US6281568B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Plastic integrated circuit device package and leadframe having partially undercut leads and die pad
Assignee: Amkor Technology Singapore Holding Pte Ltd
•
Filing: 1998-10-21
•
Granted: 2001-08-28
•
Expires: 2018-10-21
Abstract
Abstract Packages for an integrated circuit device and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, leads, bond wires, and an encapsulant. The lower surfaces of the die pad and leads are provided with a stepped profile by an etching step that etches partially through the thickness of a peripheral portion of the die pad, and also etches partially through the thickness of portions of the leads. Encapsulant material fills in beneath the recessed, substantially horizontal surfaces of the die pad and leads formed by the above-described etching step, and thereby prevents the die pad and leads from being pulled vertically from the package body. Other portions of the die pad and leads are exposed at the lower surface of the package for connecting the package externally. A metal leadframe for making an encapsulated package includes an outer frame. A die pad is within and connected to the frame. Leads extend from the frame toward the die pad without contacting the die pad. After an encapsulation step, the die pad and leads are severed from the leadframe, and a completed package is cut from the leadframe. A portion of the severed leads may extend laterally beyond the package sides, and may be bent upwards at an oblique angle to facilitate connection of a solder interconnection to the package. The packages may be made one at a time, or a plurality of packages may be made simultaneously. Packages may be cut from the leadframe with a punch or saw.
Inventors
- 👤 Thomas P. Glenn
- 👤 Scott J. Jewler
- 👤 David Roman
- 👤 J. H. Yee
- 👤 D. H. Moon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 22:24
CPC Classifications
H; H10; H10W; H10W72/00; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/411; H10W70/415; H10W70/427; H10W70/429; H10W74/00; H10W74/10; H10W74/111; H10W72/071; H10W72/075; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W72/952; H10W74/127; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49146; Y10T29/49169; Y10T29/49171
Claims Analysis
Total Claims: 44
Claim 1
Independent Claim
207 words
A package for an integrated circuit device comprising: a package body formed of a hardened encapsulant material; a plurality of metal leads having a first side and an opposite second side, the second side of each lead including a planar first portion and a second portion, wherein the planar first portion is exposed at a planar first external surface of the package body, the second portion is undercut so as to be recessed from the first portion, the second portion is covered with the encapsulant material, and the first portion of the second side of each lead is circular; a metal die pad separate from the leads and having a perimeter and an opposite second side, wherein the second side of the die pad includes a central portion and peripheral portion surrounding the central portion, the peripheral portion is undercut so as to be recessed from the central portion, and at least the peripheral portion of the second side of the die pad is covered by the encapsulant material; an integrated circuit device mounted on the first side of the die pad; and a plurality of electrical conductors, wherein an electrical conductor is electrically connected between the integrated circuit device and the first side of each lead.
Claim 2
Dependent Claim
207 words
A package for an integrated circuit device comprising: a package body formed of a hardened encapsulant material; a plurality of metal leads having a first side and an opposite second side, the second side of each lead including a planar first portion and a second portion, wherein the planar first portion is exposed at a planar first external surface of the package body, the second portion is undercut so as to be recessed from the first portion, the second portion is covered with the encapsulant material, and the first portion of the second side of each lead is circular; a metal die pad separate from the leads and having a perimeter and an opposite second side, wherein the second side of the die pad includes a central portion and peripheral portion surrounding the central portion, the peripheral portion is undercut so as to be recessed from the central portion, and at least the peripheral portion of the second side of the die pad is covered by the encapsulant material; an integrated circuit device mounted on the first side of the die pad; and a plurality of electrical conductors, wherein an electrical conductor is electrically connected between the integrated circuit device and the first side of each lead.
Claim 3
Dependent Claim
255 words
A package for an integrated circuit device comprising: a package body formed of a hardened encapsulant material; a plurality of metal leads having a first side and an opposite second side, the second side of each lead including a planar first portion and a second portion, wherein the planar first portion is exposed at a planar first external surface of the package body, the second portion is undercut so as to be recessed from the first portion, the second portion is covered with the encapsulant material, the second side of a plurality of the leads includes a third portion that is undercut so as to be recessed from the first portion of the second side of the lead, the third portion is covered with the encapsulant material, and the first portion of the second side of the lead is between the second portion and the third portion; a metal die pad separate from the leads and having a perimeter and an opposite second side, wherein the second side of the die pad includes a central portion and peripheral portion surrounding the central portion, the peripheral portion is undercut so as to be recessed from the central portion, and at least the peripheral portion of the second side of the die pad is covered by the encapsulant material; an integrated circuit device mounted on the first side of the die pad; and a plurality of electrical conductors, wherein an electrical conductor is electrically connected between the integrated circuit device and the first side of each lead.
