US5801438A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device mounting and multi-chip module
Assignee: NEC Corp
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Filing: 1996-06-14
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Granted: 1998-09-01
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Expires: 2016-06-14
Abstract
Abstract In a multi-chip module, a laminate wiring board is formed with stepped recesses. Electrodes to be connected to the electrodes of a bare-chip semiconductor device are subjected to non-electrolytic gold plating. This realizes wire bonding which is as short in distance and as low in loop as possible. To seal each recess with insulating resin, use is made of screen printing using a mesh screen which has a great aperture ratio and a small thickness.
Inventors
- 👤 Hirotsugu Shirakawa
- 👤 Yasunori Tanaka
- 👤 Tsunenobu Kouda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 03:28
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/18; H05K1/182; H05K1/183; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W90/00; H10W70/682; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W74/00; H10W74/10; H10W74/131; H10W74/142; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
78 words
A multi-chip module comprising: a surface mounting part as represented by a packaged semiconductor device; a bare-chip semiconductor device; a laminate wiring board; wherein said laminate wiring board is formed with a recess; wherein said bare-chip semiconductor device is mounted in said recess and sealed by resin; wherein said recess has a depth about 200 μm greater than a thickness of said bare-chip semiconductor device; and wherein said packaged semiconductor device is mounted to said laminate wiring board.
Claim 2
Dependent Claim
78 words
A multi-chip module comprising: a surface mounting part as represented by a packaged semiconductor device; a bare-chip semiconductor device; a laminate wiring board; wherein said laminate wiring board is formed with a recess; wherein said bare-chip semiconductor device is mounted in said recess and sealed by resin; wherein said recess has a depth about 200 μm greater than a thickness of said bare-chip semiconductor device; and wherein said packaged semiconductor device is mounted to said laminate wiring board.
Claim 3
Dependent Claim
98 words
A multi-chip module comprising: a laminate wiring board; a surface mounting part, as represented by a packaged semiconductor device, mounted to said wiring board; and a bare-chip semiconductor device; wherein said wiring board comprises a through hole, said bare-chip semiconductor device is mounted to said wiring board in said through hole and sealed therein by a resin, said through hole is larger than said bare-chip semiconductor device, and said bare-chip semiconductor device passes through said through hole; and wherein said recess has an areal dimension about 4 mm greater than the areal dimension of said bare-chip semiconductor device.
Claim 4
Dependent Claim
98 words
A multi-chip module comprising: a laminate wiring board; a surface mounting part, as represented by a packaged semiconductor device, mounted to said wiring board; and a bare-chip semiconductor device; wherein said wiring board comprises a through hole, said bare-chip semiconductor device is mounted to said wiring board in said through hole and sealed therein by a resin, said through hole is larger than said bare-chip semiconductor device, and said bare-chip semiconductor device passes through said through hole; and wherein said recess has an areal dimension about 4 mm greater than the areal dimension of said bare-chip semiconductor device.
Claim 5
Dependent Claim
27 words
A module as claimed in claim 2, wherein said through hole has a stepped configuration and includes an upper portion which is larger than a lower portion.
Claim 6
Dependent Claim
27 words
A module as claimed in claim 1, wherein said recess has an areal dimension about 4 mm greater than the areal dimension of said bare-chip semiconductor device.
Claim 7
Dependent Claim
102 words
A multi-chip module comprising: a surface mounting part as represented by a packaged semiconductor device; a bare-chip semiconductor device; a laminate wiring board; wherein said laminate wiring board is formed with a recess having a stepped configuration and including a lower portion having a depth greater than a thickness of said bare-chip semiconductor device; wherein said bare-chip semiconductor device is mounted in said recess and sealed by a resin; wherein said packaged semiconductor device is mounted to said laminate wiring board; and wherein said recess has an areal dimension about 4 mm greater than the areal dimension of said bare-chip semiconductor device.
Claim 8
Dependent Claim
102 words
A multi-chip module comprising: a surface mounting part as represented by a packaged semiconductor device; a bare-chip semiconductor device; a laminate wiring board; wherein said laminate wiring board is formed with a recess having a stepped configuration and including a lower portion having a depth greater than a thickness of said bare-chip semiconductor device; wherein said bare-chip semiconductor device is mounted in said recess and sealed by a resin; wherein said packaged semiconductor device is mounted to said laminate wiring board; and wherein said recess has an areal dimension about 4 mm greater than the areal dimension of said bare-chip semiconductor device.
Claim 9
Dependent Claim
22 words
A module as claimed in claim 1, wherein said resin projects less than 50 μm above an upper surface of said recess.
Claim 10
Dependent Claim
98 words
A multi-chip module comprising: a surface mounting part as represented by a packaged semiconductor device; a bare-chip semiconductor device; a laminate wiring board; wherein said laminate wiring board is formed with a recess having a stepped configuration and including a lower portion having a depth greater than a thickness of said bare-chip semiconductor device; wherein said bare-chip semiconductor device is mounted in said recess and sealed by a resin; and wherein said packaged semiconductor device is mounted to said laminate wiring board; and wherein said resin projects less than 50 μm above an upper surface of said recess.
Claim 11
Dependent Claim
98 words
A multi-chip module comprising: a surface mounting part as represented by a packaged semiconductor device; a bare-chip semiconductor device; a laminate wiring board; wherein said laminate wiring board is formed with a recess having a stepped configuration and including a lower portion having a depth greater than a thickness of said bare-chip semiconductor device; wherein said bare-chip semiconductor device is mounted in said recess and sealed by a resin; and wherein said packaged semiconductor device is mounted to said laminate wiring board; and wherein said resin projects less than 50 μm above an upper surface of said recess.
Claim 12
Dependent Claim
23 words
A module as claimed in claim 2, wherein said resin projects less than 50 μm above an upper surface of said through hole.
Claim 13
Dependent Claim
99 words
A multi-chip module comprising: a laminate wiring board; a surface mounting part, as represented by a packaged semiconductor device, mounted to said wiring board; and a bare-chip semiconductor device; wherein said wiring board comprises a through hole, said bare-chip semiconductor device is mounted to said wiring board in said through hole and sealed therein by a resin, said through hole is larger than said bare-chip semiconductor device, and said bare-chip semiconductor device passes through said through hole; and wherein said through hole has an areal dimension about 4 mm greater than the areal dimension of said bare-chip semiconductor device.
Claim 14
Dependent Claim
99 words
A multi-chip module comprising: a laminate wiring board; a surface mounting part, as represented by a packaged semiconductor device, mounted to said wiring board; and a bare-chip semiconductor device; wherein said wiring board comprises a through hole, said bare-chip semiconductor device is mounted to said wiring board in said through hole and sealed therein by a resin, said through hole is larger than said bare-chip semiconductor device, and said bare-chip semiconductor device passes through said through hole; and wherein said through hole has an areal dimension about 4 mm greater than the areal dimension of said bare-chip semiconductor device.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-08-31 | 2002-03-02 | 2002-09-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-08-31 | 2006-03-02 | 2006-09-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-08-31 | 2010-03-02 | 2010-09-01 | $7700.00 | Window Closed / Lapsed |