US6906415B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device assemblies and packages including multiple semiconductor devices and methods
Assignee: Micron Technology Inc
•
Filing: 2002-06-27
•
Granted: 2005-06-14
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Expires: 2022-06-27
Abstract
Abstract A multidie semiconductor device (MDSCD) package includes a generally planar interposer comprising a substrate with a central receptacle, upper surface conductors, and outer connectors on the lower surface of the interposer. Conductive vias connect upper surface conductors with outer connectors. One or more semiconductor devices may be mounted in the receptacle and one or more other semiconductor devices mounted above and/or below the interposer and attached thereto. The package may be configured to have a footprint not significantly larger than the footprint of the largest device and/or a thickness not significantly greater than the combined thickness of included devices. Methods for assembling and encapsulating packages from multidie wafers and multi-interposer sheets or strips are disclosed. Methods for combining a plurality of packages into a single stacked package are disclosed. The methods may include use of somewhat laterally extending intermediate conductive elements, flip-chip style electrical connection, or both within the same package.
Inventors
- 👤 Tongbi Jiang
- 👤 Setho Sing Fee
- 👤 Tay Wuu Yean
- 👤 Lim Thiam Chye
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 10:52
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H10W70/62; H10W70/65; H10W70/657; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W90/00; H05K2201/00; H05K2201/04; H05K2201/045; H05K2201/049; H05K2201/09; H05K2201/09145; H05K2201/09181; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10727; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K3/3442; H05K3/40; H05K3/403; H10W70/681; H10W72/00; H10W72/01; H10W72/0198; H10W72/071; H10W72/075; H10W72/50; H10W72/801; H10W72/851; H10W72/874; H10W72/877; H10W72/884; H10W72/90; H10W72/951; H10W72/952; H10W74/131; H10W74/142; H10W90/20; H10W90/22; H10W90/291; H10W90/701; H10W90/721; H10W90/722; H10W90/724; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 58
Claim 1
Independent Claim
130 words
A semiconductor device assembly, comprising: an interposer including at least one receptacle formed therein; at least one semiconductor device positioned at least partially within the at least one receptacle, a backside of the at least one semiconductor device being substantially coplanar with a surface of the interposer or located within a plane which extends through the interposer; at least one intermediate conductive element extending from a bond pad of the at least one semiconductor device to a bond pad of the interposer, the at least one intermediate conductive element being bonded to at least the bond pad of the interposer; and at least another semiconductor device at least partially superimposed over a bond pad-bearing surface of the at least one semiconductor device and at least partially supported by the interposer.
Claim 2
Dependent Claim
130 words
A semiconductor device assembly, comprising: an interposer including at least one receptacle formed therein; at least one semiconductor device positioned at least partially within the at least one receptacle, a backside of the at least one semiconductor device being substantially coplanar with a surface of the interposer or located within a plane which extends through the interposer; at least one intermediate conductive element extending from a bond pad of the at least one semiconductor device to a bond pad of the interposer, the at least one intermediate conductive element being bonded to at least the bond pad of the interposer; and at least another semiconductor device at least partially superimposed over a bond pad-bearing surface of the at least one semiconductor device and at least partially supported by the interposer.
Claim 3
Dependent Claim
19 words
The semiconductor device assembly of claim 1 , wherein the at least one receptacle extends substantially through the interposer.
Claim 4
Dependent Claim
22 words
The semiconductor device assembly of claim 1 , wherein the at least one semiconductor device is completely laterally surrounded by the interposer.
Claim 5
Dependent Claim
31 words
The semiconductor device assembly of claim 1 , wherein active surfaces of the at least one semiconductor device and the at least another semiconductor device face in substantially the same direction.
Claim 6
Dependent Claim
71 words
The semiconductor device assembly of claim 4 , further comprising: at least one intermediate conductive element extending laterally between and electrically connecting a bond pad of the at least one semiconductor device to a corresponding contact area of the interposer; and at least another intermediate conductive element extending laterally between and electrically connecting a bond pad of the at least another semiconductor device and another corresponding contact area of the interposer.
Claim 7
Dependent Claim
28 words
The semiconductor device assembly of claim 5 , wherein the corresponding contact area and the another corresponding contact area are located on the same surface of the interposer.
Claim 8
Dependent Claim
25 words
The semiconductor device assembly of claim 4 , wherein the at least another semiconductor device includes at least one redistribution circuit on a surface thereof.
Claim 9
Dependent Claim
76 words
The semiconductor device assembly of claim 7 , further comprising: at least one discrete conductive element electrically connecting a bond pad of the at least one semiconductor device and a portion of the at least one redistribution circuit in alignment with the bond pad, and at least another discrete conductive element electrically connecting another portion of the at least one redistribution circuit and a corresponding contact area of the interposer in alignment with the another portion.