Claim 4
Dependent Claim
255 words
A package for an integrated circuit device comprising: a package body formed of a hardened encapsulant material; a plurality of metal leads having a first side and an opposite second side, the second side of each lead including a planar first portion and a second portion, wherein the planar first portion is exposed at a planar first external surface of the package body, the second portion is undercut so as to be recessed from the first portion, the second portion is covered with the encapsulant material, the second side of a plurality of the leads includes a third portion that is undercut so as to be recessed from the first portion of the second side of the lead, the third portion is covered with the encapsulant material, and the first portion of the second side of the lead is between the second portion and the third portion; a metal die pad separate from the leads and having a perimeter and an opposite second side, wherein the second side of the die pad includes a central portion and peripheral portion surrounding the central portion, the peripheral portion is undercut so as to be recessed from the central portion, and at least the peripheral portion of the second side of the die pad is covered by the encapsulant material; an integrated circuit device mounted on the first side of the die pad; and a plurality of electrical conductors, wherein an electrical conductor is electrically connected between the integrated circuit device and the first side of each lead.
Claim 5
Dependent Claim
229 words
A package for an integrated circuit device comprising: a package body formed of a hardened encapsulant material; a plurality of metal leads having a first side and an opposite second side, the second side of each lead including a planar first portion and a second portion, wherein the planar first portion is exposed at a planar first external surface of the package body, the second portion is undercut so as to be recessed from the first portion, the second portion is covered with the encapsulant material, the package body has exterior side surfaces adjacent to the first external surface of the package body, and an end of each of the leads terminates in the plane of one of the side surfaces; a metal die pad separate from the leads and having a perimeter and an opposite second side, wherein the second side of the die pad includes a central portion and peripheral portion surrounding the central portion, the peripheral portion is undercut so as to be recessed from the central portion, and at least the peripheral portion of the second side of the die pad is covered by the encapsulant material; an integrated circuit device mounted on the first side of the die pad; and a plurality of electrical conductors, wherein an electrical conductor is electrically connected between the integrated circuit device and the first side of each lead.
Claim 6
Dependent Claim
229 words
A package for an integrated circuit device comprising: a package body formed of a hardened encapsulant material; a plurality of metal leads having a first side and an opposite second side, the second side of each lead including a planar first portion and a second portion, wherein the planar first portion is exposed at a planar first external surface of the package body, the second portion is undercut so as to be recessed from the first portion, the second portion is covered with the encapsulant material, the package body has exterior side surfaces adjacent to the first external surface of the package body, and an end of each of the leads terminates in the plane of one of the side surfaces; a metal die pad separate from the leads and having a perimeter and an opposite second side, wherein the second side of the die pad includes a central portion and peripheral portion surrounding the central portion, the peripheral portion is undercut so as to be recessed from the central portion, and at least the peripheral portion of the second side of the die pad is covered by the encapsulant material; an integrated circuit device mounted on the first side of the die pad; and a plurality of electrical conductors, wherein an electrical conductor is electrically connected between the integrated circuit device and the first side of each lead.
Claim 7
Dependent Claim
13 words
The package of claim 3 , wherein the exterior side surfaces are orthogonal.
Claim 8
Dependent Claim
234 words
A package for an integrated circuit device comprising: a package body formed of a hardened encapsulant material; a plurality of metal leads having a first side and an opposite second side, the second side of each lead including a planar first portion and a second portion, wherein the planar first portion is exposed at a planar first external surface of the package body, the second portion is undercut so as to be recessed from the first portion, the second portion is covered with the encapsulant material, the package body has tapered exterior side surfaces adjacent to the first external surface of the package body, and a short end portion of each of the leads is bent upwards and terminates along one of said exterior side surfaces; a metal die pad separate from the leads and having a perimeter and an opposite second side, wherein the second side of the die pad includes a central portion and peripheral portion surrounding the central portion, the peripheral portion is undercut so as to be recessed from the central portion, and at least the peripheral portion of the second side of the die pad is covered by the encapsulant material; an integrated circuit device mounted on the first side of the die pad; and a plurality of electrical conductors, wherein an electrical conductor is electrically connected between the integrated circuit device and the first side of each lead.
