US5650593A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Thermally enhanced chip carrier package
Assignee: Amkor Technology Singapore Holding Pte Ltd
•
Filing: 1995-02-06
•
Granted: 1997-07-22
•
Expires: 2015-02-06
Abstract
Abstract A thermally enhanced chip carrier package with a built-in heat sink for semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP with a center opening and a metal attachment ring for attaching a heat sink to either the top or bottom thereof with solder. A casing is further formed on the substrate outwardly of the aperture and the heat sink mounted thereacross, the casing being comprised of the suitable thermoplastic and being chemically fused to a portion of the circuit substrate to create a moisture seal therebetween. An encapsulant for filling the cavity within the casing and a lid may also be utilized to further secure and seal the chip mounted to the heat sink secured therein.
Inventors
- 👤 John R. McMillan
- 👤 William H. Maslakow
- 👤 Abram M. Castro
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 22:04
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/10; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W76/17; H10W76/18; H10W76/40; H10W76/42; H10W76/47; H10W90/00; H10W90/701; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W74/00; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 33
Claim 1
Independent Claim
161 words
A thermally enhanced chip carrier package for housing at least one integrated circuit chip, said package comprising: a circuit substrate having a central aperture formed therein; a heat sink adapted for mounting said at least one integrated circuit chip thereto; means for securing said heat sink to one side of said circuit substrate across said central aperture, said means comprising: a metallic ring formed on said circuit substrate around said central aperture adapted for the securement of said heat sink thereto, and solder placed upon said metallic ring for securing said heat sink thereto; said circuit substrate comprising a suitable thermoplastic material with a plurality of metal lead traces formed on at least one side thereof; and a casing comprised of said suitable thermoplastic material and covering a portion of said circuit substrate so that a cavity is formed around and through said central aperture, said casing being chemically fused to a portion of said circuit substrate around said central aperture.
Claim 2
Dependent Claim
161 words
A thermally enhanced chip carrier package for housing at least one integrated circuit chip, said package comprising: a circuit substrate having a central aperture formed therein; a heat sink adapted for mounting said at least one integrated circuit chip thereto; means for securing said heat sink to one side of said circuit substrate across said central aperture, said means comprising: a metallic ring formed on said circuit substrate around said central aperture adapted for the securement of said heat sink thereto, and solder placed upon said metallic ring for securing said heat sink thereto; said circuit substrate comprising a suitable thermoplastic material with a plurality of metal lead traces formed on at least one side thereof; and a casing comprised of said suitable thermoplastic material and covering a portion of said circuit substrate so that a cavity is formed around and through said central aperture, said casing being chemically fused to a portion of said circuit substrate around said central aperture.
Claim 3
Dependent Claim
29 words
The package of claim 1 wherein a chip mounting region is formed on said heat sink in a portion thereof defined by said central aperture of said circuit substrate.
Claim 4
Dependent Claim
13 words
The package of claim 1 wherein said suitable thermoplastic material comprises polyphenylene sulfide.
Claim 5
Dependent Claim
14 words
The package of claim 1 wherein said suitable thermoplastic material comprises liquid crystal polymer.
Claim 6
Dependent Claim
19 words
The package of claim 1 and further including a lid adapted for placement over and securement to said casing.
Claim 7
Dependent Claim
22 words
The package of claim 5 wherein said lid is formed of said suitable thermoplastic material and is chemically fused to said casing.
Claim 8
Dependent Claim
21 words
The package of claim 5 wherein said lid is formed of metal and is secured to said casing by an adhesive.
Claim 9
Dependent Claim
86 words
The package of claim 1 wherein said plurality of metal lead traces are found on a top side of said circuit substrate, said heat sink is secured to a bottom side of said circuit substrate and said circuit substrate further includes a plurality of metal electrical contact points formed on one side thereof outwardly of said metallic ring and further including means for connecting said plurality of metal lead traces on said top side to said plurality of metal electrical contact points of said circuit substrate.
Claim 10
Dependent Claim
58 words
The package of claim 1 wherein said plurality of metal lead traces are formed on a bottom side of said circuit substrate, said heat sink is secured to a top side of said circuit substrate and said circuit substrate further includes a plurality of metal electrical contact points formed on said circuit substrate outwardly of said central aperture.
Claim 11
Dependent Claim
25 words
The package of claim 1 and further including a liquid encapsulant disposed within said casing for protection of a chip mounted to said heat sink.
Claim 12
Dependent Claim
12 words
The package of claim 10 wherein said liquid encapsulant is an epoxy.
Claim 13
Dependent Claim
19 words
The package of claim 10 and further including a lid adapted for placement over and securement to said casing.
Claim 14
Dependent Claim
17 words
The package of claim 12 wherein said lid is secured to said casing with said liquid encapsulant.
Claim 15
Dependent Claim
16 words
The package of claim 12 wherein said lid is secured to said casing with an adhesive.
Claim 16
Dependent Claim
12 words
The package of claim 12 wherein said lid is formed of metal.
Claim 17
Dependent Claim
22 words
The package of claim 12 wherein said lid is formed of said suitable thermoplastic material and is chemically fused to said casing.
Claim 18
Dependent Claim
25 words
The package of claim 8 or 9 and further including solder balls attached to said plurality of metal electrical contact points of said circuit substrate.
Claim 19
Dependent Claim
24 words
The package of claim 1 wherein said metallic ring is solder coated to facilitate bonding to said heat sink by the application of heat.
