Chip package with grease heat sink

Claim 2

An integrated circuit (IC) chip package, comprising: a substrate with an IC chip mounted thereon, wherein the IC chip has an active surface; a grease in contact with the active surface of the IC chip; and a container disposed upon the substrate, wherein the grease is enclosed within the container and the substrate, and wherein the container is in contact with the active surface of the IC chip.

Claim 3

An IC chip package as defined in claim 1 , wherein the IC chip is a flip chip on a flex substrate.

Claim 4

An IC chip package as defined in claim 1 , wherein: the IC chip is a flip chip; and the substrate is a flex substrate.

Claim 5

An IC chip package as defined in claim 3 , wherein the container comprises a dam structure that secures the container to the substrate.

Claim 6

An IC chip package as defined in claim 1 , wherein the grease has a thermal conductivity in a range from about 2 Watts/m·K to about 5 Watts/m·K.

Claim 7

An IC chip package as defined in claim 1 , wherein the grease has a dielectric constant in a range from less than about 6 to about 9.

Claim 8

An IC chip package as defined in claim 1 , wherein the grease has a melting point in a range from about 190° C. to about 220° C.

Claim 9

An IC chip package as defined in claim 1 , wherein the grease has a weight loss at about 100° C. after 30 days of less than about 0.15%.

Claim 10

An integrated circuit (IC) chip package with IC chip elements having an IC chip with an active surface, the active surface having extending therefrom an electrical connector in electrical communication with the IC chip, the IC chip being mounted upon a substrate, the IC chip package comprising: a grease in contact with the active surface of the IC chip; and a container disposed upon the substrate and enclosing a volume external to the IC chip elements, wherein the grease is enclosed within the container and the substrate, and wherein the grease fills the volume enclosed by the container and the container is in contact with the active surface of the IC chip.

Claim 11

An integrated circuit (IC) chip package with IC chip elements having an IC chip with an active surface, the active surface having extending therefrom an electrical connector in electrical communication with the IC chip, the IC chip being mounted upon a substrate, the IC chip package comprising: a grease in contact with the active surface of the IC chip; and a container disposed upon the substrate and enclosing a volume external to the IC chip elements, wherein the grease is enclosed within the container and the substrate, and wherein the grease fills the volume enclosed by the container and the container is in contact with the active surface of the IC chip.

Claim 12

An IC chip package as defined in claim 9 , wherein the grease is in contact with a dam structure.

Claim 13

An IC chip package as defined in claim 9 , wherein the grease contacts the container.

Claim 14

An IC chip package as defined in claim 9 , wherein the grease has a thermal conductivity in a range from about 2 Watts/m·K to about 5 Watts/m·K.

Claim 15

An IC chip package as defined in claim 9 , wherein the grease has a dielectric constant in a range from less than about 6 to about 9.

Claim 16

An IC chip package as defined in claim 9 , wherein the grease has a melting point in a range from about 190° C. to about 220° C.

Claim 17

An IC chip package as defined in claim 9 , wherein the grease has a weight loss at about 100° C. after 30 days of less than about 0.15%.

Claim 18

An IC chip package as defined in claim 9 , wherein the container makes contact with the substrate to enclose the active surface of the IC chip.

Claim 19

An IC chip package as defined in claim 9 , wherein the IC chip is a flip chip on a flex substrate.

Claim 20

An IC chip package as defined in claim 9 , wherein: the IC chip is a flip chip; and the substrate is a flex substrate.

Claim 21

An IC chip package as defined in claim 18 , wherein the container is a dam structure that secures the container to the substrate.

Claim 22

An IC chip package with IC chip elements having an IC chip with an active surface, the active surface having an electrical connector extending therefrom in electrical communication with the IC chip, the IC chip being mounted upon a substrate, the IC chip package comprising: a grease in contact with the active surface of the IC chip, the grease having: a thermal conductivity in a range from about 2 Watts/m·K to about 5 Watts/m·K; a dielectric constant in a range from less than about 6 to about 9; and a melting point in a range from about 190° C. to about 220° C.; and a container disposed upon the substrate, the container enclosing a volume external to the IC chip elements, wherein the grease is enclosed within the container and the substrate, and the grease fills the volume enclosed by the container and the container is in contact with the active surface of the IC chip.

Claim 23

An IC chip package with IC chip elements having an IC chip with an active surface, the active surface having an electrical connector extending therefrom in electrical communication with the IC chip, the IC chip being mounted upon a substrate, the IC chip package comprising: a grease in contact with the active surface of the IC chip, the grease having: a thermal conductivity in a range from about 2 Watts/m·K to about 5 Watts/m·K; a dielectric constant in a range from less than about 6 to about 9; and a melting point in a range from about 190° C. to about 220° C.; and a container disposed upon the substrate, the container enclosing a volume external to the IC chip elements, wherein the grease is enclosed within the container and the substrate, and the grease fills the volume enclosed by the container and the container is in contact with the active surface of the IC chip.