US5973392A
Expired / Lapsed
US
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Stacked carrier three-dimensional memory module and semiconductor device using the same
Assignee: Godo Kaisha IP Bridge 1
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Filing: 1998-03-03
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Granted: 1999-10-26
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Expires: 2018-03-03
Abstract
Abstract A three-dimensional memory module includes a plurality of semiconductor device units, every adjacent two of which are stack-connected via through-holes by a bump connecting method. Each of the plurality of semiconductor device units includes a carrier having a circuit pattern and the through-holes connected to the circuit pattern. The semiconductor device unit also includes at least one semiconductor memory chip mounted on the carrier such that the semiconductor memory chip is connected to the circuit pattern, and at least one chip select semiconductor chip mounted on the carrier to be connected to the circuit pattern such that the chip select semiconductor chip can select the semiconductor memory chip.
Inventors
- 👤 Naoji Senba
- 👤 Yuzo Shimada
- 👤 Ikusi Morizaki
- 👤 Hideki Kusamitu
- 👤 Makoto Ohtsuka
- 👤 Katsumasa Hashimoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 02:21
CPC Classifications
H; H10; H10W; H10W90/00; H10D; H10D89/00; H10D89/10; H05; H05K; H05K7/00; H05K7/02; H05K7/023; H10B; H10B99/00; H10B99/10; H10D84/00; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W74/00; H10W74/10; H10W74/15; H10W90/20; H10W90/22; H10W90/297; H10W90/701; H10W90/721; H10W90/722; H10W90/724
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
102 words
A three-dimensional memory module comprising: a plurality of stacked semiconductor device units, an adjacent two of which are stack-connected via through-holes and connecting bumps, wherein each of said adjacent two semiconductor device units comprises: a carrier having a circuit pattern and said through-holes connected to said circuit pattern; at least one semiconductor memory chip mounted on said carrier such that said semiconductor memory chip is connected to said circuit pattern; and at least one chip select semiconductor chip mounted on said carrier to be connected to said circuit pattern such that said chip select semiconductor chip can select said semiconductor memory chip.
Claim 2
Dependent Claim
102 words
A three-dimensional memory module comprising: a plurality of stacked semiconductor device units, an adjacent two of which are stack-connected via through-holes and connecting bumps, wherein each of said adjacent two semiconductor device units comprises: a carrier having a circuit pattern and said through-holes connected to said circuit pattern; at least one semiconductor memory chip mounted on said carrier such that said semiconductor memory chip is connected to said circuit pattern; and at least one chip select semiconductor chip mounted on said carrier to be connected to said circuit pattern such that said chip select semiconductor chip can select said semiconductor memory chip.
Claim 3
Dependent Claim
32 words
A three-dimensional memory module according to claim 1, wherein said carrier further comprises a cavity, and said chip select semiconductor chip is mounted on a surface of said cavity of said carrier.
Claim 4
Dependent Claim
29 words
A three-dimensional memory module according to claim 2, wherein said at least one semiconductor memory chip is arranged to cover said chip select semiconductor chip via an insulative resin.
Claim 5
Dependent Claim
50 words
A three-dimensional memory module according to claim 1, wherein each of said semiconductor device units includes a plurality of semiconductor memory chips, and said plurality of semiconductor memory chips are arranged such that wiring lengths from said chip select semiconductor chip to said plurality of semiconductor memory chips are minimized.
Claim 6
Dependent Claim
163 words
A three-dimensional memory module comprising: a plurality of semiconductor device units, every adjacent two of which are stack-connected via through-holes by bumps, and wherein each of said plurality of semiconductor device units other than a specific one comprises: a carrier having a first circuit pattern and said through-holes of said each semiconductor device unit connected to said first circuit pattern; and at least one semiconductor memory chip mounted on said carrier such that said semiconductor memory chip is connected to said first circuit pattern, and wherein said specific semiconductor device unit comprises: a carrier having a second circuit pattern and said through-holes of said specific semiconductor device unit connected to said second circuit pattern; and at least one chip select semiconductor chip mounted on said carrier to be connected to said second circuit pattern such that said chip select semiconductor chip can select said semiconductor memory chip of one of said plurality of semiconductor device units other than said specific semiconductor device unit.
Claim 7
Dependent Claim
163 words
A three-dimensional memory module comprising: a plurality of semiconductor device units, every adjacent two of which are stack-connected via through-holes by bumps, and wherein each of said plurality of semiconductor device units other than a specific one comprises: a carrier having a first circuit pattern and said through-holes of said each semiconductor device unit connected to said first circuit pattern; and at least one semiconductor memory chip mounted on said carrier such that said semiconductor memory chip is connected to said first circuit pattern, and wherein said specific semiconductor device unit comprises: a carrier having a second circuit pattern and said through-holes of said specific semiconductor device unit connected to said second circuit pattern; and at least one chip select semiconductor chip mounted on said carrier to be connected to said second circuit pattern such that said chip select semiconductor chip can select said semiconductor memory chip of one of said plurality of semiconductor device units other than said specific semiconductor device unit.
Claim 8
Dependent Claim
44 words
A three-dimensional memory module according to claim 5, wherein said carrier of said specific semiconductor device unit further comprises a cavity, and said chip select semiconductor chip of said specific semiconductor device unit is mounted on a surface of said cavity of said carrier.
Claim 9
Dependent Claim
29 words
A three-dimensional memory module according to claim 6, wherein said at least one semiconductor memory chip is arranged to cover said chip select semiconductor chip via an insulative resin.
