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US7379316B2 Expired / Lapsed US ⏱️ 0.0 years remaining

Methods and apparatus of stacking DRAMs

Assignee: Google LLC
•
Filing: 2006-09-01
•
Granted: 2008-05-27
•
Expires: 2026-09-01
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Abstract

Abstract Large capacity memory systems are constructed using stacked memory integrated circuits or chips. The stacked memory chips are constructed in such a way that eliminates problems such as signal integrity while still meeting current and future memory standards.

Inventors

  • 👤 Suresh N. Rajan

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 11:14
CPC Classifications
G; G11; G11C; G11C7/00; G11C11/00; G11C11/21; G11C11/34; G11C11/40; G11C5/00; G11C5/06; G11C11/401; G11C11/4063; G11C11/407; G11C11/409; G11C11/4093; G11C29/00; G11C29/70; G11C29/78; G11C29/80; G11C29/812; G11C5/02; G11C7/10; H; H10; H10W; H10W70/00; H10W70/60

Claims Analysis

Total Claims: 32
Claim 1
Independent Claim 118 words
A memory device for electrical connection to a memory bus, the memory device comprising: a plurality of dynamic random access memory (“DRAM”) integrated circuits, stacked in a vertical direction, each DRAM integrated circuit comprising a memory core of a plurality of cells and accessible at a first speed; and an interface integrated circuit electrically coupled to the plurality of DRAM integrated circuits for providing an interface between the DRAM integrated circuits and the memory bus at a speed greater than the first speed; wherein the interface integrated circuit is adapted for providing a predetermined electrical load on the memory bus independent of a number of the DRAM integrated circuits to which the interface integrated circuit is electrically coupled.
Claim 2
Dependent Claim 118 words
A memory device for electrical connection to a memory bus, the memory device comprising: a plurality of dynamic random access memory (“DRAM”) integrated circuits, stacked in a vertical direction, each DRAM integrated circuit comprising a memory core of a plurality of cells and accessible at a first speed; and an interface integrated circuit electrically coupled to the plurality of DRAM integrated circuits for providing an interface between the DRAM integrated circuits and the memory bus at a speed greater than the first speed; wherein the interface integrated circuit is adapted for providing a predetermined electrical load on the memory bus independent of a number of the DRAM integrated circuits to which the interface integrated circuit is electrically coupled.
Claim 3
Dependent Claim 21 words
The memory device as set forth in claim 1 , wherein: each DRAM integrated circuit comprises a DRAM integrated circuit die.
Claim 4
Dependent Claim 23 words
The memory device as set forth in claim 1 , wherein: the plurality of DRAM integrated circuits comprises a DRAM integrated circuit package.
Claim 5
Dependent Claim 26 words
The memory device as set forth in claim 1 , wherein: the interface integrated circuit is adapted to operate in accordance with an industry defined specification.
Claim 6
Dependent Claim 26 words
The memory device as set forth in claim 1 , wherein: the interface integrated circuit is adapted to operate in accordance with a DDR2 SRAM specification.
Claim 7
Dependent Claim 115 words
A memory device for electrical connection to a memory bus, the memory device comprising: a plurality of dynamic random access memory (“DRAM”) integrated circuits, stacked in a vertical direction, each DRAM integrated circuit comprisina a memory core of a plurality of cells and accessible at a first speed; and an interface integrated circuit electrically coupled to the plurality of DRAM integrated circuits for providing an interface between the DRAM integrated circuits and the memory bus at a speed greater than the first speed; wherein the plurality of DRAM integrated circuits comprise: a working pool of “p” DRAM integrated circuits; and a spare pool of “q” DRAM integrated circuits; wherein “p” and “q” comprise integer values.
Claim 8
Dependent Claim 115 words
A memory device for electrical connection to a memory bus, the memory device comprising: a plurality of dynamic random access memory (“DRAM”) integrated circuits, stacked in a vertical direction, each DRAM integrated circuit comprisina a memory core of a plurality of cells and accessible at a first speed; and an interface integrated circuit electrically coupled to the plurality of DRAM integrated circuits for providing an interface between the DRAM integrated circuits and the memory bus at a speed greater than the first speed; wherein the plurality of DRAM integrated circuits comprise: a working pool of “p” DRAM integrated circuits; and a spare pool of “q” DRAM integrated circuits; wherein “p” and “q” comprise integer values.