Claim 10
Dependent Claim
28 words
The semiconductor device assembly of claim 8 , wherein the at least one redistribution circuit is carried upon a back side of the at least another semiconductor device.
Claim 11
Dependent Claim
44 words
The semiconductor device assembly of claim 9 , further comprising: at least one intermediate conductive element extending laterally between and electrically connecting a bond pad on said active surface of the at least another semiconductor device and another corresponding contact area of said interposer.
Claim 12
Dependent Claim
28 words
The semiconductor device assembly of claim 8 , wherein the at least one redistribution circuit is carried upon said active surface of the at least another semiconductor device.
Claim 13
Dependent Claim
47 words
The semiconductor device assembly of claim 11 , further comprising: at least another discrete conductive element electrically connecting a bond pad on the active surface of said at least another semiconductor device and another corresponding contact area of the interposer in substantial alignment with said bond pad.
Claim 14
Dependent Claim
28 words
The semiconductor device assembly of claim 1 , wherein active surfaces of the at least one semiconductor device and the at least another semiconductor device face one another.
Claim 15
Dependent Claim
88 words
The semiconductor device assembly of claim 13 , further comprising: at least one discrete conductive element extending between and electrically connecting a bond pad of the at least one semiconductor device and a corresponding bond pad of the at least another semiconductor device in substantially alignment with the bond pad; and at least another discrete conductive element extending between and electrically connecting another bond pad of the at least another semiconductor device and a corresponding contact area of the interposer in substantial alignment with the another bond pad.
Claim 16
Dependent Claim
38 words
The semiconductor device assembly of claim 14 , wherein the corresponding bond pad of said at least another semiconductor device comprises a portion of a redistribution circuit on the active surface of the at least another semiconductor device.
Claim 17
Dependent Claim
37 words
The semiconductor device assembly of claim 15 , wherein the redistribution circuit further comprises a circuit trace in communication with the corresponding bond pad and a redistribution bond pad at an opposite end of the circuit trace.
Claim 18
Dependent Claim
25 words
The semiconductor device assembly of claim 16 , wherein the another bond pad of the at least another semiconductor device comprises the redistribution bond pad.
Claim 19
Dependent Claim
24 words
The semiconductor device assembly of claim 13 , comprising at least two semiconductor devices positioned at least partially within the at least one receptacle.
Claim 20
Dependent Claim
21 words
The semiconductor device assembly of claim 18 , wherein back sides of the at least two semiconductor devices face one another.
Claim 21
Dependent Claim
28 words
The semiconductor device assembly of claim 19 , wherein another semiconductor device is positioned adjacent to an active surface of each of the at least two semiconductor devices.
Claim 22
Dependent Claim
57 words
The semiconductor device assembly of claim 1 , wherein: circuitry of the at least another semiconductor device is in electrical communication with corresponding circuitry of the interposer; and circuitry of the at least one semiconductor device is in electrical communication with corresponding circuitry of at least one of the at least another semiconductor device and the interposer.
Claim 23
Dependent Claim
35 words
The semiconductor device assembly of claim 21 , further comprising: a quantity of underfill material between at least peripheral edges of the at least one semiconductor device and surfaces of the at least one receptacle.
Claim 24
Dependent Claim
31 words
The semiconductor device assembly of claim 22 , wherein the underfill material is located between adjacent surfaces of the at least one semiconductor device and the at least another semiconductor device.
Claim 25
Dependent Claim
31 words
The semiconductor device assembly of claim 21 , further comprising: encapsulant material covering at least a peripheral edge of the at least another semiconductor device and adjacent regions of the interposer.
Claim 26
Dependent Claim
25 words
The semiconductor device assembly of claim 21 , further comprising: conductive structures on the interposer for electrical connection of the interposer to a higher-level substrate.
Claim 27
Dependent Claim
33 words
The semiconductor device assembly of claim 25 , wherein the conductive structures comprise contact pads on a surface of the interposer and discrete conductive elements that protrude from the surface of the interposer.
Claim 28
Dependent Claim
33 words
The semiconductor device assembly of claim 26 , wherein the discrete conductive elements protrude from an opposite surface from that by which the at least another semiconductor device is at least partially supported.
Claim 29
Dependent Claim
33 words
The semiconductor device assembly of claim 26 , wherein the discrete conductive elements protrude from the same surface as that by which the at least another semiconductor device is at least partially supported.
Claim 30
Dependent Claim
27 words
The semiconductor device assembly of claim 26 , wherein the discrete conductive elements comprise at least one of balls, bumps, columns, pillars, and pins of conductive material.
