Method for producing multilayer printed wiring boards

Claim 1

A method for producing a multilayer printed wiring board comprising the steps of: (a) applying and forming an etching resist film in a desired pattern on a desired position on a conductive layer; (b) etching said conductive layer through said etching resist film serving as a mask to form a wiring a pattern; (c) applying a photosensitive insulating resin on the upper face of the etched conductive layer; (d) photopolymerizing desired portions of the resulting photosensitive insulating resin layer; (e) removing the portions of the photosensitive insulating resin layer free of photopolymerization to expose the conductive portion on said etched conductive layer and to form photoviaholes; (f) hardening the photopolymerized portion of said photosensitive insulating resin layer by a method which comprises at least the step of either heating or irradiating with ultraviolet rays; (g) plating the surface of the hardened photosensitive insulating resin layer to form a conductive layer; (h) repeating a series of the foregoing steps to form a multilayered board and then printing a desired pattern on said multilayered board with a conductive paste; and (i) adhering, under heat and pressure, at least two said multilayered boards through a prepeg layer in which clearances are formed at positions corresponding to the printed pattern of said conductive paste.

Claim 2

A method for producing a multilayer printed wiring board comprising the steps of: (a) applying and forming an etching resist film in a desired pattern on a desired position on a conductive layer; (b) etching said conductive layer through said etching resist film serving as a mask to form a wiring a pattern; (c) applying a photosensitive insulating resin on the upper face of the etched conductive layer; (d) photopolymerizing desired portions of the resulting photosensitive insulating resin layer; (e) removing the portions of the photosensitive insulating resin layer free of photopolymerization to expose the conductive portion on said etched conductive layer and to form photoviaholes; (f) hardening the photopolymerized portion of said photosensitive insulating resin layer by a method which comprises at least the step of either heating or irradiating with ultraviolet rays; (g) plating the surface of the hardened photosensitive insulating resin layer to form a conductive layer; (h) repeating a series of the foregoing steps to form a multilayered board and then printing a desired pattern on said multilayered board with a conductive paste; and (i) adhering, under heat and pressure, at least two said multilayered boards through a prepeg layer in which clearances are formed at positions corresponding to the printed pattern of said conductive paste.

Claim 6

A method for producing a multilayer printed wiring board which comprises six conductive layers comprising the steps of; (1) preparing a copper-laminated plate serving as a base for a multilayered board, said copper-laminated plate being provided, on both upper and lower faces, with copper foil layers on which conductive patterns for 5th and 6th layers are subsequently formed; (2) forming via holes through said copper-laminated plate by a drill; (3) forming conductive layers on the entire surface of said copper-laminated plate including said via holes by an electroless plating or electroplating method to electrically connect the 5th copper foil layer and the 6th copper foil layer of said copper-laminated plate; (4) covering the entire surface of the 6th conductive layer and desired portions for forming circuit patterns on the 5th conductive layer with a photosensitive dry film resist according to a tenting method, followed by development, etching and peeling off of the resist to form circuit patterns on said 5th conductive layer and copper foil layer; (5) applying a photosensitive insulating resin onto the entire surface including said 5th conductive layer on which the circuit pattern has been formed, according to a screen printing method; (6) closely adhering a mask film to the resulting photosensitive insulating resin layer and exposing said insulating resin layer to ultraviolet rays to thus photopolymerize the desired portions thereof; (7) removing the portions of the photosensitive insulating resin layer free of photopolymerization by development to form photoviaholes, then hardening the remaining photosensitive insulating resin layer by heating and irradiating with ultraviolet rays and surface-roughening the hardened photosensitive insulating resin layer by mechanical or chemical graining; (8) then forming a 4th conductive layer and a lower-most conductive layer on the entire surface of the plate including said photoviaholes by an electroless plating or electroplating method to thus connect said 5th conductive layer and said 4th conductive layer; (9) covering the entire surface of the lower-most conductive layer and desired portions on said 4th conductive layer for subsequently forming circuit patterns with a photosensitive dry film resist according to a tenting method, followed by development, etching and peeling off of the resist to form circuit patterns on said 4th conductive layer; (10) applying a conductive paste onto said photoviaholes on said 4th conductive layer through a metal mask to give a first multilayered board; (11) separately preparing a second multilayered board by repeating a series of the foregoing processes, in this second multilayered board, desired circuit patterns being formed on a 2nd copper foil layer, a 2nd conductive layer and a 3rd conductive layer; (12) assembling said first and second multilayered boards through a prepreg layer in which clearances are formed at positions corresponding to the pattern of said conductive paste and then applying heat and pressure thereto to give an integrally formed multilayered board, at this stage, said conductive paste being converted into a conductor and said 3rd conductive layer on said second multilayered board being electrically connected to said 4th conductive layer on said first multilayered board; and (13) covering desired portions on the upper-most and lower-most layers on which circuit patterns are subsequently formed with a photosensitive dry film resist, followed by the removal of unnecessary portions of the conductive layers, those of the underlying layers and the copper foil layers through etching to give an intended multilayer printed wiring board.