Claim 9
Dependent Claim 95 words
The memory device as set forth in claim 6 , further comprising: a memory controller, coupled to at least one of the interface integrated circuit and the plurality of DRAM integrated circuits, for detecting occurrence of a pre-defined number of errors in working memory integrated circuits and for signaling to the interface integrated circuit to indicate the occurrence of the pre-defined number of errors; and wherein the interface integrated circuit is adapted to replace at least one DRAM integrated circuit of the working pool with at least one DRAM integrated circuit of the spare pool.
Claim 10
Dependent Claim 30 words
The memory device as set forth in claim 7 , wherein: the memory controller is further adapted to signal the occurrence of the pre-defined number of errors using in-band signaling.
Claim 11
Dependent Claim 31 words
The memory device as set forth in claim 7 , wherein: the memory controller is further adapted to signal the occurrence of the pre-defined number of errors using side band signaling.
Claim 12
Dependent Claim 115 words
A memory device for electrical connection to a memory bus, the memory device comprising: a plurality of dynamic random access memory (“DRAM”) integrated circuits, stacked in a vertical direction, each DRAM integrated circuit comprising a memory core of a plurality of cells and accessible at a first speed; and an interface integrated circuit electrically coupled to the plurality of DRAM integrated circuits for providing an interface between the DRAM integrated circuits and the memory bus at a speed greater than the first speed; wherein the plurality of DRAM integrated circuits comprise: a working pool of “p” DRAM integrated circuits; and a mirrored pool of “q” DRAM integrated circuits; wherein “p” and “q” comprise integer values.
Claim 13
Dependent Claim 115 words
A memory device for electrical connection to a memory bus, the memory device comprising: a plurality of dynamic random access memory (“DRAM”) integrated circuits, stacked in a vertical direction, each DRAM integrated circuit comprising a memory core of a plurality of cells and accessible at a first speed; and an interface integrated circuit electrically coupled to the plurality of DRAM integrated circuits for providing an interface between the DRAM integrated circuits and the memory bus at a speed greater than the first speed; wherein the plurality of DRAM integrated circuits comprise: a working pool of “p” DRAM integrated circuits; and a mirrored pool of “q” DRAM integrated circuits; wherein “p” and “q” comprise integer values.
Claim 14
Dependent Claim 95 words
The memory device as set forth in claim 10 , further comprising: a memory controller, coupled to at least one of the interface integrated circuit and the plurality of DRAM integrated circuits, for detecting occurrence of a pre-defined number of errors in working memory integrated circuits and for signaling to the interface integrated circuit to indicate the occurrence of the pre-defined number of errors; and wherein the interface integrated circuit is adapted to replace at least one DRAM integrated circuit of the working pool with at least one DRAM integrated circuit of the mirrored pool.
Claim 15
Dependent Claim 30 words
The memory device as set forth in claim 11 , wherein: the memory controller is further adapted to signal the occurrence of the pre-defined number of errors using in-band signaling.
Claim 16
Dependent Claim 31 words
The memory device as set forth in claim 11 , wherein: the memory controller is further adapted to signal the occurrence of the pre-defined number of errors using side band signaling.
Claim 17
Dependent Claim 14 words
The memory device as set forth in claim 10 , wherein: “p” equals “q”.
Claim 18
Dependent Claim 141 words
A memory device for electrical connection to a memory bus, the memory device comprising: a plurality of dynamic random access memory (“DRAM”) integrated circuits, stacked in a vertical direction, each DRAM integrated circuit comprising a memory core of a plurality of cells and accessible at a first speed; an interface integrated circuit electrically coupled to the plurality of DRAM integrated circuits for providing an interface between the DRAM integrated circuits and the memory bus at a speed greater than the first speed; and a memory scheme wherein the plurality of DRAM integrated circuits comprise; “p” DRAM integrated circuits used as a working memory device for storing data across the “p” DRAM integrated circuits; and at least one additional DRAM integrated circuit for storing additional information for the data stored in the “p” DRAM integrated circuits; wherein “p” comprises an integer value.
