layer and said second copper area disposed on said pin surface of said second board layer, said first and second copper surfaces in electrical communication with a grounding pin.
Claim 5
Dependent Claim
183 words
An add-on card which may by used to connect a flat pack packaged integrated circuit to an integrated circuit socket comprising: a board having a bonding surface and a pin surface, said board having a first board layer with containing said bonding surface and a second board layer containing said pin surface, said board further comprising a plurality of convection cooling vents passing through said first board layer and said second board layer thereby forming said convection cooling vents; means for creating a centering force that centers leads of a flat pack packaged integrated circuit onto mounting pads arranged on said bonding surface of said first board layer, said plurality of convection cooling vents placed so as to be bounded by said mounting pads; and a plurality of pins fastened to said pin surface of said circuit board, said plurality of pins arranged so that said plurality of pins fit into a pin grid array socket, each of said plurality of pins electrically connected to said one of said mounting pads via circuitries between said first board layer and said second board layer.
Claim 6
Dependent Claim
183 words
An add-on card which may by used to connect a flat pack packaged integrated circuit to an integrated circuit socket comprising: a board having a bonding surface and a pin surface, said board having a first board layer with containing said bonding surface and a second board layer containing said pin surface, said board further comprising a plurality of convection cooling vents passing through said first board layer and said second board layer thereby forming said convection cooling vents; means for creating a centering force that centers leads of a flat pack packaged integrated circuit onto mounting pads arranged on said bonding surface of said first board layer, said plurality of convection cooling vents placed so as to be bounded by said mounting pads; and a plurality of pins fastened to said pin surface of said circuit board, said plurality of pins arranged so that said plurality of pins fit into a pin grid array socket, each of said plurality of pins electrically connected to said one of said mounting pads via circuitries between said first board layer and said second board layer.
Claim 7
Dependent Claim
24 words
The add-on card of claim 4 wherein said mounting pads comprise rows of centering pads, said rows centering pads bound by corner alignment pads.
Claim 8
Dependent Claim
23 words
A. The add-on card of claim 4 wherein said first board layer and said second board layer are comprised of a fiberglass material.
Claim 9
Dependent Claim
56 words
The add-on card of claim 4 further comprising a first and second copper area, said first copper area disposed on said bonding surface of said first board surface and said second copper area disposed on said pin surface of said second board surface, said first and second copper surfaces in electrical communication with a grounding pin.
Claim 10
Dependent Claim
74 words
The add-on card of claim 4, wherein said centering force creating means comprises centering pads and corner alignment pads, said centering pads being arranged in a rectangular array and said corner alignment pads placed adjacent to each row of said array of said centering pads, said centering pads having length and width wherein said length is longer than bonding portions of leads of the flat pack packaged integrated circuit that will be bonded thereon.
Claim 11
Dependent Claim
32 words
The add-on card of claim 8 wherein said width of said centering pads is greater than bonding portions of leads of the flat pack packaged integrated circuit that will be bonded thereon.
Claim 12
Dependent Claim
42 words
The add-on card of claim 9 wherein said width of said centering pad is thirty percent wider and said length is twenty percent longer than said bonding portion of leads of the flat pack packaged integrated circuit that will be bonded thereon.
Claim 13
Dependent Claim
20 words
The add-on card of claim 8 wherein said corner alignment pads have greater width and length than said centering pads.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-01-22 | 1999-07-24 | 2000-01-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-01-22 | 2003-07-24 | 2004-01-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-01-22 | 2007-07-24 | 2008-01-23 | $7700.00 | Window Closed / Lapsed |