US4701781A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Pre-testable semiconductor die package
Assignee: National Semiconductor Corp
•
Filing: 1984-07-05
•
Granted: 1987-10-20
•
Expires: 2004-07-05
Abstract
Abstract An encapsulated die package (20) is shown in which a semiconductor die is connected in a die-attach aperture of a copper foil tape (11). Die contact pads (31) are bonded to the inner ends (31a) of interconnected finger contacts (13) on the tape. Finger contacts etched in the foil include splayed out portions (15) extending to probe ends (19). Interconnect cross-links (16) initially connect the finger contacts and the tape edges and function as dam bars in subsequent encapsulation steps. The die and die bonds are mold encapsulated to form the die package (20) and a carrier frame (17) is simultaneously molded around and spaced from the periphery of package (20). The probe ends are exposed within a slot (34) in the frame or extend from the ends of the frame so that probe tips can be pressed thereon to test the die and its bonds. Prior to testing, the interconnects exposed in the annulus between the package and the carrier are blanked out so that each finger leading from a die contact pad becomes discrete, i.e. is no longer interconnected to an adjoining finger, so that testing of each die contact and bond can be done. The stiff molded carrier acts to support the probe ends of the fingers and protects and stiffens the foil tape for the testing operations and for shipping and handling purposes.
Inventors
- 👤 Thanomsak Sankhagowit
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 03:46
CPC Classifications
H; H10; H10P; H10P74/00; H10P74/27; H10P74/273; G; G01; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2894; G01R31/2896; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/438; G01R1/00; G01R1/02; G01R1/04; G01R1/0408; H10W90/00; H10W90/701; H10W90/721; H10W90/726
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
189 words
A pre-testable lead-frame assembly comprising: a conductive foil substrate having multiple interconnected finger contacts extending from a die-receiving area, said finger contacts having inner ends bonded to contact pads on a die placed in said area, exposed outer ends forming test probe sites and intermediate portions extending between said inner and said outer ends; said intermediate portions including cross links interconnecting adjacent finger contacts for stabilizing the position of said fingers prior to die bonding and acting to create dam bars useful in controlling the plastic flow in an encapsulation operation; an insulative encapsulant surrounding said die and the inner ends of said finger contacts to form a package from which said intermediate portions extend to form package pins; an insulative support carrier spaced from and surrounding said package and extending at least transversely of and bonded to said finger contacts to temporarily support said exposed outer ends for test purposes, said cross links being exposed between said support carrier and said package so that they can be removed after said die is encapsulated to form discrete insulated testable finger contacts extending from said die to said outer ends.
Claim 2
Dependent Claim
189 words
A pre-testable lead-frame assembly comprising: a conductive foil substrate having multiple interconnected finger contacts extending from a die-receiving area, said finger contacts having inner ends bonded to contact pads on a die placed in said area, exposed outer ends forming test probe sites and intermediate portions extending between said inner and said outer ends; said intermediate portions including cross links interconnecting adjacent finger contacts for stabilizing the position of said fingers prior to die bonding and acting to create dam bars useful in controlling the plastic flow in an encapsulation operation; an insulative encapsulant surrounding said die and the inner ends of said finger contacts to form a package from which said intermediate portions extend to form package pins; an insulative support carrier spaced from and surrounding said package and extending at least transversely of and bonded to said finger contacts to temporarily support said exposed outer ends for test purposes, said cross links being exposed between said support carrier and said package so that they can be removed after said die is encapsulated to form discrete insulated testable finger contacts extending from said die to said outer ends.
Claim 3
Dependent Claim
24 words
The invention of claim 1 in which said finger contacts intermediate portions are parallel and said outer ends are splayed from said parallel portions.
Claim 4
Dependent Claim
48 words
The invention of claim 1 in which said substrate is in the form of a continuous single layer metal flexible strip having continuous linear arrays of multiple interconnected parallel finger contacts extending from die-receiving areas and said contacts being parallel to peripheral linear edge portions of said strip.
Claim 5
Dependent Claim
22 words
The invention of claim 1 wherein said die is encapsulated and said carrier peripherally surrounds and is spaced from said encapsulated die.