Claim 19
Dependent Claim 141 words
A memory device for electrical connection to a memory bus, the memory device comprising: a plurality of dynamic random access memory (“DRAM”) integrated circuits, stacked in a vertical direction, each DRAM integrated circuit comprising a memory core of a plurality of cells and accessible at a first speed; an interface integrated circuit electrically coupled to the plurality of DRAM integrated circuits for providing an interface between the DRAM integrated circuits and the memory bus at a speed greater than the first speed; and a memory scheme wherein the plurality of DRAM integrated circuits comprise; “p” DRAM integrated circuits used as a working memory device for storing data across the “p” DRAM integrated circuits; and at least one additional DRAM integrated circuit for storing additional information for the data stored in the “p” DRAM integrated circuits; wherein “p” comprises an integer value.
Claim 20
Dependent Claim 26 words
The memory device as set forth in claim 15 , wherein: the memory scheme comprises a RAID memory scheme; and the additional information comprises parity information.
Claim 21
Dependent Claim 17 words
The memory device as set forth in claim 15 , wherein: the additional information comprises prefetch information.
Claim 22
Dependent Claim 111 words
A memory device for electrical connection to a memory bus, the memory device comprising: a plurality of dynamic random access memory (“DRAM”) integrated circuits, stacked in a vertical direction, each DRAM integrated circuit comprising a memory core of a plurality of cells and accessible at a first speed; an interface integrated circuit electrically coupled to the plurality of DRAM integrated circuits for providing an interface between the DRAM integrated circuits and the memory bus at a speed greater than the first speed; and a socket, coupled to the stacked plurality of DRAM integrated circuits, for adding at least one additional DRAM integrated circuit to the stacked plurality of DRAM integrated circuits.
Claim 23
Dependent Claim 111 words
A memory device for electrical connection to a memory bus, the memory device comprising: a plurality of dynamic random access memory (“DRAM”) integrated circuits, stacked in a vertical direction, each DRAM integrated circuit comprising a memory core of a plurality of cells and accessible at a first speed; an interface integrated circuit electrically coupled to the plurality of DRAM integrated circuits for providing an interface between the DRAM integrated circuits and the memory bus at a speed greater than the first speed; and a socket, coupled to the stacked plurality of DRAM integrated circuits, for adding at least one additional DRAM integrated circuit to the stacked plurality of DRAM integrated circuits.
Claim 24
Dependent Claim 24 words
The memory device as set forth in claim 18 , wherein: the interface integrated circuit is stacked with the plurality of DRAM integrated circuits.
Claim 25
Dependent Claim 125 words
A memory device for electrical connection to a memory bus, the memory device comprising: a plurality of dynamic random access memory (“DRAM”) integrated circuits, stacked in a vertical direction, each DRAM integrated circuit comprising a memory core of a plurality of cells and accessible at a first speed; and an interface integrated circuit electrically coupled to the plurality of DRAM integrated circuits for providing an interface between the DRAM integrated circuits and the memory bus at a speed greater than the first speed; wherein the plurality of DRAM integrated circuits includes: at least one DRAM integrated circuit which was incorporated into the memory device at manufacturing time; and at least one DRAM integrated circuit which was incorporated into the memory device at a later time.
Claim 26
Dependent Claim 125 words
A memory device for electrical connection to a memory bus, the memory device comprising: a plurality of dynamic random access memory (“DRAM”) integrated circuits, stacked in a vertical direction, each DRAM integrated circuit comprising a memory core of a plurality of cells and accessible at a first speed; and an interface integrated circuit electrically coupled to the plurality of DRAM integrated circuits for providing an interface between the DRAM integrated circuits and the memory bus at a speed greater than the first speed; wherein the plurality of DRAM integrated circuits includes: at least one DRAM integrated circuit which was incorporated into the memory device at manufacturing time; and at least one DRAM integrated circuit which was incorporated into the memory device at a later time.
