US7049691B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor multi-package module having inverted second package and including additional die or stacked package on second package
Assignee: Stats Chippac Pte Ltd
•
Filing: 2003-10-08
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Granted: 2006-05-23
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Expires: 2023-10-08
Abstract
Abstract A semiconductor multi-package module has stacked lower and upper packages, each of which includes a die attached to a substrate, in which the second package is inverted, and in which the upper and lower substrates are interconnected by wire bonding; and further in which at least one of the packages includes a stacked die package, or includes an additional stacked package. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die, affixing an upper molded package including an upper substrate in inverted orientation onto the upper surface of the lower package, in which one or both of the upper and lower packages is a stacked die package or in which one of the packages includes an additional stacked package, and forming z-interconnects between the upper and lower substrates.
Inventors
- 👤 Marcos Karnezos
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-10 01:43
CPC Classifications
H; H10; H10W; H10W90/00; H10W40/00; H10W40/10; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W40/70; H10W40/77; H10W40/778; H10W42/00; H10W42/20; H10W70/00; H10W70/60; H10W70/611; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W74/121; H10W74/15; H10W90/401; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5438; H10W72/551; H10W72/851; H10W72/853; H10W72/856; H10W72/865; H10W72/874; H10W72/877; H10W72/884; H10W72/90; H10W72/951; H10W72/952; H10W74/127; H10W90/20; H10W90/22; H10W90/231; H10W90/288; H10W90/701; H10W90/721; H10W90/722; H10W90/724; H10W90/731; H10W90/732; H10W90/734; H10W90/751; H10W90/752; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
48 words
A multi-package module comprising stacked first and second packages, each said package including a die attached to a substrate, wherein the second package is inverted, wherein the second and first substrates are interconnected by wire bonding, and wherein at least one said package comprises a stacked die package.
Claim 2
Dependent Claim
48 words
A multi-package module comprising stacked first and second packages, each said package including a die attached to a substrate, wherein the second package is inverted, wherein the second and first substrates are interconnected by wire bonding, and wherein at least one said package comprises a stacked die package.
Claim 3
Dependent Claim
15 words
The multi-package module of claim 1 wherein the first package comprises a stacked die package.
Claim 4
Dependent Claim
21 words
The multi-package module of claim 1 wherein each of the first package and the second package comprises a stacked die package.
Claim 5
Dependent Claim
15 words
The multi-package module of claim 1 wherein the second package comprises a stacked die package.
Claim 6
Dependent Claim
20 words
The multi-package module of claim 1 wherein adjacent stacked die in the stacked die package are separated by a spacer.
Claim 7
Dependent Claim
16 words
The multi-package module of claim 1 , further comprising a heat spreader over the second package.
Claim 8
Dependent Claim
18 words
The multi-package module of claim 1 , further comprising an additional package stacked over the inverted second package.
Claim 9
Dependent Claim
16 words
The multi-package module of claim 7 wherein the additional package is a land grid array package.
Claim 10
Dependent Claim
17 words
The multi-package module of claim 7 wherein the additional package is an inverted land grid array package.
Claim 11
Dependent Claim
16 words
The multi-package module of claim 7 wherein the additional package is a ball grid array package.
Claim 12
Dependent Claim
15 words
The multi-package module of claim 7 wherein the additional package is a flip chip package.
Claim 13
Dependent Claim
22 words
A mobile device comprising the multi-package module of claim 1 , said multi-package module being connected to underlaying circuitry in the device.
Claim 14
Dependent Claim
21 words
A computer comprising the multi-package module of claim 1 , said multi-package module being connected to underlying circuitry in the computer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2009-05-22 | 2009-11-21 | 2010-05-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2013-05-22 | 2013-11-21 | 2014-05-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2017-05-22 | 2017-11-21 | 2018-05-23 | $7700.00 | Window Closed / Lapsed |