Claim 6
Dependent Claim
23 words
The invention of claim 1 wherein said carrier includes at least one transverse ledge for supporting said exposed outer ends of said contacts.
Claim 7
Dependent Claim
174 words
A semiconductor die package comprising a pre-testable die-mounting and lead frame tape, wherein said tape comprises: an elongated single layer conductive foil substrate having a series of conductive pathways including beam ends extending to a die-attach area, lead frame fingers extending outwardly from said beam ends and said area and links interconnecting said fingers for stabilizing said fingers prior to bonding and to act as dam bars in molding; means for mounting a die containing contact pads in said area; means for connecting said contact pads to said beam ends; means for molding an encapsulant around said die and said connected base ends to form a die package having a portion of said lead frame fingers extending outboard therefrom and wherein said links act as molding dam bars; means for molding an insulative carrier over an outboard portion of said lead frame fingers outboard of said links to support said outboard fingers; means for disconnecting said lead frame finger links; and means for accessing for testing individual ones of said fingers adjacent said carrier.
Claim 8
Dependent Claim
174 words
A semiconductor die package comprising a pre-testable die-mounting and lead frame tape, wherein said tape comprises: an elongated single layer conductive foil substrate having a series of conductive pathways including beam ends extending to a die-attach area, lead frame fingers extending outwardly from said beam ends and said area and links interconnecting said fingers for stabilizing said fingers prior to bonding and to act as dam bars in molding; means for mounting a die containing contact pads in said area; means for connecting said contact pads to said beam ends; means for molding an encapsulant around said die and said connected base ends to form a die package having a portion of said lead frame fingers extending outboard therefrom and wherein said links act as molding dam bars; means for molding an insulative carrier over an outboard portion of said lead frame fingers outboard of said links to support said outboard fingers; means for disconnecting said lead frame finger links; and means for accessing for testing individual ones of said fingers adjacent said carrier.
Claim 9
Dependent Claim
36 words
The invention of claim 6 further including means for trimming said carrier including said outboard portions of said lead frame fingers from said substrate resulting in a pre-testable die package having discrete contact fingers extending therefrom.
Claim 10
Dependent Claim
149 words
A pre-testable lead frame assembly comprising: a conductive foil substrate having multiple finger contact patterns, each of said patterns including finger contacts extending from a die-receiving area, said finger contacts having inner ends bonded to the contact pads on a semiconductor die placed in said area, exposed outer ends forming test probe sites, and intermediate portions extending between said inner and outer ends; an insulative encapsulant surrounding said die and the inner ends of said finger contacts to from a package from which said intermediate portions extend to form package pins; and an insulative support carrier located on said foil substrate to generally surround said package, said support carrier being spaced from said package and made sufficiently stiff to act as a mechanical handling aid for said lead frame assembly and to provide backing for said exposed outer ends of said finger contact when test probes are applied thereto.
Claim 11
Dependent Claim
149 words
A pre-testable lead frame assembly comprising: a conductive foil substrate having multiple finger contact patterns, each of said patterns including finger contacts extending from a die-receiving area, said finger contacts having inner ends bonded to the contact pads on a semiconductor die placed in said area, exposed outer ends forming test probe sites, and intermediate portions extending between said inner and outer ends; an insulative encapsulant surrounding said die and the inner ends of said finger contacts to from a package from which said intermediate portions extend to form package pins; and an insulative support carrier located on said foil substrate to generally surround said package, said support carrier being spaced from said package and made sufficiently stiff to act as a mechanical handling aid for said lead frame assembly and to provide backing for said exposed outer ends of said finger contact when test probes are applied thereto.
Claim 12
Dependent Claim
27 words
The lead frame assembly of claim 8 wherein said support carrier is made thicker than said package whereby said support carrier also acts to protect said package.
Claim 13
Dependent Claim
24 words
The lead frame assembly of claim 8 wherein said support carrier includes notches that accommodate and expose said outer ends of said finger contacts.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-10-19 | 1991-04-20 | 1991-10-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-10-19 | 1995-04-20 | 1995-10-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-10-19 | 1999-04-20 | 1999-10-20 | $7700.00 | Window Closed / Lapsed |