Claim 27
Dependent Claim 105 words
A memory device for electrical connection to a memory bus, the memory device comprising: a plurality of dynamic random access memory (“DRAM”) integrated circuits, stacked in a vertical direction, each DRAM integrated circuit comprising a memory core of a plurality of cells and accessible at a first speed; an interface integrated circuit electrically coupled to the plurality of DRAM integrated circuits for providing an interface between the DRAM integrated circuits and the memory bus at a speed greater than the first speed; a printed circuit board; and a socket for mounting the plurality of DRAM integrated circuits in a rank to the printed circuit board.
Claim 28
Dependent Claim 105 words
A memory device for electrical connection to a memory bus, the memory device comprising: a plurality of dynamic random access memory (“DRAM”) integrated circuits, stacked in a vertical direction, each DRAM integrated circuit comprising a memory core of a plurality of cells and accessible at a first speed; an interface integrated circuit electrically coupled to the plurality of DRAM integrated circuits for providing an interface between the DRAM integrated circuits and the memory bus at a speed greater than the first speed; a printed circuit board; and a socket for mounting the plurality of DRAM integrated circuits in a rank to the printed circuit board.
Claim 29
Dependent Claim 104 words
A memory device for use with a memory bus, the memory bus comprising: a plurality of dynamic random access memory (“DRAM”) integrated circuits, stacked in a vertical direction, each comprising a memory core of a plurality of cells accessible at low speed; and an interface integrated circuit for providing an interface, at a high speed relative to the low speed, between the DRAM integrated circuits and the memory bus; wherein the interface integrated circuit is adapted for providing a predetermined electrical load on the memory bus independent of a number of the DRAM integrated circuits to which the interface integrated circuit is electrically coupled.
Claim 30
Dependent Claim 104 words
A memory device for use with a memory bus, the memory bus comprising: a plurality of dynamic random access memory (“DRAM”) integrated circuits, stacked in a vertical direction, each comprising a memory core of a plurality of cells accessible at low speed; and an interface integrated circuit for providing an interface, at a high speed relative to the low speed, between the DRAM integrated circuits and the memory bus; wherein the interface integrated circuit is adapted for providing a predetermined electrical load on the memory bus independent of a number of the DRAM integrated circuits to which the interface integrated circuit is electrically coupled.
Claim 31
Dependent Claim 107 words
A memory device for use with a memory bus, the memory bus comprising: means for stacking, in a vertical direction, a plurality of dynamic random access memory (“DRAM”) integrated circuits each comprising a memory core of a plurality of cells accessible at a first speed; and means for providing an interface between the DRAM integrated circuits and the memory bus at a speed greater than the first speed; wherein the means for providing the interface is adapted for providing a predetermined electrical load on the memory bus independent of a number of the DRAM integrated circuits to which the means for providing the interface is electrically coupled.
Claim 32
Dependent Claim 107 words
A memory device for use with a memory bus, the memory bus comprising: means for stacking, in a vertical direction, a plurality of dynamic random access memory (“DRAM”) integrated circuits each comprising a memory core of a plurality of cells accessible at a first speed; and means for providing an interface between the DRAM integrated circuits and the memory bus at a speed greater than the first speed; wherein the means for providing the interface is adapted for providing a predetermined electrical load on the memory bus independent of a number of the DRAM integrated circuits to which the means for providing the interface is electrically coupled.

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2011-05-27 2011-11-26 2012-05-27 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2015-05-27 2015-11-26 2016-05-27 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2019-05-27 2019-11-26 2020-05-27 $7700.00 Window Closed / Lapsed

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