Universal multilayer printed circuit board

Claim 1

As a new article of manufacture, a prefabricated multilayer printed circuit board comprising: a plurality of insulative laminae, each of said laminae having first and second planar surfaces, at least one of said first and second surfaces of each of said laminae having a printed circuit area thereon, said at least one surface including a preestablished pattern of conductive material including a plurality of enlarged similarly shaped points of connection of such material for establishing electrical communications with components mounted on said board; said at least one surface being free of any conductive material in all areas outside said pattern, said laminae being physically laminated in mutually overlying relation to sandwich said patterns within the board and place said printed circuit areas in congruent relation in which at least some of said points of connection on each printed circuit being disposed along common axes perpendicular to the principal planes of said laminae, an outermost laminae of said board having an exposed surface, said exposed surface being covered with an etchable conductive material over substantially the entire area thereof and insulated from said patterns; at least one of said preestablished patterns having points of connection which are interconnected by lines of conductive materials extending principally in a first direction parallel to one edge of said laminae, another one of said laminae having a second pattern having points of connection which are interconnected by lines of conductive material extending principally in a direction at right angles relative to said first direction, a substantial number of the points of each of said preestablished pattern being aligned with the lines of interconnection connecting a substantial number of said points of connection, said interconnected points of connection of said first and second patterns overlying each other whereby a hole drilled through the laminae containing said patterns at one of the points of connection will connect several points of the first pattern with several points of the second pattern, and further wherein the first and second patterns contain a comparatively large number of said points and interconnecting lines with respect to the size of the board, permitting the circuit board to be adapted to a great variety of circuits and repair of a broken line of interconnection by changing a component to new points of connection on the broken line said printed circuit board further characterized in the provision of an additional predetermined pattern comprised substantially of a conductive area extending over the entire surface thereof and having a plurality of openings defining small areas of nonconductivity, at least some of which are congruent with respect to points of interconnection in said first and second prEdetermined patterns.