US3867759A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing a multi-layered strip transmission line printed circuit board integrated package
Assignee: United States Department of the Air Force
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Filing: 1973-06-13
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Granted: 1975-02-25
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Expires: 1993-06-13
Abstract
Abstract The method of manufacturing the integrated package includes, but is not limited to, the steps of: fabricating a plurality of identical strip transmission line printed circuit board segments, which are to be used to form a plurality, preferably two, of printed circuit boards, with each board to be a layer in and of the multi-layered integrated package; joining the segments, which collectively constitute and define each circuit board layer, in coplanar relationship, to form the respective circuit boards, drilling, and plating with an electrically conductive material, a plurality of signal path holes in and through each segment of each circuit board (i.e., each layer); inserting one end of a different two-ended electrically conductive wire into each plated signal path hole in the first circuit board layer, and soldering that end in place to its respective plated signal path hole, thereby providing electrical contact by and between each wire and its respective plated hole in the first layer; inserting the other end of each wire in a different plated signal path hole in the second circuit board layer, and soldering that end in place to its respective plated signal path hole, thereby providing electrical contact by and between each end of each wire and the two plated signal path holes to which each wire is soldered, and also thereby providing electrical conductivity between, and from and to, the first and the second layers of printed circuit boards; and, bonding the second layer to the first layer in stacked relationship. By cascading the interconnection (i.e., adding a third layer to the two-layered package, and electrically interconnecting the third layer to the second layer), an integrated package of as many layers as desired or as needed may be formed, without having to penetrate more than any two adjacent layers of circuit boards at any one time. The method may be significantly varied, by performing additional steps to drill, plate and align one or more grounded holes in the circuit board layers, to improve the electrical performance of the transition.
Inventors
- 👤 Robert G Siefker
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 22:34
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/142; H05K1/0213; H05K1/0237; H05K3/00; H05K3/46; H05K3/4611; H05K3/4623; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09536; H05K2201/096; H05K2201/09818; H05K2201/09963; H05K2201/10; H05K2201/10227; H05K2201/10295; H05K2201/10303; H05K2203/00; H05K2203/06; H05K2203/061; H05K3/40; H05K3/42; H05K3/429; H05K3/4614; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
574 words
A method of manufacturing a multi-layered strip transmission line printed circuit board integrated package, as adapted for use as a strip transmission line manifold assembly, wherein at least a first strip transmission line printed circuit board and a second strip transmission line printed circuit board are to be fixedly joined and positioned in stacked relationship and in electrical interconnection, to form the multi-layered integrated package, comprising the steps of: a. fabricating a first plurality of segments which collectively constitute and define the first strip transmission line printed circuit board; b. joining the first plurality of segments in coplaner relationship, whereby the first strip transmission line printed circuit board is formed, and whereby the first layer of the multi-layered integrated package also is formed; c. fabricating a second plurality of segments which collectively constitute and define the second strip transmission line printed circuit board; d. joining the second plurality of segments in coplaner relationship, whereby the second strip transmission line printed circuit board is formed, and whereby the second layer of the multi-layered integrated package is also formed; e. drilling a first plurality of signal path holes in and through each of the first plurality of segments which form the first strip transmission line printed circuit board; f. drilling a second plurality of signal path holes in and through each of the second plurality of segments which form the second strip transmission line printed circuit board; g. plating, with an electrically conductive material, each signal path hole drilled through each of the first plurality of segments which form the first strip transmission line printed circuit board; h. plating, with an electrically conductive material, each signal path hole drilled through each of the second plurality of segments which form the second strip transmission line printed circuit board; i. inserting a different electrically conductive stranded wire having a first end and a second end into each plated signal path hole in each of the first plurality of segments which form the first strip transmission line printed circuit board, with each said electrically conductive stranded wire inserted into its particular and individual signal path hole in first-endfirst position; j. soldering, in place, said first end of each of said different electrically conductive stranded wires, thereby providing electrical contact by and between each first end of each of said conductive wires and the plated hole in which said first end is located; k. feeding the second end of each different electrically conductive wire into a different one of the plated signal path holes in each of the second plurality of segments which form the second strip transmission line printed circuit board; l. soldering, in pLace, said second end of each of said different electrically conductive stranded wires, thereby providing electrical contact by and between each second end of each of said conductive wires and the plates hole in the second printed circuit board in which said second end is located, and also thereby providing electrical conductivity between said first and said second strip transmission line printed circuit boards; m. and, bonding said second strip transmission line printed circuit board to said first strip transmission line printed circuit board in stacked relationship; whereby the desired multi-layered strip transmission line printed circuit board integrated package is formed; and, whereby by cascading the interconnection, an integrated package of as many layers as desired may be formed without having to penetrate more than two adjacent layers of circuit boards at any one time.
