US4894709A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Forced-convection, liquid-cooled, microchannel heat sinks
Assignee: Massachusetts Institute of Technology
•
Filing: 1988-03-09
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Granted: 1990-01-16
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Expires: 2008-03-09
Abstract
Abstract A microchannel heat sink used to cool a high power electronic device such as an integrated circuit comprising a plurality of channels in close thermal contact to the integrated circuit and through which a liquid is passed to create either a developing laminar flow or a turbulent flow. The turbulent flow may be either developing or fully developed. The heat sink features a compensation heater surrounding the integrated circuit and heated at the same rate as the integrated circuit to thereby provide a more uniform temperature at the perimeter of the integrated circuit.
Inventors
- 👤 Richard J. Phillips
- 👤 Leon R. Glicksman
- 👤 Ralph Larson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 21:00
CPC Classifications
F; F28; F28F; F28F3/00; F28F3/12; H; H10; H10W; H10W40/00; H10W40/40; H10W40/47; F28F2260/00; F28F2260/02
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
104 words
A method of using a microchannel heat sink to cool a high power device such as an integrated circuit, said method comprising the steps of: forcing a fluid into an input port of said microchannel heat sink; passing said fluid through a plurality of channels in said microchannel heat sink to create a turbulent flow through said channels, said channels having a width between 125 and 300 micrometers, and being in thermal contact with said high power device to thereby transfer heat from said high power device to said fluid; and discharging said fluid from said microchannel heat sink to thereby dissipate said heat.
Claim 2
Independent Claim
104 words
A method of using a microchannel heat sink to cool a high power device such as an integrated circuit, said method comprising the steps of: forcing a fluid into an input port of said microchannel heat sink; passing said fluid through a plurality of channels in said microchannel heat sink to create a turbulent flow through said channels, said channels having a width between 125 and 300 micrometers, and being in thermal contact with said high power device to thereby transfer heat from said high power device to said fluid; and discharging said fluid from said microchannel heat sink to thereby dissipate said heat.
Claim 3
Dependent Claim
12 words
The method of claim 1 wherein said turbulent flow is fully developed.
Claim 4
Dependent Claim
11 words
The method of claim 1 wherein said turbulent flow is developing.
Claim 5
Dependent Claim
10 words
The method of claim 1 wherein said liquid is water.
Claim 6
Dependent Claim
14 words
The method of claim 1 wherein said heat sink is formed from indium phosphide.
Claim 7
Independent Claim
105 words
A method of using a microchannel heat sink to cool a high power device such as an integrated circuit, said method comprising the steps of: forcing a fluid into an input port of said microchannel heat sink; passing said fluid through a plurality of channels in said microchannel heat sink to create a developing laminar flow through said channels, said channels having a width between 125 and 300 micrometers, and being in thermal contact with said high power device to thereby transfer heat from said high power device to said fluid; and discharging said fluid from said microchannel heat sink to thereby dissipate said heat.
Claim 8
Independent Claim
105 words
A method of using a microchannel heat sink to cool a high power device such as an integrated circuit, said method comprising the steps of: forcing a fluid into an input port of said microchannel heat sink; passing said fluid through a plurality of channels in said microchannel heat sink to create a developing laminar flow through said channels, said channels having a width between 125 and 300 micrometers, and being in thermal contact with said high power device to thereby transfer heat from said high power device to said fluid; and discharging said fluid from said microchannel heat sink to thereby dissipate said heat.
Claim 9
Dependent Claim
10 words
The method of claim 6 wherein said liquid is water.
Claim 10
Dependent Claim
14 words
The method of claim 6 wherein said heat sink is formed from indium phosphide.
Claim 11
Dependent Claim
12 words
The method of claim 1 wherein said channels are substantially parallel channels.
Claim 12
Dependent Claim
12 words
The method of claim 6 wherein said channels are substantially parallel channels.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-01-15 | 1993-07-17 | 1994-01-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-01-15 | 1997-07-17 | 1998-01-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-01-15 | 2001-07-17 | 2002-01-16 | $7700.00 | Window Closed / Lapsed |