Claim 31
Dependent Claim
80 words
The semiconductor device assembly of claim 1 , wherein the interposer includes: first contact pads on a first surface thereof for establishing electrical communication between circuitry of the interposer or a semiconductor device supported thereby and a higher-level substrate; and second contact pads on a second surface thereof, opposite the first surface, for establishing electrical communication between the circuitry of the interposer or the semiconductor device supported thereby and another semiconductor device assembly at least partially superimposed over the interposer.
Claim 32
Dependent Claim
165 words
A semiconductor device assembly, comprising: an interposer including a first surface, a second surface opposite the first surface, and at least one receptacle extending from the first surface to the second surface; a first semiconductor device positioned at least partially over the first surface and including an active surface, at least a portion of the active surfaca facing the at least one receptacle; at least one first discrete conductive element electrically connecting a bond pad of the first semiconductor device and a corresponding contact pad at the first surface of the interposer that is in substantial alignment with the bond pad; a second semiconductor device positioned at least partially over to the second surface and including an active surface, at least a portion of which faces the at least one receptacle; and at least one second discrete conductive element electrically connecting a bond pad of the second semiconductor device and a corresponding bond pad of the first semiconductor device through the at least one receptacle.
Claim 33
Dependent Claim
165 words
A semiconductor device assembly, comprising: an interposer including a first surface, a second surface opposite the first surface, and at least one receptacle extending from the first surface to the second surface; a first semiconductor device positioned at least partially over the first surface and including an active surface, at least a portion of the active surfaca facing the at least one receptacle; at least one first discrete conductive element electrically connecting a bond pad of the first semiconductor device and a corresponding contact pad at the first surface of the interposer that is in substantial alignment with the bond pad; a second semiconductor device positioned at least partially over to the second surface and including an active surface, at least a portion of which faces the at least one receptacle; and at least one second discrete conductive element electrically connecting a bond pad of the second semiconductor device and a corresponding bond pad of the first semiconductor device through the at least one receptacle.
Claim 34
Dependent Claim
29 words
The semiconductor device assembly of claim 31 , wherein the at least one second discrete conductive element comprises at least one of a ball, bump, column, pillar, and pin.
Claim 35
Dependent Claim
29 words
The semiconductor device assembly of claim 31 , wherein the corresponding bond pad comprises a portion of a redistribution circuit on the active surface of the first semiconductor device.
Claim 36
Dependent Claim
43 words
The semiconductor device assembly of claim 33 , wherein the redistribution circuit further comprises a conductive trace in electrical communication with the corresponding bond pad and a redistribution bond pad at an end of the conductive trace opposite from the corresponding bond pad.
Claim 37
Dependent Claim
25 words
The semiconductor device assembly of claim 34 , wherein the redistribution bond pad is positioned adjacent to an outer periphery of the second semiconductor device.
Claim 38
Dependent Claim
178 words
A multidie semiconductor device package, comprising: an interposer, comprising: a substrate with first and second surfaces; a receptacle extending between the first and second surfaces; and bond pad carried by at least the first surface; at least one first-level semiconductor device positioned within the receptacle, a backside of the at least one first-level semiconductor device being substantially coplanar with the second surface of the interposer or located between the first and second surfaces of the interposer, each first-level semiconductor device also having an active surface; a second-level semiconductor device positioned over the first surface of the interposer and attached thereto, the second-level semiconductor device having an active surface; at least one intermediate conductive element extending at least partially laterally between a bond pad of the at least one first-level semiconductor device and a corresponding bond pad carried by the first surface of the substrate of the interposer, the at least one intermediate conductive element being bonded to at least the corresponding bond pad; and electrical connections connecting the second-level semiconductor device to corresponding bond pads of the interposer.
Claim 39
Dependent Claim
178 words
A multidie semiconductor device package, comprising: an interposer, comprising: a substrate with first and second surfaces; a receptacle extending between the first and second surfaces; and bond pad carried by at least the first surface; at least one first-level semiconductor device positioned within the receptacle, a backside of the at least one first-level semiconductor device being substantially coplanar with the second surface of the interposer or located between the first and second surfaces of the interposer, each first-level semiconductor device also having an active surface; a second-level semiconductor device positioned over the first surface of the interposer and attached thereto, the second-level semiconductor device having an active surface; at least one intermediate conductive element extending at least partially laterally between a bond pad of the at least one first-level semiconductor device and a corresponding bond pad carried by the first surface of the substrate of the interposer, the at least one intermediate conductive element being bonded to at least the corresponding bond pad; and electrical connections connecting the second-level semiconductor device to corresponding bond pads of the interposer.