Claim 2
Independent Claim
574 words
A method of manufacturing a multi-layered strip transmission line printed circuit board integrated package, as adapted for use as a strip transmission line manifold assembly, wherein at least a first strip transmission line printed circuit board and a second strip transmission line printed circuit board are to be fixedly joined and positioned in stacked relationship and in electrical interconnection, to form the multi-layered integrated package, comprising the steps of: a. fabricating a first plurality of segments which collectively constitute and define the first strip transmission line printed circuit board; b. joining the first plurality of segments in coplaner relationship, whereby the first strip transmission line printed circuit board is formed, and whereby the first layer of the multi-layered integrated package also is formed; c. fabricating a second plurality of segments which collectively constitute and define the second strip transmission line printed circuit board; d. joining the second plurality of segments in coplaner relationship, whereby the second strip transmission line printed circuit board is formed, and whereby the second layer of the multi-layered integrated package is also formed; e. drilling a first plurality of signal path holes in and through each of the first plurality of segments which form the first strip transmission line printed circuit board; f. drilling a second plurality of signal path holes in and through each of the second plurality of segments which form the second strip transmission line printed circuit board; g. plating, with an electrically conductive material, each signal path hole drilled through each of the first plurality of segments which form the first strip transmission line printed circuit board; h. plating, with an electrically conductive material, each signal path hole drilled through each of the second plurality of segments which form the second strip transmission line printed circuit board; i. inserting a different electrically conductive stranded wire having a first end and a second end into each plated signal path hole in each of the first plurality of segments which form the first strip transmission line printed circuit board, with each said electrically conductive stranded wire inserted into its particular and individual signal path hole in first-endfirst position; j. soldering, in place, said first end of each of said different electrically conductive stranded wires, thereby providing electrical contact by and between each first end of each of said conductive wires and the plated hole in which said first end is located; k. feeding the second end of each different electrically conductive wire into a different one of the plated signal path holes in each of the second plurality of segments which form the second strip transmission line printed circuit board; l. soldering, in pLace, said second end of each of said different electrically conductive stranded wires, thereby providing electrical contact by and between each second end of each of said conductive wires and the plates hole in the second printed circuit board in which said second end is located, and also thereby providing electrical conductivity between said first and said second strip transmission line printed circuit boards; m. and, bonding said second strip transmission line printed circuit board to said first strip transmission line printed circuit board in stacked relationship; whereby the desired multi-layered strip transmission line printed circuit board integrated package is formed; and, whereby by cascading the interconnection, an integrated package of as many layers as desired may be formed without having to penetrate more than two adjacent layers of circuit boards at any one time.
Claim 3
Dependent Claim
160 words
The method, as set forth in claim 1, wherein said method comprises the additional steps of: a. drilling a first plurality of ground path holes in and through each of the first plurality of segments which form the first strip transmission line printed circuit board, wherein said ground path holes parallel the signal path holes; b. drilling a second plurality of corresponding ground path holes in and through each of the second plurality of segments which form the second strip transmission line printed circuit board, wherein said ground path holes also parallel the signal path holes; c. plating, with electrically conductive material, each ground path hole drilled through each of the first plurality of segments which form the first strip transmission line printed circuit board; d. and, plating, with electrically conductive material, each corresponding ground path hole drilled through each of the second plurality of segments which form the second strip transmission line printed circuit board; thereby forming ground lines.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-02-24 | 1978-08-26 | 1979-02-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-02-24 | 1982-08-26 | 1983-02-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-02-24 | 1986-08-26 | 1987-02-25 | $7700.00 | Window Closed / Lapsed |