US7053477B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor multi-package module having inverted bump chip carrier second package
Assignee: Stats Chippac Pte Ltd
•
Filing: 2003-10-08
•
Granted: 2006-05-30
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Expires: 2023-10-08
Abstract
Abstract A semiconductor multi-package module has stacked lower and upper packages, each of which includes a die attached to a substrate, in which the second package is inverted, in which the upper and lower substrates are interconnected by wire bonding, and in which the inverted second package comprises a bump chip carrier package. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die, affixing an upper bump chip carrier package including an upper substrate in inverted orientation onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.
Inventors
- 👤 Marcos Karnezos
- 👤 Flynn Carson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 10:44
CPC Classifications
H; H10; H10W; H10W90/00; H10W40/00; H10W40/10; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W40/70; H10W40/77; H10W40/778; H10W42/00; H10W42/20; H10W70/00; H10W70/60; H10W70/611; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W74/121; H10W74/15; H10W90/401; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5438; H10W72/551; H10W72/851; H10W72/853; H10W72/856; H10W72/865; H10W72/874; H10W72/877; H10W72/884; H10W72/90; H10W72/951; H10W72/952; H10W74/127; H10W90/20; H10W90/22; H10W90/231; H10W90/288; H10W90/701; H10W90/721; H10W90/722; H10W90/724; H10W90/731; H10W90/732; H10W90/734; H10W90/751; H10W90/752; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
48 words
A multi-package module comprising stacked lower and upper packages, each said package including a die attached to a substrate, wherein the upper package is inverted, wherein the upper and lower substrates are interconnected by wire bonding, and wherein the inverted upper package comprises a bump chip carrier package.
Claim 2
Dependent Claim
48 words
A multi-package module comprising stacked lower and upper packages, each said package including a die attached to a substrate, wherein the upper package is inverted, wherein the upper and lower substrates are interconnected by wire bonding, and wherein the inverted upper package comprises a bump chip carrier package.
Claim 3
Dependent Claim
16 words
The multi-package module of claim 1 wherein the lower package comprises a bull grid array package.
Claim 4
Dependent Claim
16 words
The multi-package module of claim 1 wherein the lower package comprises a die-down flip chip package.
Claim 5
Dependent Claim
16 words
The multi-package module of claim 1 wherein the lower package comprises a die-up flip chip package.
Claim 6
Dependent Claim
22 words
The multi-package module of claim 1 wherein the inverted upper package includes an additional die stacked on the bump chip carrier package.
Claim 7
Dependent Claim
16 words
The multi-package module of claim 1 wherein the inverted upper package comprises a stacked die package.
Claim 8
Dependent Claim
22 words
The multi-package module of claim 6 wherein at least two adjacent stacked die in the upper package are separated by a spacer.
Claim 9
Dependent Claim
27 words
The multi-package module of claim 6 wherein the die affixed to the inverted upper package substrate is electrically connected to the upper package substrate by wire bonding.
Claim 10
Dependent Claim
29 words
The multi-package module of claim 6 wherein a plurality of the stacked die in the inverted upper package are electrically connected to the upper package substrate by wire bonding.
Claim 11
Dependent Claim
17 words
The multi-package module of claim 1 , further comprising a heat spreader over the inverted upper package.
Claim 12
Dependent Claim
11 words
A mobile device comprising the multi-package module of claim 1 .
Claim 13
Dependent Claim
10 words
A computer comprising the multi-package module at claim 1 .
Claim 14
Dependent Claim
22 words
The multi-package module of claim 1 wherein the upper package die is electrically connected to the upper package substrate by wire bonding.
Claim 15
Dependent Claim
16 words
The multi-package module of claim 1 wherein the lower package comprises a bump chip carrier package.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2009-05-29 | 2009-11-28 | 2010-05-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2013-05-29 | 2013-11-28 | 2014-05-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2017-05-29 | 2017-11-28 | 2018-05-30 | $7700.00 | Window Closed / Lapsed |