Semiconductor device

Abstract

Abstract PURPOSE: To enhance semiconductor chips provided on a module board in mounting density by a method wherein bump electrodes of different functions are provided so as not to confront each other, and the semiconductor chips connected to different leads are formed into groups. CONSTITUTION: Eight semiconductor chips 4A and 4B and eight semiconductor chips 4C and 4D are mounted on the front and rear of a module board 1 respectively. The semiconductor chips 4A to 4D are made to form an SRAM, and the surfaces of the semiconductor chips where semiconductor elements or wirings are provided are molded with silicone rubber or resin 7. Bump electrodes 6 of solder, Au or the like are provided on the semiconductor chips 4A to 4D respectively, and leads 5A to 5D are connected to the bump electrodes 6 through a TAB method. The semiconductor chip 4A is stacked on the semiconductor chip 4B, the leads 5A and 5B of them of the same function are connected together with solder. On the rear side of the module board 1, the semiconductor chips 4C and 4D and leads 5C and 5D are disposed the same as above. A semiconductor chip of different function from the other semiconductor chips is a decoder 3, and one selected out of eight semiconductor chips is made to serve as a decoder on both the front and rear of a module board.

Inventors

• 👤 Masayuki Watanabe
• 👤 昌行 渡辺
• 👤 Toshio Sugano
• 👤 利夫 菅野
• 👤 Seiichiro Tsukui
• 👤 誠一郎 津久井
• 👤 Takashi Ono
• 👤 貴司 小野
• 👤 Yoshiaki Wakashima
• 👤 喜昭 若島

Bibliographic Details