Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels

Claim 2

A heat generating device having improved heat removal capability comprising: a body portion having an external surface for cooling; a plurality of microscopic channels defined by fins in intimate contact with said external surface, the width of said channels being defined by ##EQU2## where μ=viscosity of coolant in poise (g cm -1 s -1 ) k l =thermal conductivity of coolant (W cm -1 K -1 ) ρC=volumetric heat capacity of coolant (J K -1 cm -3 ) P=driving pressure for forced convection (dynes cm -2 ) L=length of circuit substrate in direction of flow (cm) W c =width of channels (cm) Nu=Nusselt number; a coolant input chamber and a coolant output chamber, said chambers being connected by said channels; and a cover attached to said fins and to said chambers, to confine the flow of a coolant fluid through said channels.

Claim 3

A heat generating device as defined by claim 1 and further including means for flowing a coolant fluid through said channels.

Claim 4

A heat generating device as defined by claim 1 or 2 wherein the channel width and the fin width are approximately equal.

Claim 5

A heat generating device as defined by claim 1 or 2 wherein said channels have a depth that is greater than channel width to thereby increase the fin area in contact with a coolant.

Claim 6

A heat generating device as defined by claim 4 wherein said fins have a height to period ratio defined by [k.sub.fin /(2k.sub.l Nu)].sup.1/2 where k fin =thermal conductivity of said fin material k l =thermal conductivity of said coolant Nu=Nusselt number.

Claim 7

A semiconductor integrated circuit having improved heat removal capability comprising: a semiconductor body having an integrated circuit defined in a first major surface; a plurality of microscopic channels defined by fins in intimate contact with a second major surface opposite from said first surface, the width of channels being defined by ##EQU3## where μ=viscosity of coolant in poise (g cm -1 s - ) k l =thermal conductivity of liquid (W cm -1 K -1 ) ρC=volumetric heat capacity of liquid (J K -1 cm -3 ) P=driving pressure for forced convection (dynes cm -2 ) L=Length of circuit substrate in direction of flow (cm) W C =width of channels (cm) Nu=Nusselt number; a coolant input chamber and a coolant output chamber, said chambers being connected by said channels; a cover attached to said fins and to said chambers to confine the flow of coolant fluid through said channels; and means for uniformly distributing coolant fluid through said channels.

Claim 8

A semiconductor integrated circuit having improved heat removal capability comprising: a semiconductor body having an integrated circuit defined in a first major surface; a plurality of microscopic channels defined by fins in intimate contact with a second major surface opposite from said first surface, the width of channels being defined by ##EQU3## where μ=viscosity of coolant in poise (g cm -1 s - ) k l =thermal conductivity of liquid (W cm -1 K -1 ) ρC=volumetric heat capacity of liquid (J K -1 cm -3 ) P=driving pressure for forced convection (dynes cm -2 ) L=Length of circuit substrate in direction of flow (cm) W C =width of channels (cm) Nu=Nusselt number; a coolant input chamber and a coolant output chamber, said chambers being connected by said channels; a cover attached to said fins and to said chambers to confine the flow of coolant fluid through said channels; and means for uniformly distributing coolant fluid through said channels.

Claim 9

A semiconductor integrated circuit as defined by claim 6 wherein said microscopic fins and said chambers are formed in a recessed region of said second major surface, said cover engaging said major surface and defining a coolant chamber in said recessed region.

Claim 10

A semiconductor integrated circuit as defined by claim 6 and further including a second thermally conducting chip, said microscopic channels and said chambers being defined by fins in a major surface of said second chip, said major surface of said second chip and said fins being affixed in intimate thermal contact to said second major surface of said first chip.

Claim 11

A semiconductor integrated circuit as defined by claim 6, 7, or 8 wherein the channel width and the fin width are approximately equal.

Claim 12

A semiconductor integrated circuit as defined by claim 6, 7 or 8 wherein said channels have a depth that is greater than channel width to thereby increase the fin area in contact with a coolant.