Claim 10
Dependent Claim
49 words
A three-dimensional memory modules according to claim 5, wherein each of said semiconductor device units includes a plurality of semiconductor memory chips, and said plurality of semiconductor memory chips are arranged such that distances from said chip select semiconductor chip to said plurality of semiconductor memory chips are minimized.
Claim 11
Dependent Claim
143 words
A semiconductor device, comprising: a circuit board having a first circuit pattern; and a plurality of three-dimensional memory modules mounted on said circuit board and connected to said first circuit pattern, and wherein each of said plurality of three-dimensional memory module comprises: a plurality of semiconductor device units, every adjacent two of which are stack-connected via through-holes by a bumps, and wherein each of said plurality of semiconductor device units comprises: a carrier having a second circuit pattern and said through-holes connected to said second circuit pattern; at least one semiconductor memory chip mounted on said carrier such that said semiconductor memory chip is connected to said second circuit pattern; and at least one chip select semiconductor chip mounted on said carrier to be connected to said second circuit pattern such that said chip select semiconductor chip can select said semiconductor memory chip.
Claim 12
Dependent Claim
143 words
A semiconductor device, comprising: a circuit board having a first circuit pattern; and a plurality of three-dimensional memory modules mounted on said circuit board and connected to said first circuit pattern, and wherein each of said plurality of three-dimensional memory module comprises: a plurality of semiconductor device units, every adjacent two of which are stack-connected via through-holes by a bumps, and wherein each of said plurality of semiconductor device units comprises: a carrier having a second circuit pattern and said through-holes connected to said second circuit pattern; at least one semiconductor memory chip mounted on said carrier such that said semiconductor memory chip is connected to said second circuit pattern; and at least one chip select semiconductor chip mounted on said carrier to be connected to said second circuit pattern such that said chip select semiconductor chip can select said semiconductor memory chip.
Claim 13
Dependent Claim
31 words
A semiconductor device according to claim 9, wherein said carrier further comprises a cavity, and said chip select semiconductor chip is mounted on a surface of said cavity of said carrier.
Claim 14
Dependent Claim
28 words
A semiconductor device according to claim 10, wherein said at least one semiconductor memory chip is arranged to cover said chip select semiconductor chip via an insulative resin.
Claim 15
Dependent Claim
48 words
A semiconductor device according to claim 9, wherein each of said semiconductor device units includes a plurality of semiconductor memory chips, and said plurality of semiconductor memory chips are arranged such that distances from said chip select semiconductor chip to said plurality of semiconductor memory chips are minimized.
Claim 16
Dependent Claim
185 words
A semiconductor device comprising: a circuit board having a first circuit pattern; and a plurality of three-dimensional memory modules mounted on said circuit board and connected to said first circuit pattern, wherein each of said plurality of three-dimensional memory module comprises: a plurality of semiconductor device units, every adjacent two of which are stack-connected via through-holes by bumps, and wherein each of said plurality of semiconductor device units other than a specific one comprises: a carrier having a second circuit pattern and associated through-holes connected to said second circuit pattern; and at least one semiconductor memory chip being mounted on said carrier such that said one semiconductor memory chip is connected to said second circuit pattern, and wherein said specific semiconductor device unit comprises: a carrier having a third circuit pattern and associated through-holes connected to said third circuit pattern; and a chip select semiconductor chip mounted on said carrier connected to said third circuit pattern such that said chip select semiconductor chip can select said semiconductor memory chip of one of said plurality of semiconductor device units other than said specific semiconductor device unit.
Claim 17
Dependent Claim
185 words
A semiconductor device comprising: a circuit board having a first circuit pattern; and a plurality of three-dimensional memory modules mounted on said circuit board and connected to said first circuit pattern, wherein each of said plurality of three-dimensional memory module comprises: a plurality of semiconductor device units, every adjacent two of which are stack-connected via through-holes by bumps, and wherein each of said plurality of semiconductor device units other than a specific one comprises: a carrier having a second circuit pattern and associated through-holes connected to said second circuit pattern; and at least one semiconductor memory chip being mounted on said carrier such that said one semiconductor memory chip is connected to said second circuit pattern, and wherein said specific semiconductor device unit comprises: a carrier having a third circuit pattern and associated through-holes connected to said third circuit pattern; and a chip select semiconductor chip mounted on said carrier connected to said third circuit pattern such that said chip select semiconductor chip can select said semiconductor memory chip of one of said plurality of semiconductor device units other than said specific semiconductor device unit.
Claim 18
Dependent Claim
43 words
A semiconductor device according to claim 13, wherein said carrier of said specific semiconductor device unit further comprises a cavity, and said chip select semiconductor chip of said specific semiconductor device unit is mounted on a surface of said cavity of said carrier.
Claim 19
Dependent Claim
28 words
A semiconductor device according to claim 14, wherein said at least one semiconductor memory chip is arranged to cover said chip select semiconductor chip via an insulative resin.
Claim 20
Dependent Claim
49 words
A semiconductor device according to claim 13, wherein each of said semiconductor device units includes a plurality of semiconductor memory chips, and said plurality of semiconductor memory chips are arranged such that wiring length from said chip select semiconductor chip to said plurality of semiconductor memory chips are minimized.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-10-25 | 2003-04-26 | 2003-10-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-10-25 | 2007-04-26 | 2007-10-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-10-25 | 2011-04-26 | 2011-10-26 | $7700.00 | Window Closed / Lapsed |