Claim 7

A method for producing a multilayer printed wiring board which comprises six conductive layers comprising the steps of; (1) preparing a copper-laminated plate serving as a base for a multilayered board, said copper-laminated plate being provided, on both upper and lower faces, with copper foil layers on which conductive patterns for 5th and 6th layers are subsequently formed; (2) forming via holes through said copper-laminated plate by a drill; (3) forming conductive layers on the entire surface of said copper-laminated plate including said via holes by an electroless plating or electroplating method to electrically connect the 5th copper foil layer and the 6th copper foil layer of said copper-laminated plate; (4) covering the entire surface of the 6th conductive layer and desired portions for forming circuit patterns on the 5th conductive layer with a photosensitive dry film resist according to a tenting method, followed by development, etching and peeling off of the resist to form circuit patterns on said 5th conductive layer and copper foil layer; (5) applying a photosensitive insulating resin onto the entire surface including said 5th conductive layer on which the circuit pattern has been formed, according to a screen printing method; (6) closely adhering a mask film to the resulting photosensitive insulating resin layer and exposing said insulating resin layer to ultraviolet rays to thus photopolymerize the desired portions thereof; (7) removing the portions of the photosensitive insulating resin layer free of photopolymerization by development to form photoviaholes, then hardening the remaining photosensitive insulating resin layer by heating and irradiating with ultraviolet rays and surface-roughening the hardened photosensitive insulating resin layer by mechanical or chemical graining; (8) then forming a 4th conductive layer and a lower-most conductive layer on the entire surface of the plate including said photoviaholes by an electroless plating or electroplating method to thus connect said 5th conductive layer and said 4th conductive layer; (9) covering the entire surface of the lower-most conductive layer and desired portions on said 4th conductive layer for subsequently forming circuit patterns with a photosensitive dry film resist according to a tenting method, followed by development, etching and peeling off of the resist to form circuit patterns on said 4th conductive layer; (10) applying a conductive paste onto said photoviaholes on said 4th conductive layer through a metal mask to give a first multilayered board; (11) separately preparing a second multilayered board by repeating a series of the foregoing processes, in this second multilayered board, desired circuit patterns being formed on a 2nd copper foil layer, a 2nd conductive layer and a 3rd conductive layer; (12) assembling said first and second multilayered boards through a prepreg layer in which clearances are formed at positions corresponding to the pattern of said conductive paste and then applying heat and pressure thereto to give an integrally formed multilayered board, at this stage, said conductive paste being converted into a conductor and said 3rd conductive layer on said second multilayered board being electrically connected to said 4th conductive layer on said first multilayered board; and (13) covering desired portions on the upper-most and lower-most layers on which circuit patterns are subsequently formed with a photosensitive dry film resist, followed by the removal of unnecessary portions of the conductive layers, those of the underlying layers and the copper foil layers through etching to give an intended multilayer printed wiring board.