Claim 20
Dependent Claim
191 words
A thermally enhanced chip carrier package for housing at least one integrated circuit chip, said package comprising: a circuit substrate formed with a suitable thermoplastic and including a center aperture formed therein, a plurality of lead traces disposed on one side of said circuit substrate outwardly of said center aperture, and a plurality of electrical contact points, disposed on said circuit substrate in electrical connection with said plurality of lead traces; a heat sink disposed across said center aperture and adapted for mounting said at least one integrated circuit chip thereto; a metal ring formed on said circuit substrate outwardly of said center aperture; solder placed upon said metal ring for securing said heat sink thereto; a casing, which is comprised of said suitable thermoplastic, said casing covering a portion of one side of said circuit substrate outwardly of said center aperture so that a cavity is formed outwardly of and through said center aperture, said casing being chemically fused to said portion of said circuit substrate outwardly of said center aperture; and means for securing at least one integrated circuit chip to said heat sink for positioning within said cavity.
Claim 21
Dependent Claim
191 words
A thermally enhanced chip carrier package for housing at least one integrated circuit chip, said package comprising: a circuit substrate formed with a suitable thermoplastic and including a center aperture formed therein, a plurality of lead traces disposed on one side of said circuit substrate outwardly of said center aperture, and a plurality of electrical contact points, disposed on said circuit substrate in electrical connection with said plurality of lead traces; a heat sink disposed across said center aperture and adapted for mounting said at least one integrated circuit chip thereto; a metal ring formed on said circuit substrate outwardly of said center aperture; solder placed upon said metal ring for securing said heat sink thereto; a casing, which is comprised of said suitable thermoplastic, said casing covering a portion of one side of said circuit substrate outwardly of said center aperture so that a cavity is formed outwardly of and through said center aperture, said casing being chemically fused to said portion of said circuit substrate outwardly of said center aperture; and means for securing at least one integrated circuit chip to said heat sink for positioning within said cavity.
Claim 22
Dependent Claim
61 words
The package as set forth in claim 19 wherein said plurality of lead traces are disposed on a bottom side of said circuit substrate, said plurality of electrical contact points are disposed on one side of said circuit substrate, and said metal ring is formed on a top side of said circuit substrate for the securement of said heat sink thereon.
Claim 23
Dependent Claim
80 words
The package as set forth in claim 20 wherein said plurality of lead traces are disposed on a top side of said circuit substrate, said plurality of electrical contact points are disposed on one side of said circuit substrate, said metal ring is formed on said bottom side of said circuit substrate for the securement of said heat sink thereto, and said package further includes means for connecting said plurality of lead traces to said plurality of electrical contact points.
Claim 24
Dependent Claim
18 words
The package of claim 21 wherein said connecting means comprises a plated-through hole formed in said circuit substrate.
Claim 25
Dependent Claim
19 words
The package of claim 19 and further including a lid adapted for placement over and securement to said casing.
Claim 26
Dependent Claim
14 words
The package of claim 23 wherein said lid is formed of said suitable thermoplastic.
Claim 27
Dependent Claim
21 words
The package of claim 23 wherein said lid is formed of metal and is secured to said casing by an adhesive.
Claim 28
Dependent Claim
15 words
The package of claim 19 and further including a liquid encapsulant disposed within said casing.
Claim 29
Dependent Claim
12 words
The package of claim 26 wherein said liquid encapsulant is an epoxy.
Claim 30
Dependent Claim
22 words
The package of claim 26 and further including a lid adapted for placement over said liquid encapsulant and securement to said casing.
Claim 31
Dependent Claim
17 words
The package of claim 28 wherein said lid is secured to said casing with said liquid encapsulant.
Claim 32
Dependent Claim
16 words
The package of claim 28 wherein said lid is secured to said casing with an adhesive.
Claim 33
Dependent Claim
22 words
The package of claim 19 wherein said suitable thermoplastic is chosen from the material group including liquid crystal polymer and polyphenylene sulfide.
References Cited (Backward Citations)
US3644798A
Cited
US3790859A
Cited
USRE29325E
Cited
US3867759A
Cited
US4195193A
Cited
JPS57194556A
Cited
US4507907A
Cited
US4521801A
Cited
US4480262A
Cited
US4509096A
Cited
US4630172A
Cited
JPS59188948A
Cited
US4965660A
Cited
JPS60127747A
Cited
JPS60198818A
Cited
JPS61114563A
Cited
US4823234A
Cited
JPS6281735A
Cited
US4700276A
Cited
US4890152A
Cited
US4887149A
Cited
US4910583A
Cited
US4878108A
Cited
US4843695A
Cited
US4876588A
Cited
US5152057A
Cited
US4894709A
Cited
US4868349A
Cited
JPH027545A
Cited
US4940181A
Cited
US5027191A
Cited
US5006673A
Cited
US4978638A
Cited
JPH03261165A
Cited
US5345106A
Cited
JPH04142068A
Cited
US5194695A
Cited
US5293301A
Cited
US5241133A
Cited
US5254500A
Cited
US5155579A
Cited
US5357673A
Cited
US5328870A
Cited
US5378869A
Cited
US5278446A
Cited
JPH06148950A
Cited
US5371404A
Cited
US5355283A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-07-21 | 2001-01-20 | 2001-07-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-07-21 | 2005-01-20 | 2005-07-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-07-21 | 2009-01-20 | 2009-07-22 | $7700.00 | Window Closed / Lapsed |