Claim 9
Dependent Claim
234 words
A package for an integrated circuit device comprising: a package body formed of a hardened encapsulant material; a plurality of metal leads having a first side and an opposite second side, the second side of each lead including a planar first portion and a second portion, wherein the planar first portion is exposed at a planar first external surface of the package body, the second portion is undercut so as to be recessed from the first portion, the second portion is covered with the encapsulant material, the package body has tapered exterior side surfaces adjacent to the first external surface of the package body, and a short end portion of each of the leads is bent upwards and terminates along one of said exterior side surfaces; a metal die pad separate from the leads and having a perimeter and an opposite second side, wherein the second side of the die pad includes a central portion and peripheral portion surrounding the central portion, the peripheral portion is undercut so as to be recessed from the central portion, and at least the peripheral portion of the second side of the die pad is covered by the encapsulant material; an integrated circuit device mounted on the first side of the die pad; and a plurality of electrical conductors, wherein an electrical conductor is electrically connected between the integrated circuit device and the first side of each lead.
Claim 10
Dependent Claim
210 words
A package for an integrated circuit device comprising: a package body formed of a hardened encapsulant material; a plurality of metal leads having a first side and an opposite second side, the second side of each lead including a planar first portion and a second portion, wherein the planar first portion is exposed at a planar first external surface of the package body, the second portion is undercut so as to be recessed from the first portion, the second portion is covered with the encapsulant material, and the integrated circuit device extends over the first side of a plurality of the leads; a metal die pad separate from the leads and having a perimeter and an opposite second side, wherein the second side of the die pad includes a central portion and peripheral portion surrounding the central portion, the peripheral portion is undercut so as to be recessed from the central portion, and at least the peripheral portion of the second side of the die pad is covered by the encapsulant material; an integrated circuit device mounted on the first side of the die pad, and a plurality of electrical conductors, wherein an electrical conductor is electrically connected between the integrated circuit device and the first side of each lead.
Claim 11
Dependent Claim
210 words
A package for an integrated circuit device comprising: a package body formed of a hardened encapsulant material; a plurality of metal leads having a first side and an opposite second side, the second side of each lead including a planar first portion and a second portion, wherein the planar first portion is exposed at a planar first external surface of the package body, the second portion is undercut so as to be recessed from the first portion, the second portion is covered with the encapsulant material, and the integrated circuit device extends over the first side of a plurality of the leads; a metal die pad separate from the leads and having a perimeter and an opposite second side, wherein the second side of the die pad includes a central portion and peripheral portion surrounding the central portion, the peripheral portion is undercut so as to be recessed from the central portion, and at least the peripheral portion of the second side of the die pad is covered by the encapsulant material; an integrated circuit device mounted on the first side of the die pad, and a plurality of electrical conductors, wherein an electrical conductor is electrically connected between the integrated circuit device and the first side of each lead.
Claim 12
Dependent Claim
21 words
The package of claim 6 , wherein the integrated circuit device extends over the first side of all of the leads.
Claim 13
Dependent Claim
35 words
The package of claim 6 , further comprising an insulative material within said encapsulant material and between the integrated circuit device and the first side of the leads over which the integrated circuit device extends.
Claim 14
Dependent Claim
13 words
The package of claim 6 , wherein the electrical conductors include bond wires.
Claim 15
Dependent Claim
217 words
A package for an integrated circuit device comprising: a package body formed of a hardened encapsulant material; a plurality of metal leads having a first side and an opposite second side, the second side of each lead including a planar first portion and a second portion, wherein the planar first portion is exposed at a planar first external surface of the package body, the second portion is undercut so as to be recessed from the first portion, the second portion is covered with the encapsulant material, and the first portions of the second sides of a plurality of the leads are fully within a perimeter of the package body; a metal die pad separate from the leads and having a perimeter and an opposite second side, wherein the second side of the die pad includes a central portion and peripheral portion surrounding the central portion, the peripheral portion is undercut so as to be recessed from the central portion, and at least the peripheral portion of the second side of the die pad is covered by the encapsulant material; an integrated circuit device mounted on the first side of the die pad; and a plurality of electrical conductors, wherein an electrical conductor is electrically connected between the integrated circuit device and the first side of each lead.
Claim 16
Dependent Claim
217 words
A package for an integrated circuit device comprising: a package body formed of a hardened encapsulant material; a plurality of metal leads having a first side and an opposite second side, the second side of each lead including a planar first portion and a second portion, wherein the planar first portion is exposed at a planar first external surface of the package body, the second portion is undercut so as to be recessed from the first portion, the second portion is covered with the encapsulant material, and the first portions of the second sides of a plurality of the leads are fully within a perimeter of the package body; a metal die pad separate from the leads and having a perimeter and an opposite second side, wherein the second side of the die pad includes a central portion and peripheral portion surrounding the central portion, the peripheral portion is undercut so as to be recessed from the central portion, and at least the peripheral portion of the second side of the die pad is covered by the encapsulant material; an integrated circuit device mounted on the first side of the die pad; and a plurality of electrical conductors, wherein an electrical conductor is electrically connected between the integrated circuit device and the first side of each lead.