Claim 13

A semiconductor integrated circuit array as defined by claim 10 wherein said fins have a height to period ratio defined by [k.sub.fin /(2k.sub.l Nu)].sup.1/2 where k fin =thermal conductivity of said fin material k l =thermal conductivity of said coolant Nu=Nusselt number.

Claim 14

A semiconductor integrated circuit as defined by claim 6, 7, or 8 wherein said fins comprise continuous parallel rows of semiconductor material.

Claim 15

A semiconductor integrated circuit as defined by claim 6, 7, or 8 wherein said fins comprise parallel rows of semiconductor material with each row being discontinuous.

Claim 16

A semiconductor integrated circuit and package having improved heat removal capability comprising: a support member having a recessed portion in a major surface; a plurality of bonding pads within said recessed portion; and a plurality of conductive leads extending from said support member and in electrical contact with said bonding pads; a semiconductor integrated circuit chip having an integrated circuit defined in a first major surface and having a plurality of microscopic fins in integral contact with a second major surface opposite from said first major surface, said semiconductor integrated chip mounted in said recessed portion with said integrated circuit in electrical contact with said bonding pads; a first tube for applying a coolant fluid to one end of said recessed portion and a second tube for removing coolant from a second end of said recessed portion opposite from said first end; and a cover affixed to said fins and defining microscopic channels whereby coolant fluid flows from said first tube through said channels and then to said second tube, the width of said fins being defined by ##EQU4## where μ=viscosity of coolant in poise (g cm -1 s -1 ) k l =thermal conductivity of coolant (W cm -1 K -1 ) ρC=volumetric heat capacity of coolant (J K -1 cm -3 ) P=driving pressure for forced convection (dynes cm -2 ) L=length of circuit substrate in direction of flow (cm) W C =width of channels (cm) Nu=Nusselt number; and wherein said fins have a height to period ratio defined by [k.sub.fin /(2k.sub.l Nu)].sup.1/2 where k fin =thermal conductivity of said fin material k l =thermal conductivity of said coolant Nu=Nusselt number.

Claim 17

A semiconductor integrated circuit and package having improved heat removal capability comprising: a support member having a recessed portion in a major surface; a plurality of bonding pads within said recessed portion; and a plurality of conductive leads extending from said support member and in electrical contact with said bonding pads; a semiconductor integrated circuit chip having an integrated circuit defined in a first major surface and having a plurality of microscopic fins in integral contact with a second major surface opposite from said first major surface, said semiconductor integrated chip mounted in said recessed portion with said integrated circuit in electrical contact with said bonding pads; a first tube for applying a coolant fluid to one end of said recessed portion and a second tube for removing coolant from a second end of said recessed portion opposite from said first end; and a cover affixed to said fins and defining microscopic channels whereby coolant fluid flows from said first tube through said channels and then to said second tube, the width of said fins being defined by ##EQU4## where μ=viscosity of coolant in poise (g cm -1 s -1 ) k l =thermal conductivity of coolant (W cm -1 K -1 ) ρC=volumetric heat capacity of coolant (J K -1 cm -3 ) P=driving pressure for forced convection (dynes cm -2 ) L=length of circuit substrate in direction of flow (cm) W C =width of channels (cm) Nu=Nusselt number; and wherein said fins have a height to period ratio defined by [k.sub.fin /(2k.sub.l Nu)].sup.1/2 where k fin =thermal conductivity of said fin material k l =thermal conductivity of said coolant Nu=Nusselt number.

Claim 18

A semiconductor integrated circuit and package as defined by claim 14 wherein said cover engages said package and encloses said recessed portion.

Claim 19

A semiconductor integrated circuit and package as defined by claim 14 or 15 wherein said first tube and said second tube comprise electrically conductive material and function as power busses to said integrated circuit.

Claim 20

A semiconductor integrated circuit and package as defined by claim 14 or 15 wherein said tubes are integral with said support member.