US5834337A
Expired / Lapsed
US
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Integrated circuit heat transfer element and method
Assignee: Bryte Technologies Inc
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Filing: 1996-03-21
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Granted: 1998-11-10
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Expires: 2016-03-21
Abstract
Abstract An integrated circuit heat transfer element (6,30) is made by selecting thermally conductive fibers having aspect ratios of length to diameter of more than 1, selecting a resin and combining the fibers and the resin to create a formable resin/fiber compound. The resin/fiber compound is formed into a composite material in part by applying pressure to the formable resin/fiber compound, which aligns the fibers, and when cured creates a thermally anisotropic composite material to maximize heat conduction along the aligned fibers. The thermally anisotropic composite material has a coefficient of thermal expansion (CTE) of less than about 10×10 -6 cm/cm/° C. The composite material has a thermal conductivity in the direction of the carbon fibers of at least 50 W/m° K. The IC device is preferably secured to the heat transfer element using a thermally conductive adhesive.
Inventors
- 👤 Scott M. Unger
- 👤 Guy T. Riddle
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 10:57
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/257; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/25; Y10T428/26; Y10T428/263; Y10T428/264; Y10T428/265
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
99 words
A method of making a heat transfer element for an integrated circuit device comprising the following steps: selecting thermally conductive fibers of which at least 30% have aspect ratios of length to diameter of more than 1; selecting a resin; combining said fibers with said resin to create a formable resin/fiber compound; and forming said resin/fiber compound into a composite material, the forming step including the step of: generally aligning said fiber in a chosen direction by applying pressure to said resin/fiber compound to create a thermally anisotropic composite material so to maximize heat conduction along said chosen direction.
Claim 2
Independent Claim
99 words
A method of making a heat transfer element for an integrated circuit device comprising the following steps: selecting thermally conductive fibers of which at least 30% have aspect ratios of length to diameter of more than 1; selecting a resin; combining said fibers with said resin to create a formable resin/fiber compound; and forming said resin/fiber compound into a composite material, the forming step including the step of: generally aligning said fiber in a chosen direction by applying pressure to said resin/fiber compound to create a thermally anisotropic composite material so to maximize heat conduction along said chosen direction.
Claim 3
Dependent Claim
33 words
The method according to claim 1 wherein said selecting steps are carried out so the thermally anisotropic composite material has a coefficient of thermal expansion (CTE) of less than about 10×10 -6 cm/cm/°C.
Claim 4
Dependent Claim
27 words
The method according to claim 2 wherein said selecting steps are carried out so the thermally isotropic composite material has a CTE of about 5-6×10 -6 cm/cm/°C.
Claim 5
Dependent Claim
15 words
The method according to claim 1 wherein the fiber selecting step includes selecting carbonaceous fibers.
Claim 6
Dependent Claim
15 words
The method according to claim 1 wherein the fiber selecting step includes selecting graphite fibers.
Claim 7
Dependent Claim
19 words
The method according to claim 1 wherein the fiber selecting step includes selecting fibers coated with thermally conductive material.
Claim 8
Dependent Claim
33 words
The method according to claim 6 wherein said fiber selecting step is carried out from a group of fibers coated with at least one of the following: nickel, silver, gold, diamond and ceramics.
Claim 9
Dependent Claim
88 words
The method according to claim 1 wherein the resin selecting step includes the step of increasing the carbon content of said thermally anisotropic composite material by selecting a carbon precursor resin as the resin and the forming step includes the step of heating the thermally anisotropic composite material, following the pressure applying step, in the absence of oxygen to at least partially transform the carbon precursor resin into carbon, thereby increasing the amount of carbon in, and thus raise the thermal conductivity of, the thermally anisotropic composite material.
Claim 10
Dependent Claim
37 words
The method according to claim 1 wherein said forming step and said selecting steps are carried out so that the thermally anisotropic composite material has a thermal conductivity in said chosen direction of at least 50 W/m°K.
Claim 11
Dependent Claim
25 words
The method according to claim 1 wherein said pressure applying step is carried out by applying pressure to said resin/fiber compound within a cavity mold.
Claim 12
Dependent Claim
22 words
The method according to claim 1 wherein the forming step includes the step of curing the resin/fiber compound at an elevated temperature.
Claim 13
Dependent Claim
32 words
The method according to claim 1 wherein selecting steps and said forming step are carried out so that said thermally anisotropic composite material has a density of less than about 3.0 gm/cc.
Claim 14
Dependent Claim
32 words
The method according to claim 1 wherein selecting steps and said forming step are carried out so that said thermally anisotropic composite material has a density of less than about 2.3 gm/cc.
Claim 15
Dependent Claim
17 words
The method according to claim 1 further comprising the step of plating the thermally anisotropic composite material.
Claim 16
Dependent Claim
14 words
An integrated circuit heat transfer element made according to the method of claim 1.
Claim 17
Independent Claim
157 words
A method of making a heat transfer element for an integrated circuit device comprising the following steps: selecting carbonaceous fibers having aspect ratios of length to diameter of more than 1; selecting a resin; combining said fibers with said resin to create a formable resin/fiber compound with the fibers being other than aligned; forming said resin/fiber compound into a composite material, the forming step including the step of: generally aligning said fibers in a chosen direction by applying pressure to said resin/fiber compound to create a thermally anisotropic composite material so to maximize heat conduction along said chosen direction; said selecting steps being carried out so the thermally anisotropic composite material has a coefficient of thermal expansion (CTE) of less than about 10×10 -6 cm/cm/°C.; and said forming step and said selecting steps being carried out so that the thermally anisotropic composite material has a thermal conductivity in said chosen direction of at least 50 W/m° K.
Claim 18
Independent Claim
157 words
A method of making a heat transfer element for an integrated circuit device comprising the following steps: selecting carbonaceous fibers having aspect ratios of length to diameter of more than 1; selecting a resin; combining said fibers with said resin to create a formable resin/fiber compound with the fibers being other than aligned; forming said resin/fiber compound into a composite material, the forming step including the step of: generally aligning said fibers in a chosen direction by applying pressure to said resin/fiber compound to create a thermally anisotropic composite material so to maximize heat conduction along said chosen direction; said selecting steps being carried out so the thermally anisotropic composite material has a coefficient of thermal expansion (CTE) of less than about 10×10 -6 cm/cm/°C.; and said forming step and said selecting steps being carried out so that the thermally anisotropic composite material has a thermal conductivity in said chosen direction of at least 50 W/m° K.
Claim 19
Dependent Claim
88 words
The method according to claim 16 wherein the resin selecting step includes the step of increasing the carbon content of said thermally anisotropic composite material by selecting a carbon precursor resin as the resin and the forming step includes the step of heating the thermally anisotropic composite material, following the pressure applying step, in the absence of oxygen to at least partially transform the carbon precursor resin into carbon, thereby increasing the amount of carbon in, and thus raise the thermal conductivity of, the thermally anisotropic composite material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-11-09 | 2002-05-11 | 2002-11-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-11-09 | 2006-05-11 | 2006-11-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-11-09 | 2010-05-11 | 2010-11-10 | $7700.00 | Window Closed / Lapsed |