Patent US6734552B2 successfully refreshed from Google Patents.
US6734552B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Enhanced thermal dissipation integrated circuit package
Assignee: UTAC Headquarters Pte Ltd
•
Filing: 2001-07-11
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Granted: 2004-05-11
•
Expires: 2021-07-11
Abstract
Abstract In one aspect, the present invention relates to an integrated circuit package includes a scmiconductor die electrically connected to a substrate, a heat sink having a top and a side portion, the heat sink further including an extending finger when viewed from a top of the package, the extending finger including the side portion of the heat sink, a thermally conductive element thermally coupled with an interposed between both the semiconductor die and the heat sink, wherein the thermally conductive element does not directly contact the semiconductor die, and an encapsulant material encapsulating the thermally conductive element and the heat sink such that the top portion and the side portion of the heat sink are exposed to the surroundings of the package.
Inventors
- 👤 Edward G. Combs
- 👤 Robert P. Sheppard
- 👤 Tai Wai Pun
- 👤 Hau Wan Ng
- 👤 Chun Ho Fan
- 👤 Neil Robert McLellen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:51
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W72/00; H10W72/01; H10W72/0198; H10W72/071; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/877; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
110 words
An integrated circuit package, comprising: a semiconductor die electrically connected to a substrate; a heat sink comprising a top portion and a side portion, said heat sink further comprising an extending finger when viewed from a top of said package, said extending finger said side portion; a thermally conductive element thermally coupled with and interposed between both said semiconductor die and said heat sink, wherein said thermally conductive element does not directly contact said semiconductor die; and an encapsulant material encapsulating said thermally conductive element and said heat sink such that said top portion and said side portion of said beat sink are exposed to the surroundings of said package.
Claim 2
Dependent Claim
110 words
An integrated circuit package, comprising: a semiconductor die electrically connected to a substrate; a heat sink comprising a top portion and a side portion, said heat sink further comprising an extending finger when viewed from a top of said package, said extending finger said side portion; a thermally conductive element thermally coupled with and interposed between both said semiconductor die and said heat sink, wherein said thermally conductive element does not directly contact said semiconductor die; and an encapsulant material encapsulating said thermally conductive element and said heat sink such that said top portion and said side portion of said beat sink are exposed to the surroundings of said package.
Claim 3
Dependent Claim
21 words
The integrated circuit package of claim 1 , wherein said thermally conductive element is substantially shaped as a right rectangular solid.
Claim 4
Dependent Claim
35 words
The integrated circuit package of claim 1 , wherein said thermally conductive element is made of a material from the group consisting of alumina, aluminum nitride, beryllium oxide, ceramic material, copper, diamond compound, and metal.
Claim 5
Dependent Claim
21 words
The integrated circuit package of claim 1 , wherein said integrated circuit package is a ball grid array integrated circuit package.
Claim 6
Dependent Claim
23 words
The integrated circuit package of claim 1 , further comprising an interface element interposed between said thermally conductive element and said semiconductor die.
Claim 7
Dependent Claim
18 words
The integrated circuit package of claim 5 , wherein said interface element is made of a polymeric material.
Claim 8
Dependent Claim
27 words
The integrated circuit package of claim 1 , wherein a distance between said semiconductor die and said thermally conductive element is about five (5) mils or Less.
Claim 9
Dependent Claim
22 words
The integrated circuit package of claim 1 , wherein said semiconductor die is electrically connected to said substrate by direct chip attachment.
Claim 10
Dependent Claim
20 words
The integrated circuit package of claim 1 , wherein said extending finger extends from a corner of said heat sink.
Claim 11
Dependent Claim
128 words
An integrated circuit package, comprising: a semiconductor die electrically connected to a substrate; a heat sink comprising a top portion and a side portion, said heat sink further comprising an extending finger when viewed from a top of said package, said extending finger comprising said side portion; means for thermally coupling said semiconductor die with said heat sink to dissipate heat from said semiconductor die to the surroundings of said package, wherein said means for thermally coupling is interposed between said semiconductor die and said heat sink but does not directly contact said semiconductor die, and means for encapsulating said thermally conductive element and said heat sink such that said top portion and said side portion of said heat sink are exposed to the surroundings of said package.
Claim 12
Dependent Claim
128 words
An integrated circuit package, comprising: a semiconductor die electrically connected to a substrate; a heat sink comprising a top portion and a side portion, said heat sink further comprising an extending finger when viewed from a top of said package, said extending finger comprising said side portion; means for thermally coupling said semiconductor die with said heat sink to dissipate heat from said semiconductor die to the surroundings of said package, wherein said means for thermally coupling is interposed between said semiconductor die and said heat sink but does not directly contact said semiconductor die, and means for encapsulating said thermally conductive element and said heat sink such that said top portion and said side portion of said heat sink are exposed to the surroundings of said package.
Claim 13
Dependent Claim
20 words
The integrated circuit package of claim 10 , wherein said extending finger extends from a corner of sad heat sink.
