US5907189A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Conformal diamond coating for thermal improvement of electronic packages
Assignee: Bell Semiconductor LLC
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Filing: 1997-05-29
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Granted: 1999-05-25
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Expires: 2017-05-29
Abstract
Abstract One aspect of the invention relates to a method for providing a semiconductor package with a thermally conductive coating, the semiconductor package including a package substrate having a plurality of electrically conductive traces formed thereon, an upper surface and a lower surface, the lower surface having a plurality of contacts for providing electrical connection between the conductive traces formed on the package substrate and a plurality of conductive traces formed on a printed circuit board, and a semiconductor die mounted to the upper surface to the package substrate, the semiconductor die having a plurality of bond pads formed thereon which are electrically connected to the conductive traces formed on the package substrate. In one embodiment, the method includes the steps of depositing a coating on the upper surface of the package substrate and the coating includes a diamond film or diamond particles.
Inventors
- 👤 Atila Mertol
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:03
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/25; H10W40/254; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W72/50; H10W72/551; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
138 words
A semiconductor package, comprising: a package substrate having a plurality of electrically conductive traces formed thereon, an upper surface and a lower surface, the lower surface having a plurality of contacts for providing electrical connection between the conductive traces formed on the package substrate and a plurality of conductive traces formed on a printed circuit board; a semiconductor die with an upper surface and a lower surface, the lower surface of the semiconductor die mounted to the upper surface of the package substrate, the semiconductor die having a plurality of bond pads formed thereon which are electrically connected to the conductive traces formed on the package substrate; a coating disposed on at least part of the upper surface of the package substrate and at least part of the upper surface of the semiconductor die, the coating comprising diamond.
Claim 2
Dependent Claim
138 words
A semiconductor package, comprising: a package substrate having a plurality of electrically conductive traces formed thereon, an upper surface and a lower surface, the lower surface having a plurality of contacts for providing electrical connection between the conductive traces formed on the package substrate and a plurality of conductive traces formed on a printed circuit board; a semiconductor die with an upper surface and a lower surface, the lower surface of the semiconductor die mounted to the upper surface of the package substrate, the semiconductor die having a plurality of bond pads formed thereon which are electrically connected to the conductive traces formed on the package substrate; a coating disposed on at least part of the upper surface of the package substrate and at least part of the upper surface of the semiconductor die, the coating comprising diamond.
Claim 3
Dependent Claim
20 words
A semiconductor package as in claim 1 wherein the coating is deposited on the package substrate by chemical vapor deposition.
Claim 4
Dependent Claim
15 words
A semiconductor package as in claim 1 wherein the coating comprises a preformed diamond structure.
Claim 5
Dependent Claim
167 words
A semiconductor package, comprising: a package substrate having a plurality of electrically conductive traces formed thereon, an upper surface and a lower surface, the lower surface having a plurality of contacts for providing electrical connection between the conductive traces formed on the package substrate and a plurality of conductive traces formed on a printed circuit board; a semiconductor die with an upper surface and a lower surface, the lower surface of the semiconductor die mounted to the upper surface of the package substrate, the semiconductor die having a plurality of bond pads formed thereon which are electrically connected to the conductive traces formed on the package substrate; a coating disposed on at least part of the upper surface of the package substrate and at least part of the upper surface of the semiconductor die, the coating comprising diamond; a heat sink for transferring heat away from the semiconductor die, the heat sink being attached to the diamond coating disposed on the upper surface of the package substrate.
Claim 6
Dependent Claim
167 words
A semiconductor package, comprising: a package substrate having a plurality of electrically conductive traces formed thereon, an upper surface and a lower surface, the lower surface having a plurality of contacts for providing electrical connection between the conductive traces formed on the package substrate and a plurality of conductive traces formed on a printed circuit board; a semiconductor die with an upper surface and a lower surface, the lower surface of the semiconductor die mounted to the upper surface of the package substrate, the semiconductor die having a plurality of bond pads formed thereon which are electrically connected to the conductive traces formed on the package substrate; a coating disposed on at least part of the upper surface of the package substrate and at least part of the upper surface of the semiconductor die, the coating comprising diamond; a heat sink for transferring heat away from the semiconductor die, the heat sink being attached to the diamond coating disposed on the upper surface of the package substrate.
Claim 7
Dependent Claim
15 words
A semiconductor package as in claim 4 wherein the coating is a chemical vapor deposition.
Claim 8
Dependent Claim
15 words
A semiconductor package as in claim 4 wherein the coating comprises a preformed diamond structure.
Claim 9
Dependent Claim
17 words
A semiconductor package as in claim 4 wherein the heat sink comprises a plurality of cooling fins.
References Cited (Backward Citations)
US5218215A
Cited
US5608267A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-05-24 | 2002-11-23 | 2003-05-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-05-24 | 2006-11-23 | 2007-05-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-05-24 | 2010-11-23 | 2011-05-25 | $7700.00 | Window Closed / Lapsed |