Claim 17
Dependent Claim
37 words
The package of claim 10 , wherein the leads are arranged so that the exposed first portions of the second sides of the leads form an array with a plurality of rows and a plurality of columns.
Claim 18
Dependent Claim
19 words
The package of claim 11 , wherein the first portion of the second side of each lead is circular.
Claim 19
Dependent Claim
246 words
A package for an integrated circuit device comprising: a package body formed of a hardened encapsulant material; a plurality of metal leads having a first side and an opposite second side, and the second side of each lead including a planar first portion and a second portion, wherein the planar first portion is exposed at a planar first external surface of the package body, the second portion is undercut so as to be recessed from the first portion, the second portion is covered with the encapsulant material, and the leads are arranged so that the exposed first portions of the second sides of the leads form an array with a plurality of rows and a plurality of columns; a metal die pad separate from the leads and having a perimeter and an opposite second side, wherein the second side of the die pad includes a central portion and peripheral portion surrounding the central portion, the peripheral portion is undercut so as to be recessed from the central portion, the peripheral portion of the second side of the die pad is covered by the encapsulant material, and the central portion of the second side of the die pad is exposed at the first external surface of the package body; an integrated circuit device mounted on the first side of the die pad; and a plurality of electrical conductors, wherein an electrical conductor is electrically connected between the integrated circuit device and the first side of each lead.
Claim 20
Dependent Claim
246 words
A package for an integrated circuit device comprising: a package body formed of a hardened encapsulant material; a plurality of metal leads having a first side and an opposite second side, and the second side of each lead including a planar first portion and a second portion, wherein the planar first portion is exposed at a planar first external surface of the package body, the second portion is undercut so as to be recessed from the first portion, the second portion is covered with the encapsulant material, and the leads are arranged so that the exposed first portions of the second sides of the leads form an array with a plurality of rows and a plurality of columns; a metal die pad separate from the leads and having a perimeter and an opposite second side, wherein the second side of the die pad includes a central portion and peripheral portion surrounding the central portion, the peripheral portion is undercut so as to be recessed from the central portion, the peripheral portion of the second side of the die pad is covered by the encapsulant material, and the central portion of the second side of the die pad is exposed at the first external surface of the package body; an integrated circuit device mounted on the first side of the die pad; and a plurality of electrical conductors, wherein an electrical conductor is electrically connected between the integrated circuit device and the first side of each lead.
Claim 21
Dependent Claim
150 words
A package for an integrated circuit device comprising: a package body formed of a hardened encapsulant material; a plurality of metal leads having a first side and an opposite second side, wherein the second side of each lead includes a first portion exposed at a planar first external surface of the package body and a second portion that is undercut so as to be recessed from the first portion, the second portion being covered with the encapsulant material; a metal die pad separate from the leads and having a planar first side having a perimeter; an integrated circuit device mounted on the first side of the die pad, wherein the integrated circuit device extends over the perimeter of the first side of the die pad; and a plurality of electrical conductors, wherein an electrical conductor is electrically connected between the integrated circuit device and the first side of each lead.
Claim 22
Dependent Claim
150 words
A package for an integrated circuit device comprising: a package body formed of a hardened encapsulant material; a plurality of metal leads having a first side and an opposite second side, wherein the second side of each lead includes a first portion exposed at a planar first external surface of the package body and a second portion that is undercut so as to be recessed from the first portion, the second portion being covered with the encapsulant material; a metal die pad separate from the leads and having a planar first side having a perimeter; an integrated circuit device mounted on the first side of the die pad, wherein the integrated circuit device extends over the perimeter of the first side of the die pad; and a plurality of electrical conductors, wherein an electrical conductor is electrically connected between the integrated circuit device and the first side of each lead.
Claim 23
Dependent Claim
61 words
The package of claim 14 , wherein the die pad has a second side opposite the first side, and the second side includes a central portion and a peripheral portion surrounding the central portion, wherein the peripheral portion is undercut so as to be recessed from the central portion, and at least the peripheral portion is covered by the encapsulant material.
Claim 24
Dependent Claim
29 words
The package of claim 15 , wherein the central portion of the second side of the die pad is exposed at the first exterior surface of the package body.
Claim 25
Dependent Claim
29 words
The package of claim 14 , wherein the die pad has a second side opposite the first side and the second side is fully covered with the encapsulant material.
