US6972481B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages
Assignee: Stats Chippac Pte Ltd
•
Filing: 2003-08-02
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Granted: 2005-12-06
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Expires: 2023-08-02
Abstract
Abstract A semiconductor multi-package module having stacked first and second packages, each package including a die attached to a substrate, in which the first and second substrates are interconnected by wire bonding, and wherein at least one said package comprises a stacked die package. Also, a method for making a semiconductor multi-package module, by providing a stacked die molded first package including a first package substrate, affixing a second molded package including a second substrate onto an upper surface of the first package, and forming z-interconnects between the first and second substrates.
Inventors
- 👤 Marcos Karnezos
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:03
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/401; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W42/00; H10W42/20; H10W70/00; H10W70/60; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/075; H10W72/20; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W74/15; H10W90/20; H10W90/22; H10W90/288; H10W90/701; H10W90/721; H10W90/722; H10W90/724; H10W90/731; H10W90/732; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
73 words
A multi-package module comprising stacked lower and upper packages, the lower package including a die attached to and electrically connected to a lower substrate and the upper package including a die attached to and electrically connected to an upper substrate, wherein the upper and lower substrates are interconnected by wire bonding, wherein at least one said package comprises a stacked die package, and wherein at least one said stacked die package is encapsulated.
Claim 2
Dependent Claim
73 words
A multi-package module comprising stacked lower and upper packages, the lower package including a die attached to and electrically connected to a lower substrate and the upper package including a die attached to and electrically connected to an upper substrate, wherein the upper and lower substrates are interconnected by wire bonding, wherein at least one said package comprises a stacked die package, and wherein at least one said stacked die package is encapsulated.
Claim 3
Dependent Claim
15 words
The multi-package module of claim 1 wherein the lower package comprises a stacked die package.
Claim 4
Dependent Claim
21 words
The multi-package module of claim 1 wherein each of the lower package and the upper package comprises a stacked die package.
Claim 5
Dependent Claim
15 words
The multi-package module of claim 1 wherein the upper package comprises a stacked die package.
Claim 6
Dependent Claim
20 words
The multi-package module of claim 1 wherein adjacent stacked die in the stacked die package are separated by a spacer.
Claim 7
Dependent Claim
16 words
The multi-package module of claim 1 , further comprising a heat spreader over the upper package.
Claim 8
Independent Claim
79 words
A method for making a multi-package module, comprising providing a first package, providing a second package, each said package comprising a die attached to and electrically interconnected to a substrate, at least one of said first package and said second package comprising a stacked die package, wherein at least one said stacked die package is encapsulated, stacking the second package over the first package, and forming electrical interconnects between the first package and the second package by wire bonding.
Claim 9
Independent Claim
79 words
A method for making a multi-package module, comprising providing a first package, providing a second package, each said package comprising a die attached to and electrically interconnected to a substrate, at least one of said first package and said second package comprising a stacked die package, wherein at least one said stacked die package is encapsulated, stacking the second package over the first package, and forming electrical interconnects between the first package and the second package by wire bonding.
Claim 10
Dependent Claim
39 words
The method of claim 7 wherein providing said package comprising a stacked die package comprising testing stacked die packages for a performance and reliability requirement, and identifying a package that meets the requirement as a said stacked die package.
Claim 11
Dependent Claim
32 words
The method of claim 7 wherein providing a second package comprises testing packages for a performance and reliability requirement, and identifying a package that meets the requirement as a said second package.
Claim 12
Dependent Claim
23 words
The method of claim 7 wherein providing said package comprising a stacked die package comprises providing an unsingulated strip of stacked die packages.
Claim 13
Dependent Claim
48 words
The method of claim 7 wherein providing said package comprising a stacked die package comprises providing a package comprising a first die affixed to a package substrate, a second die affixed over the first die, and wire bond interconnects between said first and second die and said substrate.
Claim 14
Dependent Claim
30 words
The method of claim 11 wherein providing said package comprising a stacked die package comprises providing a package further comprising a spacer interposed between said first and said second die.
Claim 15
Dependent Claim
12 words
The method of claim 7 , further comprising providing a heat spreader.
Claim 16
Dependent Claim
17 words
The method of claim 7 , further comprising attaching second-level interconnect balls onto the first package substrate.
Claim 17
Dependent Claim
19 words
The method of claim 7 , further comprising encapsulating the stacked packages on the module in a molding compound.
Claim 18
Dependent Claim
11 words
A mobile device comprising the multi-package module of claim 1 .
Claim 19
Dependent Claim
10 words
A computer comprising the multi-package module of claim 1 .
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2008-12-05 | 2009-06-06 | 2009-12-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2012-12-05 | 2013-06-06 | 2013-12-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2016-12-05 | 2017-06-06 | 2017-12-06 | $7700.00 | Window Closed / Lapsed |