Claim 14
Dependent Claim
195 words
An integrated circuit package, comprising: a substrate comprising: an upper race with an electrically conductive trace formed thereon; and a lower face with a plurality of solder balls electrically connected thereto, wherein said trace and at least one of said plurality of solder balls are electrically connected; a semiconductor die mounted on said upper face of said substrate, wherein said semiconductor die is electrically connected to said trace; a heat sink comprising a top portion and a plurality of side portions, said heat sink further comprising a plurality of extending fingers when viewed from a top of said package, each extending finger comprising at least one of said side portions; a thermally conductive element thermally coupled to but not in direct contact with said semiconductor die, wherein said thermally conductive element is substantially shaped as a right rectangular solid, is interposed between said semiconductor die and said heat sink, and is attached to said heat sink; and an encapsulant material formed to encapsulate said upper face of said substrate, said semiconductor die, said thermally conductive element and substantially all of said heat sink except said top portion and said side portions of said heat sink.
Claim 15
Dependent Claim
195 words
An integrated circuit package, comprising: a substrate comprising: an upper race with an electrically conductive trace formed thereon; and a lower face with a plurality of solder balls electrically connected thereto, wherein said trace and at least one of said plurality of solder balls are electrically connected; a semiconductor die mounted on said upper face of said substrate, wherein said semiconductor die is electrically connected to said trace; a heat sink comprising a top portion and a plurality of side portions, said heat sink further comprising a plurality of extending fingers when viewed from a top of said package, each extending finger comprising at least one of said side portions; a thermally conductive element thermally coupled to but not in direct contact with said semiconductor die, wherein said thermally conductive element is substantially shaped as a right rectangular solid, is interposed between said semiconductor die and said heat sink, and is attached to said heat sink; and an encapsulant material formed to encapsulate said upper face of said substrate, said semiconductor die, said thermally conductive element and substantially all of said heat sink except said top portion and said side portions of said heat sink.
Claim 16
Dependent Claim
23 words
The integrated circuit package of claim 12 , further comprising an interface element interposed between said thermally conductive element and said semiconductor die.
Claim 17
Dependent Claim
20 words
The integrated circuit package of claim 13 , wherein said interface element is in direct contact with said semiconductor die.
Claim 18
Dependent Claim
17 words
The integrated circuit package of claim 13 , wherein said interface element is made of a polymer.
Claim 19
Dependent Claim
25 words
The integrated circuit package of claim 12 , wherein said semiconductor die is mounted on said upper face of said substrate by direct chip attachment.
Claim 20
Dependent Claim
27 words
The integrated circuit package of claim 12 , wherein a distance between said semiconductor die and said thermally conductive element is about five (5) mils or less.
Claim 21
Dependent Claim
35 words
The integrated circuit package of claim 12 , wherein said thermally conductive element is made of a material from the group consisting of alumina, aluminum nitride, beryllium oxide, ceramic material, copper, diamond compound, and metal.
Claim 22
Dependent Claim
19 words
The integrated circuit package of claim 12 , wherein said top portion of said heat sink comprises a plating.
Claim 23
Dependent Claim
15 words
The integrated circuit package of claim 19 , wherein said plating is made of nickel.
Claim 24
Dependent Claim
20 words
The integrated circuit package of claim 12 , wherein said integrated circuit package is a ball grid integrated circuit package.
Claim 25
Dependent Claim
28 words
The integrated circuit package of claim 12 , the integrated circuit package of claim 3 , wherein said extending finger extends from a corner of said heat sink.
Claim 26
Dependent Claim
156 words
An integrated circuit package, comprising: a substrate comprising: means for electrically interconnecting a semiconductor die; and means for exchanging electrical signals with an outside device; a semiconductor die attached and electrically connected to said substrate by attachment means; a heat sink comprising a top portion and a side portion, said heat sink further comprising an extending finger when viewed from a top of said package, said extending finger comprising said side portion; means for thermally coupling said semiconductor die to said heat sink to dissipate heat from said semiconductor die to the surroundings of said package, wherein said means for thermally coupling is interposed between said semiconductor die and said heat sink but does not directly contact said semiconductor die; and means for encapsulating said semiconductor die, said thermally conductive element and said heat sink such that said top portion and said side portion of said heat sink are exposed to the surroundings of said package.
Claim 27
Dependent Claim
156 words
An integrated circuit package, comprising: a substrate comprising: means for electrically interconnecting a semiconductor die; and means for exchanging electrical signals with an outside device; a semiconductor die attached and electrically connected to said substrate by attachment means; a heat sink comprising a top portion and a side portion, said heat sink further comprising an extending finger when viewed from a top of said package, said extending finger comprising said side portion; means for thermally coupling said semiconductor die to said heat sink to dissipate heat from said semiconductor die to the surroundings of said package, wherein said means for thermally coupling is interposed between said semiconductor die and said heat sink but does not directly contact said semiconductor die; and means for encapsulating said semiconductor die, said thermally conductive element and said heat sink such that said top portion and said side portion of said heat sink are exposed to the surroundings of said package.
Claim 28
Dependent Claim
20 words
The integrated circuit package of claim 23 , wherein said extending finger extends from a corner of said heat sink.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-05-11 | 2007-11-10 | 2008-05-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-05-11 | 2011-11-10 | 2012-05-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-05-11 | 2015-11-10 | 2016-05-11 | $7700.00 | Window Closed / Lapsed |