Claim 26
Dependent Claim
19 words
The package of claim 14 , wherein the first portion of the second side of each lead is rectangular.
Claim 27
Dependent Claim
19 words
The package of claim 14 , wherein the first portion of the second side of each lead is circular.
Claim 28
Dependent Claim
68 words
The package of claim 14 , wherein the second side of a plurality of the leads includes a third portion that is undercut so as to be recessed from the first portion of the second side of the lead, the third portion is covered with the encapsulant material, and the first portion of the second side of the lead is between the second portion and the third portion.
Claim 29
Dependent Claim
42 words
The package of claim 14 , wherein the package body has exterior side surfaces adjacent to the first external surface of the package body, and an end of each of the leads terminates in the plane of one of the side surfaces.
Claim 30
Dependent Claim
13 words
The package of claim 21 , wherein the exterior side surfaces are orthogonal.
Claim 31
Dependent Claim
47 words
The package of claim 14 , wherein the package body has tapered exterior side surfaces adjacent to the first external surface of the package body, and a short end portion of each of the leads is bent upwards and terminates along one of said exterior side surfaces.
Claim 32
Dependent Claim
22 words
The package of claim 14 , wherein the integrated circuit device extends over the first side of a plurality of the leads.
Claim 33
Dependent Claim
21 words
The package of claim 24 , wherein the integrated circuit device extends over the first side of all of the leads.
Claim 34
Dependent Claim
37 words
The package of claim 24 , further comprising an insulative material within the encapsulant material and between the integrated circuit device and the first side of plurality of the leads over which the integrated circuit device extends.
Claim 35
Dependent Claim
26 words
The package of claim 14 , wherein the first portions of the second sides of the leads are fully within a perimeter of the package body.
Claim 36
Dependent Claim
37 words
The package of claim 14 , wherein the leads are arranged so that the exposed first portions of the second sides of the leads form an array with a plurality of rows and a plurality of columns.
Claim 37
Dependent Claim
34 words
The package of claim 24 , wherein the leads are arranged so that the exposed first portions of the second sides of the leads form an array with a plurality of rows and columns.
Claim 38
Dependent Claim
68 words
The package of claim 16 , wherein the second side of a plurality of the leads includes a third portion that is undercut so as to be recessed from the first portion of the second side of the lead, the third portion is covered with the encapsulant material, and the first portion of the second side of the lead is between the second portion and the third portion.
Claim 39
Dependent Claim
13 words
The package of claim 24 , where the electrical conductors include bond wires.
Claim 40
Dependent Claim
161 words
A leadframe for making a plastic integrated circuit device package comprising: a disposable metal frame; a plurality of metal leads integrally connected to the frame, and having a planar first side and an opposite second side, wherein the second side of each lead includes a planar first portion and a second portion, the second portion being undercut so as to be recessed from the first portion, and the leads are arranged so that the first portions of the second sides of the leads form an array with a plurality of rows and a plurality of columns; and a metal die pad connected to the frame and physically isolated from the leads, said die pad having a planar first side having a perimeter and an opposite second side, wherein the second side of the die pad includes a central portion and peripheral portion surrounding the central portion, and the peripheral portion is undercut so as to be recessed from the central portion.
Claim 41
Dependent Claim
161 words
A leadframe for making a plastic integrated circuit device package comprising: a disposable metal frame; a plurality of metal leads integrally connected to the frame, and having a planar first side and an opposite second side, wherein the second side of each lead includes a planar first portion and a second portion, the second portion being undercut so as to be recessed from the first portion, and the leads are arranged so that the first portions of the second sides of the leads form an array with a plurality of rows and a plurality of columns; and a metal die pad connected to the frame and physically isolated from the leads, said die pad having a planar first side having a perimeter and an opposite second side, wherein the second side of the die pad includes a central portion and peripheral portion surrounding the central portion, and the peripheral portion is undercut so as to be recessed from the central portion.
Claim 42
Dependent Claim
19 words
The leadframe of claim 32 , wherein the first portion of the second side of each lead is circular.
Claim 43
Dependent Claim
19 words
The leadframe of claim 32 , wherein the first portion of the second side of each lead is rectangular.
Claim 44
Dependent Claim
59 words
The leadframe of claim 32 , wherein the second side of a plurality of the leads includes a third portion that is undercut so as to be recessed from the first portion of the second side of the lead, and the first portion of the second side of the lead is between the second portion and the third portion.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-08-27 | 2005-02-26 | 2005-08-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-08-27 | 2009-02-26 | 2009-08-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-08-27 | 2013-02-26 | 2013-08-28 | $7700.00 | Window Closed / Lapsed |