US6838761B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield
Assignee: Stats Chippac Pte Ltd
•
Filing: 2003-08-02
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Granted: 2005-01-04
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Expires: 2023-08-02
Abstract
Abstract A semiconductor multi-package module having stacked lower and upper packages, each package including a die attached to a substrate, in which the upper and lower substrates are interconnected by wire bonding. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die, affixing an upper molded package including an upper substrate onto the upper surface of the lower package, and forming wire bond z-interconnects between the upper and lower substrates.
Inventors
- 👤 Marcos Karnezos
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:00
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/401; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W42/00; H10W42/20; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W70/00; H10W70/60; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W74/15; H10W90/20; H10W90/22; H10W90/288; H10W90/701; H10W90/721; H10W90/722; H10W90/724; H10W90/731; H10W90/732; H10W90/734; H10W90/751; H10W90/752; H10W90/754
Claims Analysis
Total Claims: 34
Claim 1
Independent Claim
33 words
A multi-package module, having a second package stacked over a first package, the stacked packages being electronically interconnected by wire bonds, wherein at least one said package is provided with an electrical shield.
Claim 2
Dependent Claim
33 words
A multi-package module, having a second package stacked over a first package, the stacked packages being electronically interconnected by wire bonds, wherein at least one said package is provided with an electrical shield.
Claim 3
Dependent Claim
17 words
The multi-package module of claim 1 wherein the first said package is provided with an electrical shield.
Claim 4
Dependent Claim
18 words
The multi-package module of claim 1 wherein the electrical shield is configured to serve as a heat spreader.
Claim 5
Dependent Claim
39 words
The multi-package module of claim 1 wherein the package that is provided with an electrical shield includes an RF die, and the shield serves to limit electromagnetic interference between the RF die and other die in the multi-package module.
Claim 6
Dependent Claim
25 words
The multi-package module of claim 1 wherein the first package is a flip-chip ball grid array package having a flip chip in a die-up configuration.
Claim 7
Dependent Claim
25 words
The multi-package module of claim 1 wherein the first package is a flip-chip ball grid array package having a flip chip in a die-down configuration.
Claim 8
Dependent Claim
15 words
The multi-package module of claim 1 where the second package is a stacked die package.
Claim 9
Dependent Claim
20 words
The multi-package module of claim 7 wherein adjacent stacked die in the stacked die package are separated by a spacer.
Claim 10
Dependent Claim
34 words
The multi-package module of claim 1 , the first package comprising a first package substrate and the second package compriseing a second package substrate, wherein the firt package substrate includes an embedded ground plane.
Claim 11
Dependent Claim
17 words
The multi-package module of claim 9 , the ground plane being configured to serve for heat dissipation.
Claim 12
Dependent Claim
18 words
The multi-package module of claim 9 , the ground plane being configured to serve as an electrical shield.
Claim 13
Independent Claim
52 words
A method for making a multi-package module including a second package stacked over a first package, comprising providing a first package having a shield, providing a second package, stacking the second package onto a generally planar upper surface of the shield, and electrically interconnecting the first and second packages by wire bonds.
Claim 14
Independent Claim
52 words
A method for making a multi-package module including a second package stacked over a first package, comprising providing a first package having a shield, providing a second package, stacking the second package onto a generally planar upper surface of the shield, and electrically interconnecting the first and second packages by wire bonds.
Claim 15
Dependent Claim
17 words
The method of claim 12 wherein providing the first package comprises providing an unsingulated strip of packages.
Claim 16
Dependent Claim
36 words
The method of claim 12 wherein stacking the second package onto the upper surface of the shield comprises applying an adhesive onto an upper surface of the shield and placing the second package onto the adhesive.
Claim 17
Dependent Claim
18 words
The method of claim 14 wherein the adhesive is a curable adhesive, and further comprising curing the adhesive.
Claim 18
Dependent Claim
28 words
The method of claim 12 wherein providing the first package comprises testing packages for a performance and reliability requirement and selecting the first package as meeting the requirement.
Claim 19
Dependent Claim
28 words
The method of claim 12 wherein providing the second package comprises testing packages for a performance and reliability requirement and selecting the second package as meeting the requirement.
Claim 20
Dependent Claim
17 words
The method of claim 12 , further comprising attaching second-level interconnect balls onto the first package substrate.
Claim 21
Dependent Claim
17 words
The method of claim 12 , further comprising encapsulating the stacked packages in a multi-package module molding.
Claim 22
Dependent Claim
17 words
The method of claim 12 wherein providing the first package comprises providing a ball grid array package.
Claim 23
Dependent Claim
16 words
The method of claim 12 , further comprising providing the multi-package module with a heat spreader.
Claim 24
Dependent Claim
32 words
The method of claim 21 , wherein providing a heat spreader comprises carrying out a drop-in mold operation, the heat spreader being placed into a mold prior to forming a module molding.
Claim 25
Dependent Claim
31 words
The method of claim 21 , wherein providing a heat spreader comprises affixing a generally planar portion of a heat spreader onto a generally planar upper surface of the second package.
Claim 26
Dependent Claim
19 words
The method of claim 12 wherein providing the first package comprises providing a flip chip ball grid array package.
Claim 27
Dependent Claim
23 words
The method of claim 12 wherein providing the first package having a shield comprises providing a die-down flip chip ball grid array package.
Claim 28
Dependent Claim
23 words
The method of claim 12 wherein providing the first package having a shield comprises providing a die-up flip chip ball grid array package.
Claim 29
Dependent Claim
33 words
The method of claim 25 wherein providing a die-down flip chip ball grid array package having a shield comprises providing a package having a shield including a generally planar part over the die.
Claim 30
Dependent Claim
33 words
The method of claim 26 wherein providing a die-up flip chip ball grid array package having a shield comprises providing a package having a shield including a generally planar part beneath the die.
Claim 31
Dependent Claim
37 words
A mobile device comprising a multi-package module having a second package stacked over a first package, the stacked packages being electronically interconnected by wire bonds, wherein at least one said package is provided with an electrical shield.
Claim 32
Dependent Claim
37 words
A mobile device comprising a multi-package module having a second package stacked over a first package, the stacked packages being electronically interconnected by wire bonds, wherein at least one said package is provided with an electrical shield.
Claim 33
Dependent Claim
36 words
A computer comprising a multi-package module having a second package stacked over a first package, the stacked packages being electronically interconnected by wire bonds, wherein at least one said package is provided with an electrical shield.
Claim 34
Dependent Claim
36 words
A computer comprising a multi-package module having a second package stacked over a first package, the stacked packages being electronically interconnected by wire bonds, wherein at least one said package is provided with an electrical shield.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2008-01-04 | 2008-07-05 | 2009-01-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2012-01-04 | 2012-07-05 | 2013-01-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2016-01-04 | 2016-07-05 | 2017-01-04 | $7700.00 | Window Closed / Lapsed |