Claim 40
Dependent Claim
25 words
The multidie semiconductor device package of claim 36 , further comprising outer connectors for attaching the multidie semiconductor device package to conductors on an object.
Claim 41
Dependent Claim
29 words
The multidie semiconductor device package of claim 37 , wherein the outer connectors are mounted on the second surface of the substrate and conductively connected to the electrical connections.
Claim 42
Dependent Claim
35 words
The multidie semiconductor device package of claim 38 , wherein the outer connectors are conductively connected to the electrical connections by conductive vias extending between the first surface and the second surface of the substrate.
Claim 43
Dependent Claim
23 words
The multidie semiconductor device package of claim 37 , wherein the object comprises one of a circuit board and another semiconductor device package.
Claim 44
Dependent Claim
29 words
The multidie semiconductor device package of claim 37 , wherein the outer connectors comprise one of conductive balls, conductive bumps, conductive columns, conductive pins and plug-in type electrical connectors.
Claim 45
Dependent Claim
28 words
The multidie semiconductor device package of claim 36 , wherein the second-level semiconductor device has a larger footprint than that of the at least one first-level semiconductor device.
Claim 46
Dependent Claim
29 words
The multidie semiconductor device package of claim 36 , wherein the second-level semiconductor device is larger than the receptacle in at least one of an X and Y dimension.
Claim 47
Dependent Claim
33 words
The multidie semiconductor device package of claim 36 , further comprising: elongate, intermediate conductive elements connecting bond pads of the at least one first-level semiconductor device to corresponding bond pads of the interposer.
Claim 48
Dependent Claim
28 words
The multidie semiconductor device package of claim 36 , wherein the electrical connections connecting the second-level semiconductor device to the corresponding bond pads comprise elongate, intermediate conductive elements.
Claim 49
Dependent Claim
42 words
The multidie semiconductor device package of claim 36 , wherein the electrical connections connecting the second-level semiconductor device to the corresponding bond pads comprise discrete conductive elements interposed between the active surface of the second-level semiconductor device and the corresponding bond pads.
Claim 50
Dependent Claim
44 words
The multidie semiconductor device package of claim 46 , wherein the electrical connections connecting the second-level semiconductor device to the corresponding bond pads comprise one of conductive balls, conductive bumps, conductive pins, conductive columns, conductive pillars, and conductive regions of z-axis-conductive or conductor-filled elastomer.
Claim 51
Dependent Claim
39 words
The multidie semiconductor device package of claim 46 , wherein bond pads of the at least one first-level semiconductor device are connected to corresponding bond pads on the active surface of the second-level semiconductor device by first-level electrical connections.
Claim 52
Dependent Claim
57 words
The multidie semiconductor device package of claim 48 , wherein the first-level electrical connections between the bond pads of the at least one first-level semiconductor device and the corresponding bond pads of the second-level semiconductor device comprise one of conductive balls, conductive bumps, conductive pins, conductive columns, conductive pillars and conductive regions of z-axis-conductive or conductor-filled elastomer.
Claim 53
Dependent Claim
26 words
The multidie semiconductor device package of claim 46 , wherein the second-level semiconductor device is attached to the first surface of the substrate of the interposer.
Claim 54
Dependent Claim
31 words
The multidie semiconductor device package of claim 36 , wherein a back side of the at least one first-level semiconductor device is substantially coplanar with the second surface of the substrate.
Claim 55
Dependent Claim
42 words
The multidie semiconductor device package of claim 36 , further comprising a third-level semiconductor device with an active surface, bond pads on the active surface of the third-level semiconductor device being attached by conductive connectors to the second surface of the substrate.
Claim 56
Dependent Claim
46 words
The multidie semiconductor device package of claim 52 , wherein the conductive connectors on the third-level semiconductor device comprise one of conductive balls, conductive bumps, conductive pins, conductive columns, conductive pillars, conductive regions of z-axis-conductive or conductor-filled elastomer, bond wires, conductive tape-automated bonding elements, and leads.
Claim 57
Dependent Claim
44 words
The multidie semiconductor device package of claim 52 , further comprising a second first-level semiconductor device positioned below the at least one first-level semiconductor device in the receptacle, the second first-level semiconductor device electrically attached to the third-level semiconductor device in a flip-chip arrangement.
Claim 58
Dependent Claim
29 words
The multidie semiconductor device package of claim 36 , wherein the at least one first-level semiconductor device comprises a plurality of first-level semiconductor devices mounted side-by-side in the receptacle.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2008-06-13 | 2008-12-13 | 2009-06-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2012-06-13 | 2012-12-13 | 2013-06-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2016-06-13 | 2016-12-13 | 2017-06-14 | $7700.00 | Window Closed / Lapsed |